TechConnect World 2017
National SBIR/STTR Conference National Innovation Summit & Showcase Nanotech 2017

Accelerating the Commercialization of

Global Innovation

Press Room

audience

Members of the media – including reporters, writers, editors, photographers and production crews – are encouraged to register in advance to receive complimentary press passes for TechConnect World. Press passes allow complete access to the following:

  • All keynotes and breakout sessions
  • Exhibit floor during open hours
  • All lunches, breaks and receptions
  • Press and speaker rooms

To apply for a press pass, please send your credentials: .

Marketing, advertising, sales, art directors, managers, publishers and other non-editorial professionals of media organizations are NOT eligible for press passes and should proceed to the Attendee Registration page.

If you are a broadcast journalist, please have your producer/editor email: press@techconnect.org; stating that you are on assignment to cover the TechConnect World events.

After we have received your credentials, they will be reviewed and are subject to approval based on availability and management's discretion. You will be notified within two weeks if you are approved or disapproved. Submitting a press pass request does not guarantee that you will receive a press pass, and press passes will not be granted to anyone whose principal purpose for attending our event is -- in our judgment -- for reasons other than covering them as working news media.

Members of the Media will need to pick up their press passes at the registration desk when they arrive at the TechConnect World.

Media organizations that attended previously.


Platinum Sponsors
Korusip
KIAT and KETEP
Lockheed Martin
NSTXL

Silver Sponsors
Fujifilm
TechOpp

Corporate Acceleration Partners
Aerojet
Arkema
Baxter
Boeing
Church & Dwight
Corning
Cummins
Eastman Chemical
Energizer Holdings Inc.
Evonik
Henkel
Huntsman
Ingersoll_Rand
LG
Lockheed Martin
LOreal
Magna
Medtronic
Michelman
Owens Corning
Panasonic
Praxair
Sabic
SAINT-GOBAIN
Shell
Sherwin Williams
UTC

Technology Development Partners
 
AirForce Technology Transfer
Argonne
Business Sweden
ceatech
Fermilab
GLEAMM
Idaho National Laboratory
Innovate Hawaii
InvestInSkane
Iowa State University
Jefferson Lab
Kansas City National Security Campus
korusip
KYUNGPOOK National University
Lawrence Berkeley National Laboratory
NASA
NETL
NREL
New Jersey Innovation Institute
University of Buffalo NYSCEMI
OakRidgeNatLab
PolyU
PPPL
Sandia National Laboratories
SungKyunKwan University
Texas Tech Research Commercialization
UCI
University Of Melbourne
University Of Minnesota
University Of Vermont
UCLA Technology Development Group
UCSB
Vermont Department Economic Development
Vermont Technology Council

Supporting Partners
ACCT
American Elements
Angel Capital Associates
AOCS
Arrowhead Center
Asia Nano Forum
AURP
AUTM
BILAT USA 4.0
Coatings
Diplomacy Matters
European Commission
European Cluster Collaboration Platform
Explore Nano
FCHEA
FLC
Graphene Council
INNO
InterNano
Journal of Nanobiotechnology
LES
NVCA
NCURA
NECEC
SBIR
SBDC
Taylor Francis CRC
Texas Nanotech Initiative
UIDP

TechConnect World 2017

Jointly produced by