MEMS & NEMS Fabrication, Devices & Applications
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Symposium Sessions | ||
Tuesday June 14 | ||
| 8:30 | Opening TechConnect World Keynotes - Innovation Impact - Nanotech, Cleantech, Microtech, Biotech 2011 | |
| 10:30 | Microtech for Quality of Life and Medical Applications - MIG Special Symposia | |
| 10:30 | Inkjet Design, Materials & Fabrication 1 | |
| 1:30 | Inkjet Design, Materials & Fabrication 2 | |
| 1:30 | Microtech for Quality of Life and Medical Applications - MIG Special Symposia | |
| 2:30 | MEMS in QoL Medical Devices and why the world is ready for Silicon-implantable Devices - MIG Special Symposia | |
| 1:30 | Advanced Packaging & Interfaces for MEMS & NEMS | |
| 3:10 | TechConnect IP Partnering: Sensors & Microsystems | |
| 4:00 | Italian Trade Commission Reception - Nanotech booth 1607, Cleantech booth 707 | |
| 4:15 | MEMS Networking Reception - Sponsored by NSTI & MEMS Industry Group | |
| 4:00 | Innovation Showcase & Poster Session - Reception (4:00 - 6:00) | |
| MEMS & NEMS Fabrication, Devices & Applications | ||
Wednesday June 15 | ||
| 8:30 | Novel MEMS & NEMS Devices: Design & Fabrication | |
| 10:30 | Biofluidic Devices | |
| 1:30 | Integrated NEMS & MEMS Sensors: Application & Fabrication | |
| 1:30 | TechConnect IP Partnering: Biotech & Medical | |
| 3:00 | TechConnect IP Partnering: Pharmaceuticals | |
| 3:00 | TechConnect IP Partnering: Semiconductors, Sensors & Microsystems | |
| 1:30 | US-China Nanotech Connect | |
| 3:30 | US-China Nanotech Connect - Networking Reception - Booth 930 Expo Hall C (3:30 - 4:00) | |
| 4:00 | Piemonte Agency For Investments, Export And Tourism Reception - Nanotech booth 1607, Cleantech booth 707 | |
| 4:00 | Innovation Showcase & Poster Session - Reception (4:00 - 6:00) | |
| MEMS & NEMS Fabrication, Devices & Applications | ||
Thursday June 16 | ||
| 8:30 | MEMS-Based Systems Solutions and Integration Approaches | |
| 10:30 | Device Design and Simulation 1 | |
| 10:30 | Nano and Micro Technologies for Oil & Gas | |
| 10:30 | MEMS-Based Systems Solutions and Integration Approaches | |
| 10:30 | TechConnect Corporate Partnering: Venture Partnering | |
| 1:00 | TechConnect Ventures: Biotech & Medical | |
| 1:30 | Micro & Nano Reliability | |
| 1:30 | MEMS-Based Systems Solutions and Integration Approaches | |
| 2:30 | TechConnect Ventures: Semiconductors, Sensors & Microsystems | |
| 3:00 | MEMS-Based Systems Solutions and Integration Approaches | |
| 4:30 | Technical and Business Collaboration Opportunities: MEMS-Based Systems Solutions and Integration Approaches | |
| 5:00 | TechConnect Closing Networking, Partnering & Investment Reception (3rd Floor, Boylston Hallway) | |
Symposium Program | ||
Tuesday June 14 | ||
| Back to Top | ||
| 8:30 | Opening TechConnect World Keynotes - Innovation Impact - Nanotech, Cleantech, Microtech, Biotech 2011 | Ball Room A |
| Session chair: Matthew Laudon, NSTI/CTSI, US | ||
| 8:30 | Welcome and Opening M. Laudon, TechConnect World Co-Chair, US | |
| 8:40 | Cross Sector Perspective on Nanotech to Cleantech Innovation T. Earles, Lockheed Martin & Former OSTP, US | |
| 9:10 | No Small Matter: Scaling the Business of Materials Science T. Taber, CTO, Eastman Kodak Company, US | |
| Back to Top | ||
| 10:30 | Microtech for Quality of Life and Medical Applications - MIG Special Symposia | Room 209 |
| Session chair: Karen Lightman, MEMS Industry Group, US | ||
| 10:30 | Introduction to Quality of Life and Medical Applications - MIG Special Symposia K. Lightman, MEMS Industry Group, US | |
| 10:45 | Medical Implant Devices, MEMS and Quality of Life: Lessons from Cardiovascular Devices: Stents, VADs and the Total Artificial Heart (invited presentation) M. Slepian, Syncardia Systems, US | |
| 11:15 | Quality of Life Through Intelligent Monitoring (invited presentation) M. DiPerri, Freescale Semiconductor Inc., US | |
| 11:35 | BioMEMS Technology for Artificial Organs (invited presentation) J. Borenstein, Charles Stark Draper Laboratory, US | |
| 11:55 | MEMS in Healthcare - The Only Limit Is Imagination (invited presentation) T. O'Dwyer, Analog Devices, US | |
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| 10:30 | Inkjet Design, Materials & Fabrication 1 | Room 204 |
| Session chair: Chris Menzel, Dimatix, US | ||
| 10:30 | Challenges of Modeling Inkjet Systems (invited presentation) E.P. Furlani, University of Buffalo, US | |
| 10:55 | Life And Death Of A Weakly Viscoelastic Jet (invited presentation) Fluid Mechanics And Rheometry V. Sharma, MIT, US | |
| 11:20 | New developments in inkjet of deposits carried out under localised extraction or helium V. Conedera, F. Mesnilgrente, P. Fadel, N. Fabre, LAAS-CNRS, FR | |
| 11:40 | Advancements in Ink-Jet Deposition of Carbon Nanotube Materials for Printed Electronics S. Turner, Brewer Science, US | |
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| 1:30 | Inkjet Design, Materials & Fabrication 2 | Room 204 |
| Session chair: Chris Menzel, Dimatix, US | ||
| 1:30 | Expanding Capabilities of a Machine Vision System for Analysis of Drops-in-flight Y. Kipman, P. Mehta, S-W. Wang, ImageXpert Inc., US | |
| 1:50 | Imbibition dynamics of nano-particulate ink-jet drops on micro-porous media W.-K. Hsiao, S.D. Hoath, G.D. Martin, I.M. Hutchings, S. Jones, N. Chilton, University of Cambridge, UK | |
| 2:10 | Advancement of Printed Electronics, Energetics, Materials, & Sensors (PEEMS) for Military Utilization J.L. Zunino III, G. Di Benedetto, D.P. Schmidt, R.E. Cornell, A.M. Petrock, B.E. Fuchs, U.S. Army ARDEC, US | |
| Back to Top | ||
| 1:30 | Microtech for Quality of Life and Medical Applications - MIG Special Symposia | Room 209 |
| Session chair: Karen Lightman, MEMS Industry Group, US | ||
| 1:30 | Modeling Objective Quality of Life using Smartphone Sensors (invited presentation) A. Madan, ginger.io, US | |
| 1:50 | Total Artificial Heart Utilizes MEMS Technology (invited presentation) D. Sandfox, Omron Electronic Components LLC, US | |
| 2:10 | Networking -, Break, US | |
| Back to Top | ||
| 2:30 | MEMS in QoL Medical Devices and why the world is ready for Silicon-implantable Devices - MIG Special Symposia | Room 209 |
| Session chair: Karen Lightman, MEMS Industry Group, US | ||
| - | Advanced MEMS/NEMS Processing for Improved Drug Delivery R. Goodall, Nano Medical Systems, Inc., US | |
| - | Convergence of MEMS, Microfluidics, and Semiconductor Processing in Life SciencesR. Brossart_Sr., SVTC Technologies, US | |
| - | S. Wilcenski, MEMSCAP, Inc., US | |
| - | J. Borenstein, Charles Stark Draper Laboratory, US | |
| 3:30 | MEMS in QoL Medical Devices - Closing Keynote B. Wirth, GE Sensing, US | |
| 4:00 | Conclusion and Wrap-up K. Lightman, MEMS Industry Group, US | |
| Back to Top | ||
| 1:30 | Advanced Packaging & Interfaces for MEMS & NEMS | Room 111 |
| Session chair: Cy Wilson, NASA, US | ||
| 1:30 | Design, Fabrication and Characterization of Inverse Adiabatic Fiber-To-Chip Couplers M. Araghchini, A. Khilo, C.W. Holzwarth, M.S. Dahlem, H.I. Smith, E.P. Ippen, F.X. Kärtner, Massachusetts Institute of Technology, US | |
| 1:50 | Investigation of Lead-free Nanosolder Reflow and Wettability Property for Electronics/Nanoelectronics Assembly and Packaging F. Gao, Z. Gu, S. Shina, G. Morose, P. Eliason, R. Farrell, University of Massachusetts Lowell, US | |
| 2:10 | Effects of Ag and Pd Addition on Mechanical Property and Ion-migration Tolerance in Low Temperature Sintering Bonding Using Ag2O Paste A. Hirose, T. Itou, T. Ogura, Osaka University, JP | |
| 2:30 | Lead Frame Package of MEMS Devices using Wafer-level, Air-gap Structures N. Fritz, R. Saha, S.A. Bidstrup Allen, P.A. Kohl, Georgia Institute of Technology, US | |
| 2:50 | Novel Nanofiber Anisotropic Conductive Films (ACFs) with coupled conductive particles for Ultra Fine Pitch Electronic Packaging Applications K-L Suk, K.W. Paik, KAIST, KR | |
| 3:10 | Compliant interconnect technology for power modules in automotive applications P. Nenzi, University of Rome la Sapienza, IT | |
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| 3:10 | TechConnect IP Partnering: Sensors & Microsystems | Room 303 |
| Session chair: Tom O’Donnell, Product Genesis | ||
| 3:10 | Computational Method for Improved Forewarning of Critical Events D. Sims, Oak Ridge National Laboratory, US | |
| 3:20 | LABRADOR(Lightweight Analyzer for Buried Remains And Decomposition Odor Recognition) R. Speck, Oak Ridge National Laboratory, US | |
| 3:30 | Light-directed, in situ synthesis of RNA microarrays M. Beaulieu, McGill University, CA | |
| 3:40 | Method Of Applying A Lubricant To A Micromechanical Device CW Su, National University of Singapore, SG | |
| 3:50 | Novel Measuring Technologies and Series of Universal Sensors and Transducers Interfaces (USTI) ICs on its basis S. Yurish, Technology Assistance BCNA 2010, S.L., ES | |
| 4:00 | A software to develop low cost and highly efficient self-adaptive grippers T. Martinuzzo, Univalor, CA | |
| Back to Top | ||
| 4:00 | Italian Trade Commission Reception - Nanotech booth 1607, Cleantech booth 707 | Expo Hall |
| Back to Top | ||
| 4:15 | MEMS Networking Reception - Sponsored by NSTI & MEMS Industry Group | Room 209 |
| Back to Top | ||
| 4:00 | Innovation Showcase & Poster Session - Reception (4:00 - 6:00) | Expo Hall |
| Back to Top | ||
| MEMS & NEMS Fabrication, Devices & Applications | Expo Hall | |
| - | Fracture-induced polymeric grating structures C.C. Lin, F. Yang, J.W. Chin, L. Sung, S. Lee, National Tsing Hua Univesity, TW | |
| - | Comparaison between PDMS and PMMA for MEMS applications H. Bourbaba, C. Benachaiba, M. Bouanini, University of Bechar, DZ | |
| - | High-aspect-ratio deep Si etching of micro/nano scale features with SF6 /H2/ O2 plasma, in a low plasma density reactive ion etching system Z. Sanaee, M. Poudineh, M. Mehran, S. Mohajerzadeh, University of Tehran, IR | |
| - | Modularity in the Design and Volume Production of Microfluidic Devices J. Podczerviensky, L. Levine, ALine, Inc., US | |
| - | Liquid State Polydimethylsiloxane Wrinkle Fabrication for passive micro fluidic channel mixer S.H. Lee, Y. Yoon, J. Lee, J. Jeon, J-B Lee, M.J. Kim, University of Texas at Dallas, US | |
| - | An Improved Micro Injection Molding Technique for Grating Devices H.S. Li, W.H. Hsieh, L.K.C. Au, K.C. Liu, National Chung Cheng University, TW | |
| - | Fabrication of Nano-structures of NiTi Shape Memory Films and Investigations on Size dependence of their Mechanical Properties S.K. Sharma, S. Mohan, Indian Institute of Science, Bangalore, IN | |
| - | Multi-purpose tool for checking the microfabrication products G. De Pasquale, A. Somà, Politecnico di Torino, IT | |
| - | Fabrication and analysis of MEMS test structures for residual stress measurement A. Sharma, M. Kaur, D. Bansal, D. Kumar, K. Rangra, Central Electronics Engineering Research Institute (CEERI/ CSIR), IN | |
| - | Energy-saving Nanotechnology of water heating for heating of inhabited and industrial premises G. Dubinin, E. Voloschuk, Scientific and Technical Centre “AVATARA”, UA | |
| - | SC Cavities Fast Tuning System Based on Piezoelectric Actuators K. Przygoda, T. Pozniak, A. Napieralski, P. Sekalski, M. Grecki, Technical University of Lodz, PL | |
| - | DESIGN and FABRICATION of a METALLIC MEMS GRIPPER USING ELECTRO-THERMAL V-SHAPE and MODIFIED U-SHAPE ACTUATORS J.J. Khazaai, H. Qu, M. Shillor, L. Smith, Oakland University, US | |
| - | A Pressure Sensor Array with Sensing Ranges Tunable by Driving Frequency Y.-T. Lai, Y.-J. Yang, National Taiwan University, TW | |
| - | Control of MEMS-Technology Axial Topology MicroServos S.E. Lyshevski, Rochester Institute of Technology, US | |
| - | u-Helix 3D-antenna technology P. Nenzi, Sapienza - Università di Roma, IT | |
Wednesday June 15 | ||
| Back to Top | ||
| 8:30 | Novel MEMS & NEMS Devices: Design & Fabrication | Room 203 |
| Session chair: Cy Wilson, NASA, US | ||
| 8:30 | Sensor Fusion Solution with MEMS Sensors J. Esfandyari, STMicroelectronics, US | |
| 8:50 | Programmable MEMS-Based Silicon Timing Solutions Change the Game M. Lutz, SiTime Corp, US | |
| 9:10 | Space Applications for Wireless Sensors W.C. Wilson, G.M. Atkinson, NASA Langley Research Center, US | |
| 9:30 | AC and DC Applications of Three-Dimensional Nano-electro-mechanical-systems A.B. Kaul, A.R. Khan, K.G. Megerian, L. Bagge, L. Epp, Jet Propulsion Laboratory, US | |
| 9:50 | Design of a g-force meter on Si wafer, based on motor driven by photons J. Valenzuela, S. Mil’shtein, University of Massachusetts, US | |
| Back to Top | ||
| 10:30 | Biofluidic Devices | Room 103 |
| Session chair: Daniel Attinger, Columbia University and Edward P. Furlani, University at Buffalo (SUNY) | ||
| 10:30 | Control in Microfluidic Assay and Synthesis Systems (invited presentation) M.A. Burns, University of Michigan, US | |
| 11:00 | Sensors and Microfluidics (invited presentation) R. Potyrailo, GE Global Research, US | |
| 11:30 | The Physics of Pressure Powered Micro-Flow Focusing Device for the Encapsulation of Live Cells J. Berthier, P. Dalle, F. Rivera, R. Renaudot, S. Morales, P-Y. Benhamou, P. Caillat, CEA-Leti, FR | |
| 11:50 | Use of Silica Nanosprings in an Enzyme-Based Continuous Flow Reactor D.C. Hyatt, T. Cantrell, M. Yahvah, M. Grant Norton, D.N. McIlroy, G. Corti, GoNano Technologies, Inc., US | |
| Back to Top | ||
| 1:30 | Integrated NEMS & MEMS Sensors: Application & Fabrication | Room 209 |
| Session chair: Cy Wilson, NASA, US | ||
| 1:30 | Tin oxide nanowire sensors for highly sensitive detection of toxic gases A. Koeck, E. Brunet, C. Griessler, T. Maier, G. Mutinati, S. Steinhauer, AIT Austrian Institute of Technology GmbH, AT | |
| 1:50 | Nanospring Mats for Detection of Explosives V. Dobrokhotov, Western Kentucky University, US | |
| 2:10 | Novel Low Temperature Fabrication Method for Label-Free Electronic Sensing of Biomolecules in Nanofluidic Channels with Integrated Electrodes T. Wynne, X.T. Huang, S. Pennathur, University of California, Santa Barbara, US | |
| 2:30 | Magnetic nanoparticles as components of magnetoresistance sensors: the gGMR-sensor A. Weddemann, I. Ennen, A. Regtmeier, A. Hütten, M. Zahn, Massachusetts Institute of Technology, US | |
| 2:50 | Parallel Fabrication of Single-Walled Carbon Nanotube based Piezoresistive Pressure Sensors B.R. Burg, T. Helbling, C. Hierold, D. Poulikakos, ETH Zurich, CH | |
| 3:10 | Design and Fabrication of a Multi-Axis MEMS Force Sensor with Integrated Carbon Nanotube Based Piezoresistors M.A. Cullinan, R.M. Panas, M.L. Culpepper, Massachusetts Institute of Technology, US | |
| 3:30 | Current research at CSHR: towards ElectroMioGraphy (EMG) sensor network M. Pzaleari, Istituto Italiano di Tecnologia, IT | |
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| 1:30 | TechConnect IP Partnering: Biotech & Medical | Room 303 |
| Session chair: Lynn Foster, BPT Pharma, US | ||
| 1:30 | Cellular Gradient Polymer Composites P. Bourban, Ecole Polytechnique Fédérale de Lausanne (EPFL), CH | |
| 1:40 | Magnetic nanoparticles for drug targeting M. Kempe, Lund University, SE | |
| 1:50 | Novel biomarker signature as a predictor of breast cancer outcome O. Novac, McGill University, CA | |
| 2:00 | Portfolio of Scaffolds and Biomaterials for Multiple Orthopaedic and Medical Applications S. Hartford, University of Notre Dame, US | |
| 2:10 | Microfluidic Lab-on-Chip Platform for Point of Care Testing P. Koonjul, VALEO MANAGEMENT, CA | |
| 2:20 | New Technology for Micro- and Nanonization & Encapsulation of Molecular Compounds of Interest J. Reverter, ICN - INSTITUT CATALA DE NANOTECNOLOGIA, ES | |
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| 3:00 | TechConnect IP Partnering: Pharmaceuticals | Room 303 |
| Session chair: Belen Martinez, CaramelTech, MX | ||
| 3:00 | New Strategies For Secure, Non-Invasive Transitional for Brain Cancer Treatment C. Michel, SOCPRA, CA | |
| 3:10 | Treatment of Influenza Virus-Mediated Lung Injury: Blocking the A1-Adenosine Receptor I. Davis, The Ohio State University, US | |
| 3:20 | High-Throughput Label-Free Nanoparticle Detection And Size Assay F. Caporale, University of California Santa Barbara, US | |
| 3:30 | Radionuclide-Loaded Liposome C. Burke, UT Health Science Center at San Antonio, US | |
| 3:40 | Cerium oxide nanoparticles for treatment and prevention of Alzheimer’s disease, Parkinson’s disease, and disorders associated with free radical production and/or mitochondrial dysfunction. B. Rzigalinski, Virginia Coll. of Osteopathic Medicine, US | |
| Back to Top | ||
| 3:00 | TechConnect IP Partnering: Semiconductors, Sensors & Microsystems | Room 305 |
| Session chair: Ryan Williams, Fraunhofer, US | ||
| 3:00 | High-speed feedback controller P. Lamoureux, Valeo Management, CA | |
| 3:10 | Organic/Inorganic Hybrid Optical Amplifier with Wavelength Conversion L. Loerchner, University of Waterloo, CA | |
| 3:20 | Inertial Sensors Based on Magnetic Levitation F. Barrot, CSEM SA, CH | |
| 3:30 | Low cost production of single crystal-like films S. Lux, ETH Zurich - ETH transfer, CH | |
| 3:40 | Tunable High Sensitivity or Low Cost Gas Detectors D. Nugent, University of Minnesota, US | |
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| 1:30 | US-China Nanotech Connect | Expo Hall Theater |
| 1:30 | Introducing Suzhou Industry Park- a Vibrant and Progressive High-tech Hub in China D. Zhang, Technology and Development Bureau, Suzhou Industrial Park (SIP), CN | |
| 1:45 | Overview of Suzhou Nano-manufacturing Capabilities L. Liu, NanoGlobe, CN | |
| 2:00 | Printed electronics R&D in China and collaboration opportunities Z. Cui, Suzhou Institute of Nanotech and Nanobionics (SINANO), CN | |
| 2:15 | Intradermal Drug Delivery Devices Based on Proprietary Functional Micro Array (FMA) Technology B. Xu, Suzhou Natong Bionanotechnology Ltd. (Nanomed), CN | |
| 2:30 | Experience Sharing: Growing Venture Businesses in China N. An, New England Chinese Information and Networking Association, CN | |
| 2:45 | Technology Partnership and Business Development Opportunities in Nanopolis Suzhou Q&A L. Liu, NanoGlobe, CN | |
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| 3:30 | US-China Nanotech Connect - Networking Reception - Booth 930 Expo Hall C (3:30 - 4:00) | Expo Hall Theater |
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| 4:00 | Piemonte Agency For Investments, Export And Tourism Reception - Nanotech booth 1607, Cleantech booth 707 | Expo Hall |
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| 4:00 | Innovation Showcase & Poster Session - Reception (4:00 - 6:00) | Expo Hall |
| Back to Top | ||
| MEMS & NEMS Fabrication, Devices & Applications | Expo Hall | |
| - | Electrical performance comparison of Symmetric Toggle Switch for SiO2 and HfO2 dielectric layers K. Maninder, Central Electronics Engineering Research Institute, IN | |
| - | Gravimeter on a Chip: An Theoretical Study F. Li, J.V. Clark, Purdue University, US | |
| - | Quantum Electromechanichal oscillations and Current Enhancement by Compression of Buckled Carbon Nanotube Bundle L.T. Singh, Indian Institute of Science, IN | |
| - | A simple and low cost method for fabrication of nanochannels using water soluble nanowires A. Joshi, Agharkar Research Institute, IN | |
| - | A Novel Silicon-based Wideband Nano Switch for RF Applications Y.X. Yang, R. Ramer, University of New South Wales (UNSW), AU | |
| - | Meander based RF MEMS capacitive switch for Mobile Front End Terminal Antenna support P. Chawla, R. Khanna, KITM, Kurukshetra University Kurukshetra, IN | |
| - | Design and Analysis of FBAR switches for RF Front-End Mobile Terminal P. Chawla, R. Khanna, KITM, Kurukshetra University Kurukshetra, IN | |
| - | Weak Magnetic Fields Sensing Using Soft Ferrite Nanoparticles and MEMS S.E. Lyshevski, Rochester Institute of Technology, US | |
| - | Low-cost Thin-film Transistor-based Microcantilever for Measuring Deflection P-Y Lin, Y-J Cheng, S. Kuan and L-S. Huang, National Tainwan University, TW | |
| - | Design and Characterization of a Fully Differential Mems Accelerometer Fabricated Using METALMUMPS Technology P. Qu, Oakland University, US | |
| - | Calibrating the AFM with Self-Calibratable MEMS: An Theoretical Study F. Li, J.V. Clark, Purdue University, US | |
| - | COMB FINGER CAPACITIVE MICRO WIND SENOR Z. Zhao, Y. Han, L. Du, Z. Fang, X. Wang, Institute of Electronics,CAS, CN | |
Thursday June 16 | ||
| Back to Top | ||
| 8:30 | MEMS-Based Systems Solutions and Integration Approaches | Room 209 |
| Session chair: Roger Grace, Roger Grace Associates, US | ||
| 8:30 | Welcome and Introduction R. Grace, Roger Grace Associates, US | |
| 8:45 | Think Beyond the Chip: Challenges of Smart System Integration and the Critical Role of the European Platform for Smart Systems (Keynote) S. Coffa, ST Microelectronics, IT | |
| 9:30 | MEMS-Based System Solutions: Review and Overview with a Focus on Current and Emerging High Volume Applications (invited presentation) R. Grace, Roger Grace Associates, US | |
| 9:50 | Power Optimization of heterogeneous and MEMS based systems: “Consume more to consume less” (invited presentation) C. Van Hoof, IMEC, BE | |
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| 10:30 | Device Design and Simulation 1 | Room 205 |
| 10:30 | Design of Microassembly through Process Modeling in Virtual Reality A.N. Das, H.E. Stephanou, University of Texas at Arlington, US | |
| 10:50 | Simulation of Field-Plate Effects on Surface-State-Related Lag and Current Slump in GaAs FETs T. Tanaka, K. Itagaki, A. Nakajima, K. Horio, Shibaura Institute of Technology, JP | |
| 11:10 | Performance Study of Nitride-Based Gunn Diodes G. Aloise, S. Vitanov, V. Palankovski, Advanced Material and Device Analysis Group, AT | |
| 11:30 | The role of Electromechanical coupling in AlGaN/AlN/GaN HEMTs B. Padmanabhan, D. Vasileska, S.M. Goodnick, Arizona State University, US | |
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| 10:30 | Nano and Micro Technologies for Oil & Gas | Room 303 |
| Session chair: Chris Menzel, Dimatix, US | ||
| 10:30 | Microfluidics and Microsensors for Downhole Oilfield Applications C. Harrison, M. Sullivan, R. Schroeder, E. Smythe, P. Dryden, Schlumberger-Doll Research, US | |
| 10:50 | Design and Application of Novel Nano Drilling Fluids to Mitigate Circulation Loss Problems during Oil Well Drilling Operations V. Mostafavi, M.Z. Ferdous, G. Hareland, M. Husein, University of Calgary, CA | |
| 11:10 | The Separation of Hydrocarbons from Sand Using Ionic Liquids P. Painter, B. Miller, A. Lupinsky, P. Williams, Penn State University, US | |
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| 10:30 | MEMS-Based Systems Solutions and Integration Approaches | Room 209 |
| Session chair: Roger Grace, Roger Grace Associates, US | ||
| 10:30 | MEMS sensors enable high-performance devices and unique system-level applications (invited presentation) A. Oja, VTT Technical Research Centre of Finland, FI | |
| 10:50 | Integration Approaches of Combining Micro and Nano Technologies (invited presentation) A. Rouzaud, Ph. Robert, J.-Ph. Polizzi, N. Sillon, Léti, FR | |
| 11:10 | Integration Challenges for High Performance Inertial Sensors (invited presentation) R. Scannell, Analog Devices, Inc., US | |
| 11:30 | Optofluidics: exciting integration of two microsystem technology platforms (invited presentation) A. Leinse, J. Walker, LioniX BV, US | |
| 11:50 | Integration Strategies for Magnetic Microsystems (invited presentation) D. Harris, Advanced MicroSensors, Inc., US | |
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| 10:30 | TechConnect Corporate Partnering: Venture Partnering | Room 306 |
| Session chair: Dina Lozofsky, University of California Santa Barbara, US | ||
| 10:30 | BASF Corporate Partnering P. Mukherjee, BASF Venture Capital America, US | |
| 10:50 | Panasonic TechConnect Partnering I. Nydick, Panasonic, US | |
| 11:10 | Cabot TechConnect Partnering T. Kodas, Cabot Corporation, US | |
| 11:30 | Honda TechConnect Partnering N. Sugimoto, Honda, US | |
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| 1:00 | TechConnect Ventures: Biotech & Medical | Room 303 |
| Session chair: Belen Martinez-Lopez, CaramelTech | ||
| 1:00 | Cellanyx Diagnostics C. Ashok, Cellanyx Diagnostics, US | |
| 1:10 | Quegen Biotech Co. J.D. Lee, Quegen Biotech Co., US | |
| 1:20 | BIO-FD&C Co., Ltd. S.H. Moh, BIO-FD&C Co., Ltd., KR | |
| 1:30 | Sharklet Technologies, Inc. M. Spiecker, Sharklet Technologies, Inc., US | |
| 1:40 | NanoMedical Systems, Inc. R. Goodall, NanoMedical Systems, Inc., US | |
| 1:50 | Cosmas Therapeutics Development Inc. M. Atkin, Cosmas Therapeutics Development Inc., CA | |
| 2:00 | WaveGuide Corporation L. Fritzemeier, WaveGuide Corporation, US | |
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| 1:30 | Micro & Nano Reliability | Room 205 |
| Session chair: Jürgen Keller, AMIC GmbH and Bernd Michel, Fraunhofer IZM, DE | ||
| 1:30 | Three-dimensional Deformation Analysis of MEMS/NEMS by means of X-ray Computer-Tomography J. Hammacher, M. Dost, W. Faust, L. Scheiter, R. Erb, B. Michel, Fraunhofer ENAS, DE | |
| 1:50 | Comparative Analysis of Threshold Voltage Variations in Presence of Random Channel Dopants and a Single Random Interface Trap for 45 nm N-MOSFET as Predicted by Ensemble Monte Carlo Simulation and Existing Analytical Model Expressions N. Ashraf, D. Vasileska, Arizona State University, US | |
| 2:10 | Reliability Analysis of Low Temperature Low Pressure Ag-Sinter Die Attach R. Mrossko, H. Oppermann, B. Wunderle, T. Winkler, B. Michel, Berliner Nanotest und Design GmbH, DE | |
| 2:30 | Fracture mechanical test methods for interface crack evaluation of electronic packages J. Keller, I. Maus, H. Pape, B. Wunderle, B. Michel, AMIC Angewandte Micro-Messtechnik GmbH, DE | |
| 2:50 | Automated test system for in-situ testing of reliability and aging behaviour of thermal interface materials M. Abo Ras, Berliner Nanotest and Design GmbH, DE | |
| 3:10 | Correlation of Microstructure and Tribological Properties of Dry Sliding Nanocrystalline Diamond Coatings M. Wiora, N. Sadrifar, K. Brühne, P. Gluche, H.-J. Fecht, Ulm University, DE | |
| 3:30 | Ultrathin Parylene-C Gate Dielectrics for Flexible Carbon Nanotube Field Effect Transistors M. Mohebbi, S. Selvarasah, X. Li, B. Beauvais, M.R. Dokmeci, Northeastern University, US | |
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| 1:30 | MEMS-Based Systems Solutions and Integration Approaches | Room 209 |
| Session chair: Roger Grace, Roger Grace Associates, US | ||
| 1:40 | Monitoring and Assessing the Structural Integrity of Infrastructure Systems using Next-Generation Sensor Technologies (invited presentation) J.P. Lynch, University of Michigan, US | |
| 2:00 | Pixtronix DMS™ MEMS Technology for Broad Spectrum of Display System Applications (invited presentation) R. Payne, J. Gandhi, T. Brosnihan, L. Steyn, J. Wu, J. DeRoo, S. Lewis, G. Fike, M. Halfman, N. Hagood, Pixtronix, Inc., US | |
| 2:20 | Wafer level packaging solutions for hermetic sealing, temperature control and vibration isolation (invited presentation) J. Mitchell, S. Lee, K. Najafi, ePack, Inc., US | |
| 2:40 | Making a MEMs Mass Flow Controller for Portable Analytics (invited presentation) R. Meisinger, B. Kinkade, Leister Technologies LLC, US | |
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| 2:30 | TechConnect Ventures: Semiconductors, Sensors & Microsystems | Room 303 |
| Session chair: Bill Byun, 7Capital, US | ||
| 2:30 | Linear Signal, LLC G. Mockett, Linear Signal, LLC, US | |
| 2:40 | mc10 G. Callsen, mc10, US | |
| 2:50 | Nanofab3D Inc. D. Diesk, Nanofab3D Inc., US | |
| 3:00 | Arkansas Power Electronics International, Inc. T. McNutt, Arkansas Power Electronics International, Inc., US | |
| 3:10 | nanoLambda B. Choi, nanoLambda, US | |
| 3:20 | VERSATILIS LLC G. Powch, VERSATILIS LLC, US | |
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| 3:00 | MEMS-Based Systems Solutions and Integration Approaches | Room 209 |
| Session chair: Roger Grace, Roger Grace Associates, US | ||
| 3:00 | Design for Reliability in MEMS-Based Systems (invited presentation) A. Hartzell, Lilliputian Systems Inc., US | |
| 3:20 | Co-design of Heterogeneous Microsystems (invited presentation) M.A. Maher, SoftMEMS LLC, US | |
| 3:40 | Improving Performance of Micro Structure and MEMS Designs by using Optical Measurement (invited presentation) E.M. Lawrence, Polytec Inc., US | |
| 4:00 | Motivations for a common MEMS test methodology (invited presentation) D. Feuerstein, SemiProbe, Inc., US | |
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| 4:30 | Technical and Business Collaboration Opportunities: MEMS-Based Systems Solutions and Integration Approaches | Room 209 |
| Session chair: Roger Grace, Roger Grace Associates, US | ||
| - | High Value Sensor Systems – a Commercial View G. Pease, Hewlett Packard, US | |
| - | Overview of ATK Micro-Technologies for Aerospace Applications N. Tiliakos, G. Papadopoulos, D. Modroukas, ATK GASL, US | |
| - | System Solutions Using MEMS Sensors for Inertial Navigation and Wireless Sensor ApplicationsM. Grimmer, MEMSIC, Inc., US | |
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| 5:00 | TechConnect Closing Networking, Partnering & Investment Reception (3rd Floor, Boylston Hallway) | Boylston Hallway |
Special Symposium
This special symposia focuses specifically on emerging applications and advanced fabrication, materials, devices for MEMS and Sensors. Participating corporations are looking to the MEMS community for business and technology developement opportunities for their strategic needs. F-1000 corporate end-users participating include: Lockheed Martin, Honda, GM, GE, Samsung, Dow, BASF, bp, Siemens, Kodak, Proctor & Gamble, Applied Materials, Fuji Electric, Toray, Merck, Chevron, Omron, Panasonic, and many more. Submit your technical abstract today and join the leading innovators in providing new microtech solutions to the world's top corporate technology integrators.
Topics & Application Areas
- Novel Materials for MEMS
- Novel MEMS Fabrication & Processes
- Acoustic Devices
- Optical MEMS
- Thermal Devices
- Actuating Devices
- Novel MEMS Devices
- Novel NEMS Devices
- RF MEMS, Resonators & Oscillators
- Sensing Systems & Networks
- Mechanical & Physical Sensors
- Chemical & Gas Sensors
- Other Micro Sensors
- Other
Journal Submissions
On-line Journal ‘Sensors & Transducers’
Selected proceedings papers in the Electronics and Microsystems Track (MEMS & NEMS, Sensors & Systems, Micro & Nano Fluidics symposia, and MSM conference) will be reviewed and invited into a Special Issue of the on-line journal ‘Sensors & Transducers’.
For consideration into this Special Issue of the on-line journal ‘Sensors & Transducers’, please select the “Submit to Sensors & Transducers” button during the on-line submission procedure.
Journal of Experimental Nanoscience
Selected Nanotech Proceedings papers will be reviewed and invited into a Special Issue of the Journal of Experimental Nanoscience. The journal provides a showcase for advances in the experimental sciences underlying nanotechnology and nanomaterials.
For consideration into this Special Issue of the Journal of Experimental Nanoscience, please select the “Submit to Journal of Experimental Nanoscience” button during the on-line submission procedure.
Molecular Simulation
Selected Nanotech Proceedings papers will be reviewed and invited into a Special Issue of Molecular Simulation. The journal covers all aspects of research related to, or of importance to, molecular modelling and simulation (including informatics, theoretical and experimental work).
For consideration into this Special Issue of Molecular Simulations, please select the “Submit to Molecular Simulation” button during the on-line submission procedure.
