TechConnect World 2018

Advanced Manufacturing


Submit your Abstracts: Due December 8th. Select the most appropriate symposium from the technical program listing and submit an abstract describing your research. Our distinguished Program Review Committee will consider your work for oral or poster presentation at the conference, and for inclusion in TechConnect Briefs open-access journal.

Join industry partners and applied research leadership accelerating the development and deployment of new material solutions into products and society.

2017 Featured Speakers:

Mandakini KanungoMandakini Kanungo
Corning, Inc.

Chris MenzelChris Menzel
Fujifilm Dimatix, Inc.

Murat GuvendirenMurat Guvendiren
New Jersey Institute of Technology (NJIT)

Aram ChungAram Chung
Rensselaer Polytechnic Institute (RPI)

Jeff Tza-Huei WangJeff Tza-Huei Wang
Johns Hopkins University

Jean BerthierJean Berthier
CEA-LETI-Minatec, France

Edward FurlaniEdward Furlani
University at Buffalo (SUNY)

Kwang W. OhKwang W. Oh
University at Buffalo (SUNY)

Richard B. FairRichard B. Fair
Duke University

Robert CelottaRobert Celotta
NIST Center for Nanoscale Science and Technology

HaugstadGreg Haugstad
University of Minnesota
Ryan WagnerRyan Wagner
National Institute of Standards and Technology

Pierre PaninePierre Panine
Xenocs SA, France

Dalia YablonDalia Yablon
SurfaceChar LLC

Jean BerthierJean Berthier
CEA-LETI-Minatec, France

Aram ChungAram Chung
Rensselaer Polytechnic Institute (RPI)

2017 Key Speakers Included:

  • Aerojet
  • Alex Norman, ExxonMobil Chemical
  • Antonios Doufas, ExxonMobil Chemical Company
  • Brent M Segal, Lockheed Martin
  • Brian Thompson, GKN Aerospace
  • Carl Dekker, Met-l-flo Inc.
  • Chris Menzel, Fujifilm Dimatix, Inc.
  • Chris Skinner, Owens Corning
  • Christian Hoepfner, Fraunhofer CSE
  • Chruch & Dwight
  • Chuck C.W. Extrand, Colder Products Company (CPC)
  • Daniel J. Barta, NASA Johnson Space Center
  • Daniel L. Alge, Texas A&M University
  • Gokce Gulsoy, TE Connectivity
  • Ian Simmons, Magna International
  • Ingersoll Rand
  • James Kushmerick, NIST
  • Jan Kosny, Fraunhofer Center for Sustainable Energy Systems CSE
  • Jan-Steffen Niehaus, CAN Center for Applied Nanotechnology, Germany
  • John Sirman, Praxair
  • Karma Sawyer, US Department of Energy
  • Lisa Friedersdorf, NNCO
  • Loucas Tsakalakos , GE Global Research
  • Mandakini Kanungo, Corning, Inc.
  • Marc de Mul, BASF
  • Massimo F Bertino, Virginia Commonwealth University
  • Michael Makowski, PPG Industries
  • Michael Renn, Optomec
  • Murat Guvendiren, New Jersey Institute of Technology (NJIT)
  • Nitin Shukla, Fraunhofer CSE
  • Oliver Brand, Georgia Institute of Technology
  • Radislav A. Potyrailo, GE Global Research, US
  • Riley Reese, Engineering at Arevo
  • Robert Carpick, University of Pennsylvania
  • Robert Celotta, NIST Center for Nanoscale Science and Technology
  • Roger England, Cummins
  • Sarah Bergbreiter, Maryland Robotics Center
  • Sikorsky
  • Slade H Gardner, Big Metal Additive, Inc.
  • Tracy L. Albers, Rapid Prototype and Manufacturing, LLC.
  • William (Cy) Wilson, NASA Langley Research Center
  • YuanQiao Rao, The Dow Chemical Company

2017 Sponsors & Partners
2017 Sponsors & Partners

TechConnect World 2018

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