TECHNOLOGY SUMMARY

Leveraging meta-surface optics, we use holograms to simultaneous fabricate conductors and insulators with sub-micrometer resolution on the minute scale for advanced semiconductor packaging

AREA/MATURITY/AWARDS

Primary Application Area: Electronics & Microsystems

Technology Development Status: Prototype

Technology Readiness Level: TRL 4

SHOWCASE SUMMARY

Organization Type: Startup Technology Company

Website: https://Not.Applicable.com

MARKET KEYWORDS

Market Keywords: Advanced Packaging, Heterogenous Integration, Co-packaged Copper/Optics