Micro & Nano Reliability

Symposium Chair
Jürgen Keller CEO AMIC GmbH, Germany	Bernd Michel Director of MicroMaterials Center, Berlin and Chemnitz Fraunhofer ENAS, Germany

Symposium Sessions
	Tuesday June 14
1:30	Welcome to Nanotech Germany
4:00	Italian Trade Commission Reception - Nanotech booth 1607, Cleantech booth 707
4:00	Innovation Showcase & Poster Session - Reception (4:00 - 6:00)
	Wednesday June 15
4:00	Piemonte Agency For Investments, Export And Tourism Reception - Nanotech booth 1607, Cleantech booth 707
4:00	Innovation Showcase & Poster Session - Reception (4:00 - 6:00)
	Micro & Nano Reliability
	Thursday June 16
1:30	Micro & Nano Reliability
Symposium Program
	Tuesday June 14
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1:30	Welcome to Nanotech Germany	Room 205
1:30	Opening and Welcome F. Wolf, Federal Ministry of Education and Research (BMBF), Bonn, DE
1:40	CNT – A novel cooperation model to conquer new markets for CNT based products P. Krüger, Inno.CNT, DE
2:00	Zentallium®, ZoLiBat® & H2Tank2Go®-modules and ZE-powerplant-nanostructures for zero-emission future transportation and energy D. Zoz, Zoz Group, DE
2:20	Carbon Nanotubes and Nano Structures for Applicati on in Interconnects,Sensors and Wafer Level Packaging S. Schulz, Fraunhofer Institute for Electronic Nano Systems, Chemnitz, DE
2:40	NanoMat: The German Network for Nanomaterials and Polymer Phase Lithography:Layout-Controlled and Spontaneous Structure Formation on the Nano Scale T. Heiler, R. Hedderich, R. Gröger, S. Walheim, T. Schimmel, Karlsruhe Institute of Technology, NanoMat, DE
3:00	Sharing the enthusiasm for Nano B. Gerbauer, Nanosystems Initiative Munich (NIM), DE
3:20	CANdots: Nanoparticles for your Purpose J. Niehaus, D. Tiegs, S. Becker, V-H. Tran, H. Weller, Center for Applied Nanotechnology (CAN) GmbH, DE
3:40	Hi-Tec Nano-Composites Containing Carbon Nanotubes W. Schütz, FutureCarbon GmbH, DE
4:00	Electron Beam Lithography: The Nanolithography for Nanotechnology J. Krostoff and I. Stolberg, Vistec Electron Beam Lithography Group, US
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4:00	Italian Trade Commission Reception - Nanotech booth 1607, Cleantech booth 707	Expo Hall
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4:00	Innovation Showcase & Poster Session - Reception (4:00 - 6:00)	Expo Hall
	Wednesday June 15
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4:00	Piemonte Agency For Investments, Export And Tourism Reception - Nanotech booth 1607, Cleantech booth 707	Expo Hall
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4:00	Innovation Showcase & Poster Session - Reception (4:00 - 6:00)	Expo Hall
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	Micro & Nano Reliability	Expo Hall
-	FinFET reliability issue analysis by forward gated-diode method Z. Liu, PKU HKUST Shenzhen Institution of IER., CN
-	Numerical study on effect of random dopant fluctuation on double gate MOSFET based 6-T SRAM performance X. Zhang, Peking University, CN
-	Characteristics Sensitivity of FinFET to Fin Vertical Nonuniformity J. Xu, Peking University, CN
-	An Accurate Method to Extract and Separate Interface and Gate Oxide Traps by the MOSFET Subthreshold Current C. Zhang, Peking University, CN
-	Cryostructuration of latexes I. Portnaya, Technion - Israel Institute of Technology, IL
	Thursday June 16
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1:30	Micro & Nano Reliability	Room 205
	Session chair: Jürgen Keller, AMIC GmbH and Bernd Michel, Fraunhofer IZM, DE
1:30	Three-dimensional Deformation Analysis of MEMS/NEMS by means of X-ray Computer-Tomography J. Hammacher, M. Dost, W. Faust, L. Scheiter, R. Erb, B. Michel, Fraunhofer ENAS, DE
1:50	Comparative Analysis of Threshold Voltage Variations in Presence of Random Channel Dopants and a Single Random Interface Trap for 45 nm N-MOSFET as Predicted by Ensemble Monte Carlo Simulation and Existing Analytical Model Expressions N. Ashraf, D. Vasileska, Arizona State University, US
2:10	Reliability Analysis of Low Temperature Low Pressure Ag-Sinter Die Attach R. Mrossko, H. Oppermann, B. Wunderle, T. Winkler, B. Michel, Berliner Nanotest und Design GmbH, DE
2:30	Fracture mechanical test methods for interface crack evaluation of electronic packages J. Keller, I. Maus, H. Pape, B. Wunderle, B. Michel, AMIC Angewandte Micro-Messtechnik GmbH, DE
2:50	Automated test system for in-situ testing of reliability and aging behaviour of thermal interface materials M. Abo Ras, Berliner Nanotest and Design GmbH, DE
3:10	Correlation of Microstructure and Tribological Properties of Dry Sliding Nanocrystalline Diamond Coatings M. Wiora, N. Sadrifar, K. Brühne, P. Gluche, H.-J. Fecht, Ulm University, DE
3:30	Ultrathin Parylene-C Gate Dielectrics for Flexible Carbon Nanotube Field Effect Transistors M. Mohebbi, S. Selvarasah, X. Li, B. Beauvais, M.R. Dokmeci, Northeastern University, US

Special Symposium

Driving forces in microelectronics and MEMS/NEMS manufacturing are the miniaturization processes with steadily increasing service temperatures, temperature gradients and cooling requirements. For these requirements, new processes and technologies are developed to achieve highly localized tailoredthermo mechanical properties. New approaches down to the nanoscale in frontend as well as backend processes of semiconductor industry are continuously brought into the application.

This symposium is focused on reliability tasks of chip design, MEMS/NEMS and cleantech applications were nano or microstructural effects are dominating factors for reliability and lifetime. Novel testing methods for thermo mechanical characterization of the building blocks of nanotechnology are also addressed. Nanoreliability approaches from other sectors are also welcome to provide an overview of experimental and numerical concepts for nanotechnology applications.

Topics & Application Areas

• Reliability of MEMS/NEMS, Microsystems, Sensors, Mechatronic Systems
• Reliability of Microelectronic Components and Systems
• Reliability in Nanoelectronics, Nanopackaging
• Nanobiotechnology and Reliability Issues
• Reliability - Experiments, Testing Methods and Techniques at the Nano Scale
• Design for Reliability
• Reliability Concepts on Micro- and Nanoscale; Physics of Failure
• Reliability Simulation
• Reliability Monitoring and Diagnostics
• Fracture, Cracks (e.g. Interface Cracking)
• Coupled Field Reliability Applications (Mechanical, Thermal, Electrical, Diffusion, Vibration etc.)
• Mechanical and Thermal Reliability, Thermal Mismatch
• Micromaterials, Nanomaterials and related Reliability Issues
• High Resolution Stress and Strain Analysis for Reliability Applications
• Micro- and Nano Packaging, Reliability Strategies
• Reliability and Standarization in the Micro-Nano Region
• Other

 

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