Development of a Low Thermal Expansion POSS Nanocomposite Resin for SLA 3D Printing of Aerospace Components

M.A. Sufian, J.S. Tate
Texas State University,
United States

Keywords: POSS, stereolithography (SLA), nanocomposite resin, coefficient of thermal expansion (CTE), mechanical properties

Summary:

Stereolithography (SLA) 3D printing provides excellent dimensional precision, surface finish, and can create complex geometries. However, its photopolymer resins often suffer from high thermal expansion, leading to performance issues in applications subjected to temperature variations. In this research, we study the incorporation of Polyhedral Oligomeric Silsesquioxanes (POSS) nanoparticles into SLA resin to significantly reduce its coefficient of thermal expansion (CTE). POSS, known for its rigid inorganic core, enhances thermal stability while maintaining the resin’s printability. The resulting nanocomposite is expected to align the CTE of the resin more closely with metallic coatings like nickel, used for durability and surface finishing, thereby minimizing internal stresses during thermal cycling in harsh environments, such as those encountered in space applications. Mechanical properties, including tensile and flexural strength, will also be evaluated to ensure no degradation in structural performance. SEM will be used to analyze nanoparticle dispersion, while TGA and DSC analysis will be done to assess thermal properties. This study aims to create a balance between reduced thermal expansion and mechanical integrity, making the way for more durable 3D-printed components for aerospace parts such as antenna brackets, sensor mounts, etc.