TECHNOLOGY SUMMARY

Our wireless chipset design solves the problem of securing power low IoT edge devices with minimal latency and high in network node densification. Our solution complements other cybersecurity measures employ at customers sites and seamless coexists within LTE 4G/5G networks and WiFi hot spots.

AREA/MATURITY/AWARDS

Primary Application Area: Electronics, Sensors, Communications

Technology Development Status: Proven Manufacturability

Technology Readiness Level: TRL 6

Vetted Programs/Awards: We are a portfolio company of Silicon Catalyst and recent graduate of the Army Applied SBIR Accelerator. Member of the Mitre Engenuity Semiconductor Alliance by invitation. Contribution member of Semiconductor Alliance Position Paper to be released. Army xTech Prize

SHOWCASE SUMMARY

Organization Type: Early-stage Startup (Seed)

Website: https://espretech.com

Showcase Booth: 426T

MARKET KEYWORDS

Market Keywords: smart city & mobility, smart buildings, public safety wireless monitoring & alert