Advanced Packaging
Symposium Sessions | ||
Tuesday June 14 | ||
| 1:30 | Advanced Packaging & Interfaces for MEMS & NEMS | |
| 4:00 | Italian Trade Commission Reception - Nanotech booth 1607, Cleantech booth 707 | |
| 4:00 | Innovation Showcase & Poster Session - Reception (4:00 - 6:00) | |
Wednesday June 15 | ||
| 4:00 | Piemonte Agency For Investments, Export And Tourism Reception - Nanotech booth 1607, Cleantech booth 707 | |
| 4:00 | Innovation Showcase & Poster Session - Reception (4:00 - 6:00) | |
Symposium Program | ||
Tuesday June 14 | ||
| Back to Top | ||
| 1:30 | Advanced Packaging & Interfaces for MEMS & NEMS | Room 111 |
| Session chair: Cy Wilson, NASA, US | ||
| 1:30 | Design, Fabrication and Characterization of Inverse Adiabatic Fiber-To-Chip Couplers M. Araghchini, A. Khilo, C.W. Holzwarth, M.S. Dahlem, H.I. Smith, E.P. Ippen, F.X. Kärtner, Massachusetts Institute of Technology, US | |
| 1:50 | Investigation of Lead-free Nanosolder Reflow and Wettability Property for Electronics/Nanoelectronics Assembly and Packaging F. Gao, Z. Gu, S. Shina, G. Morose, P. Eliason, R. Farrell, University of Massachusetts Lowell, US | |
| 2:10 | Effects of Ag and Pd Addition on Mechanical Property and Ion-migration Tolerance in Low Temperature Sintering Bonding Using Ag2O Paste A. Hirose, T. Itou, T. Ogura, Osaka University, JP | |
| 2:30 | Lead Frame Package of MEMS Devices using Wafer-level, Air-gap Structures N. Fritz, R. Saha, S.A. Bidstrup Allen, P.A. Kohl, Georgia Institute of Technology, US | |
| 2:50 | Novel Nanofiber Anisotropic Conductive Films (ACFs) with coupled conductive particles for Ultra Fine Pitch Electronic Packaging Applications K-L Suk, K.W. Paik, KAIST, KR | |
| 3:10 | Compliant interconnect technology for power modules in automotive applications P. Nenzi, University of Rome la Sapienza, IT | |
| Back to Top | ||
| 4:00 | Italian Trade Commission Reception - Nanotech booth 1607, Cleantech booth 707 | Expo Hall |
| Back to Top | ||
| 4:00 | Innovation Showcase & Poster Session - Reception (4:00 - 6:00) | Expo Hall |
Wednesday June 15 | ||
| Back to Top | ||
| 4:00 | Piemonte Agency For Investments, Export And Tourism Reception - Nanotech booth 1607, Cleantech booth 707 | Expo Hall |
| Back to Top | ||
| 4:00 | Innovation Showcase & Poster Session - Reception (4:00 - 6:00) | Expo Hall |
Special Symposium
Advanced packaging needs are driving an incredible convergence across a host of industries. IC is looking to MEMS for guidance, LED is looking to IC and PV is looking at all three… The sessions under this symposium will focus on developments specifically related to 3D integration and packaging. As designers sort out the path forward, the application will be the ultimate arbiter for solutions and as such these sessions seek to highlight shared opportunities and differentiate unique challenges at the application level.
Topics & Application Areas
- Novel Materials for Advanced Packaging
- Interconnect Technologies
- 3D Packages (System in Package)
- 3D Integrated Circuits (3D IC)
- Through-Silicon Vias (TSV)
- System-on-a-Chip (SoC)
- Wafer-Level Packaging (WLP)
- Flexible Electronics & Printing Technologies
- Other
Journal Submissions
Microelectronics Journal
Published since 1969, Microelectronics Journal is an international forum for the dissemination of research into, and applications of, microelectronics. Papers published in Microelectronics Journal have undergone peer review to ensure originality, relevance and timeliness. The journal thus provides a worldwide, regular and comprehensive update on microelectronics.
For consideration into the Microelectronics Journal please select the “Submit to Microelectronics Journal” button during the on-line submission procedure.
On-line Journal ‘Sensors & Transducers’
Selected proceedings papers in the Electronics and Microsystems Track (MEMS & NEMS, Sensors & Systems, Micro & Nano Fluidics symposia, and MSM conference) will be reviewed and invited into a Special Issue of the on-line journal ‘Sensors & Transducers’.
For consideration into this Special Issue of the on-line journal ‘Sensors & Transducers’, please select the “Submit to Sensors & Transducers” button during the on-line submission procedure.
