TechConnect World 2020
Co-Located with Nanotech 2020 SBIR/STTR Spring AI TechConnect
Nanotech 2020
 
 

AI, Modeling & Simulation for Materials Design

Informatics, Modeling, and Simulation

Abstracts due - December 13

Symposium Co-Chairs

Rick RossRick Ross
Senior Research Chemist
3M Company

Peter KoenigPeter Koenig
Group Head
Procter & Gamble

Key Speakers

Corinne LipscombMaterials Informatics Applications for Structural Adhesives at 3M
Corinne Lipscomb
CPO Materials Informatics,, 3M

 

Materials modeling and simulation approaches continue to provide valuable insights and guidance for researchers working on new materials and product development across a wide range of industries. It is becoming clear that by encoding the physics of materials behavior, and capturing the domain knowledge from many decades of materials development and testing, these techniques may provide even greater value in machine learning and AI approaches.

This symposium will highlight the latest advances in AI, machine learning and autonomous research approaches for materials development.

We will also highlight applications-focused theoretical developments, industry applications and case studies in materials modeling and simulation (across all length scales).

Submit your abstract today and plan to share your research results and insights at this exciting event.

Topics & Application Areas

  • AI, Modeling and Simulation for Materials Design
  • Machine Learning
  • Autonomous Research Approaches
  • Multiscale Modeling of Advanced Materials
  • Molecular Modeling
  • Quantitive Structure Property Relationship (QSAR) Methods
  • Computational Fluid Dynamics
  • Finite Element Approaches
  • Novel Modeling Methods & Theory
  • Data Science
  • Other

View the 2019 program »

Submit Your Abstract

Please first review the information for authors — abstract submission guidelines.

 
2019 Sponsors & Partners
 

2019 SBIR/STTR Agency Partners:

SBIR/STTR Agency Partners