TechConnect World 2020
Co-Located with Nanotech 2020 SBIR/STTR Spring AI TechConnect
 

Advanced Materials for Engineering Applications

Advanced Materials for Engineering Applications

Abstracts due - December 13

2020 Symposium Chair

Brent M SegalBrent M Segal
Director of Research Science and Chief Technologist
Lockheed Martin

Jim JohnstonJim Johnston
Professor, School of Chemical and Physical Sciences
Victoria University of Wellington, New Zealand

Key Speakers

Peter BishopPeter Bishop
Research Manager
Johnson Matthey, United Kingdom

 

The TechConnect World Advanced Engineering Materials symposium will feature materials that are ready for commercial application. We will also spotlight new research and development: Innovative technologies, materials, and approaches that could provide game-changing increases in performance in engineering applications. Please submit an abstract and plan to join innovators from industry, academic and government laboratories around the world at this important event. 

Topics & Application Areas

  • Advanced Engineering Materials
  • Next Generation Alloys & Ceramics
  • Polymer Composites
  • Novel Inorganic Pigments & Colorants
  • Inorganic Micro- and Nanofibres – Syntheses & Applications
  • Novel Inorganic Materials in Light Harvesting, Fluorescence & Photoluminescence Applications
  • Silica and Silicates – Syntheses & Applications
  • Rare Earths – Extraction, Processing & Applications
  • Magnetic & Superconducting Materials & Applications
  • Recovery and Recycling of Metals & Inorganic Materials
  • Inorganic Materials in Environmental Protection & Remediation
  • Aerospace Materials
  • Other

View the 2019 program »

Submit Your Abstract

Please first review the information for authors — abstract submission guidelines.

 
2019 Sponsors & Partners
 

2019 SBIR/STTR Agency Partners:

SBIR/STTR Agency Partners