E. Li
SiliconCore Technology, Inc.,
United States
Keywords: MicroLED, CMOS, light processing unit, LPU, LED driver, μLED
Summary:
1. Market Demand: In the area of AI and AR, there is a strong demand for high speed, low power, small form factor, and low-cost light sources. We see a technology breakthrough is possible to solve for this demand, specifically in furthering development around μLED (MicroLED). In the area of AI, the power consumption in the communication area between servers, or between GPU and memory, are becoming the limiting factor of AI computing. MicroLED is perfect to meet this market demand since Micro LED is more energy efficient, a smaller form factor and much lower cost than laser. In addition, the switching speed while is lower than laser can be compensated with various LED communications. In the area of AR, Micro LED has much higher brightness at the same power level than any other display device and can also achieve much smaller form factors. High speed switching can also provide much higher dynamic range than other displays, for display of imagery that is closer to reality. 2. Problems need to be solved: we propose a light processing unit(commonly referred as LED driver) to be developed that can convert extremely high bandwidth data from electrical signal to optical signal in good fidelity and a low power fashion. We see a new method of integration between Micro LED and LED driver CMOS chip to be developed. This new method is to be robust and low cost and will be fault tolerant to take into account dead pixel possibilities during the manufacturing process. 3. Proposal to solve the problem: Light Processing Unit design proposal is based on SiliconCore Technology’s deep understanding of LED behavior and deep IP portfolio in driving LED. This development will solve problems for both AI and AR. A new architecture for AI which integrates very high speed interface IP with combined bandwidth of 1 Tera Bit per second and sophisticated fault tolerant LED driving circuitry will be developed to solve the problem of AI communication. A similar architecture for AR which integrates a low power video processing engine and zero frame delay fault tolerant LED drivers will be developed to solve the problem for AR. A new integration method between μLED and LPU silicon will also be developed. 4. Opportunity: A new enabling chip level solution enables deployment in AI and AR, tremendously reducing the cost and power consumption of communication and display to enable wide spread adoption of AI and AR capabilities for consumers. SiliconCore plans to develop this technology in the US and pursue to the greatest extent US manufacturing to initiate more competitive display solutions outside of Asia. By developing proprietary IP in both design and manufacturing, a significant barrier to entry will be established to compete well with foreign competitors.