Daniel Schmidt is a Senior Engineer at IBM Research in Albany, NY and leads metrology developments for next generation semiconductor manufacturing. He received his undergraduate degree in Microsystems Technology in Germany and earned a PhD in Electrical Engineering from the University of Nebraska-Lincoln in 2010. After three years of postdoctoral research, he accepted a position as Senior Research Fellow at the National University of Singapore. In 2016, he left academia to start an industry career at GlobalFoundries before joining IBM Research in 2018. Daniel is the author or co-author of 100+ conference papers, 60+ journal articles, and three book chapters. He is a founding member of the Spectroscopic Ellipsometry Technical Group at AVS and serves as a committee member and session chair at SPIE.