Abstracts Due: January 19, 2018
The TechConnect World Advanced Engineering Materials symposium will feature materials that are ready for commercial application. We will also spotlight new research and development: innovative and disruptive technologies, materials, and approaches that could provide game-changing increases in performance in future engineering applications. Please submit an abstract and plan to join innovators from industry, academic and government laboratories around the world at this important event.
Please first review the information for authors — abstract submission guidelines.