TechConnect World 2018

Informatics, Modeling, & Simulation

Informatics, Modeling, and Simulation

Abstracts Due: January 19, 2018

Symposium Co-Chairs

Michael MakowskiMichael Makowski
Technical Platform Manager
PPG Industries

Rick RossRick Ross
Senior Research Chemist
3M Company

Key Speakers

Johannes HachmannJohannes Hachmann
Assistant Professor
University at Buffalo, SUNY

David S SimmonsDavid S Simmons
Assistant Professor of Polymer Engineering
University of Akron

Peter KoenigModeling the physics and chemistry behind Personal Care Products
Peter Koenig
Group Head, Procter & Gamble

The Informatics, Modeling and Simulation symposium provides a comprehensive forum for the multidisciplinary materials design, modeling, simulation, and informatics communities. The 2018 symposium (our 19th annual event) will feature presentations on the latest applications-focused research and development in computational methods, tools and simulation for advanced materials and formulation design. It will also highlight informatics and knowledge management issues including data management and expansion of data pattern recognition, structure-property correlation, and data-based prediction capabilities.

You are invited to submit on topics ranging from theoretical developments through industry-oriented applications.

Submit Your Abstract

Please first review the information for authors — abstract submission guidelines.


Topics & Application Areas

  • Multiscale Modeling of Advanced Materials
  • Molecular Modeling
  • Materials Design Using Quantum Chemistry
  • Novel Modeling Methods & Theory
  • Modeling & Simulation of Polymer Nanostructures
  • Modeling Catalytic Surfaces & Reactions
  • Modeling & Simulation of Microsystems
  • Innovations In Computer-Aided Materials Design
  • Other
Sponsors & Partners
2018 Sponsors & Partners

TechConnect World 2018

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