TechConnect World 2020
Co-Located with Nanotech 2020 SBIR/STTR Spring AI TechConnect
Nanotech 2020
 

Materials Characterization & Imaging

Nanoscale Materials Characterization

Abstracts due - December 13

Symposium Co-Chairs

Greg HaugstadGreg Haugstad
Technical Staff Member & Director, Characterization Facility (CharFac)
University of Minnesota

Dalia YablonDalia Yablon
Technical Program Chair
TechConnect World Innovation Conference

 

This year's symposium will focus on innovations in nanoscale materials characterization including new method development as well as industry-specific applications. Submissions are also invited for special sessions focused on machine learning for materials characterization and imaging (in conjunction with the AI TechConnect Conference); and on industrial applications of x-ray scattering methods.

Topics & Application Areas

  • Innovations in Nanomaterials Characterization
  • Special Session: Machine Learning for Materials Characterization and Imaging
  • Special Session: Scattering Methods in Industrial Applications
  • Other

View the 2019 program »

Submit Your Abstract

Please first review the information for authors — abstract submission guidelines.

 
 
2019 Sponsors & Partners
2019 Sponsors & Partners