JUNE 9-11, 2025 | AUSTIN, TX
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  INNOVATION AND  
COMMERCIALIZATION COMMITTEES



Corporate & Investment Committee

3M 
AGC 
Arkema 
Armstrong 
Atrium Capital 
Bemis 
Boeing 
BPT Pharmaceuticals 
Corning 
Covestro 
DharmaGrowth 
Dow Chemical 
Eastman 
Emerald Technology Ventures 
Energizer 
Envia Systems 
ExxonMobil 
Ford Motor Company 
Henkel 
In-Q-Tel 
Lockheed Martin 
Magna 
NanoDimension AG 
NICDP-Saudi Arabia 
Novartis 
Owens Corning 
Pangaea Ventures 
Philips 
Praxair 
Product Genesis 
QUEST Integrated 
Roche 
Rockport Capital 
SABIC 
SABIC Ventures 
Sensor Films 
Sherwin Williams 
Sofinnova Partners, France 
The Livingston Group 
United Technologies Research Corporation 
Wacker 


Innovation Committee

Arizona State University 
Boston University 
CaramelTech-Mexico 
École Polytechnique Fédérale de Lausanne (EPFL) 
Georgia Tech 
Hong Kong Polytechnic University 
Imperial College-London 
Tufts University 
Univ. of California - Irvine 
Univ. of California - Los Angeles 
Univ. of California - Santa Barbara 
Univalor 
Univ. of Minnesota 
Univ. of Notre Dame 
Univ. of Waterloo 
Univ. of Wisconsin-Madison 
Wisconsin Alumni Research Foundation (WARF) 
Yale University 

Technical Program Co-Chairs

Matthew Laudon, TechConnect Division, ATI
Bart Romanowicz, TechConnect Division, ATI
Dalia Yablon, TechConnect Division, ATI


Founding Advisory Committee

Wolfgang Bacsa, University of Toulouse 
Lynn Foster, Z-Field Technologies LLC 
Lisa E. Friedersdorf, Office of Science and Technology Policy, The White House, US 
Srinivas Iyer, Los Alamos National Laboratory 

Chris Menzel, Chris Menzel Engineering Design 
Brent Segal, Lockheed Martin 
William (Cy) Wilson, NASA Langley Research Center 
Xing Zhou, Nanyang Technological University, Singapore 


Organizing Committee

Wolfgang Bacsa, University of Toulouse, France 
Tim Barckholtz, ExxonMobil, US 
John Barnes, The Barnes Global Advisors, US 
Amelia Campbell, Oak Ridge National Laboratory, US 
Sehoon Chang, Aramco Services Company, US 
Jeannine Coburn, Worcester Polytechnic Institute, US 
Liam Collins, Oak Ridge National Laboratory, US 
Jaydeep Deshpande, Commonwealth Fusion Systems, US 
Xiangyang Dong, Arizona State University, US 
Alison Fritz, National Energy Technology Laboratory, US 
Slade Gardner, Big Metal Additive, US 
Peter Grutter, McGill University, Canada 
Imre Gyuk, U.S. Department of Energy, US 
Jan-Willem Handgraaf, Siemens Digital Industries Software, Netherlands 
Greg Haugstad, University of Minnesota, US 
Santa Jansone-Popova, Oak Ridge National Laboratory, US 
Jim Johnston, Victoria University of Wellington, New Zealand 
Mandakini Kanungo, Corning, Inc., US 
Jason Killgore, National Institute of Standards and Technology, US 
R. Joseph Kline, National Institute of Standards and Technology, US 
John Kopasz, Argonne National Laboratory, US 
Piotr Kulczakowicz, Quantum Startup Foundry, US 
Matt Kweon, ExxonMobil, US 
Yuming Lai, The Dow Chemical Company, US 
Qilin Li, Rice University, US 
Arnie Lumsdaine, Oak Ridge National Laboratory, US 
Joey Mead, University of Massachusetts, Lowell, US 
Chris Menzel, Chris Menzel Engineering Design, US 
Prakash Nallathamby, Notre Dame University, US 

Sang Nam, George Mason University, US 
Christina Newcomb, Stanford University, US 
Alex Norman, Princeton University, US 
Kwang Oh, University at Buffalo (SUNY), US 
Andriy Palasyuk, Ames National Laboratory, US 
Simona Patange, National Institute of Standards and Technology, US 
Derek Patton, University of Southern Mississippi, US 
Martin Poitzsch, Aramco Services Company, US 
Elena Polyakova, G6 Materials Corp., US 
Carlos Quiroz, Sandia National Laboratories, US 
Yuanqiao Rao, The Dow Chemical Company, US 
Daniel Schmidt, IBM, US 
Maksim Shivokhin, ExxonMobil, US 
Christopher Sims, National Institute of Standards and Technology, US 
Kenan Song, Arizona State University, US 
Erik Spoerke, Sandia National Laboratories, US 
Chris Stafford, National Institute of Standards and Technology, US 
Anirudha Sumant, Argonne National Laboratory, US 
Halil Tekinalpm, Oak Ridge National Laboratory, US 
Loucas Tsakalakos, Coherent Inc, US 
Shruti Venkatram, 3M, US 
Thomas Webster, Interstellar Therapeutics, US 
William "Cy" Wilson, NASA Langley Research Center, US 
Yiliang Wu, CollTech North America, US 
Dalia Yablon, SurfaceChar LLC, US 
Helen Zha, Rensselaer Polytechnic Institute, US 
Lin Zhao, The Dow Chemical Company, US 
Junyong Zhu, U.S Department of Agriculture, US 


Review Committee

Wolfgang Bacsa, University of Toulouse, France 
Tim Barckholtz, ExxonMobil, US 
John Barnes, The Barnes Global Advisors, US 
Osman Basaran, Purdue University, US 
Alex Belianinov, Sandia National Laboratories, US 
Jean Berthier, University of Washington Seattle, US 
Scott Broderick, University at Buffalo-SUNY, US 
Samuel Brunner, Swiss Federal Laboratories for Materials Science and Technology, Switzerland 
Ameilia Campbell, Oak Ridge National Laboratory, US 
Sehoon Chang, Aramco Services Company, US 
Nitin Chopra, AdMatIX LLC, US 
Matt Clancy, UltraTech, US 
Jeannine Coburn, Worcester Polytechnic Institute, US 
Liam Collins, Oak Ridge National Laboratory, US 
Jaydeep Deshpande, Commonwealth Fusion Systems, US 
Xiangyang Dong, Arizona State University, US 
Alison Fritz, National Energy Technology Laboratory, US 
Slade Gardner, Big Metal Additive, Inc, US 
Joamin Gonzalez-Gutierrez, Luxembourg Institute of Science and Technology (LIST), Luxembourg 
Shubhodeep Goswami, GE Global Research, US 
Peter Grutter, McGill University, Canada 
Imre Gyuk, U.S. Department of Energy, US 
Johannes Hachman, University at Buffalo, SUNY, US 
Jan-Willem Handgraaf, Siemens Digital Industries Software, The Netherlands 
Greg Haugstad, University of Minnesota, US 
Andreas Hieke, Stanford University, US 
Santa Jansone-Popova, Oak Ridge National Laboratory, US 
Jim Johnston, Victoria University of Wellington, US 
Erina Joyee, University of North Carolina Charlotte, US 
Mandakini Kanungo, Corning, US 
Jason Killgore, National Institute of Standards and Technology, US 
R. Joseph Kline, National Institute of Standards and Technology, US 
John Kopasz, Argonne National Laboratory, US 
Piotr Kulczakowicz, University of Maryland, US 
Matt Kweon, ExxonMobil, US 
Yuming Lai, The Dow Chemical Company, US 
Patrick Lee, University of Toronto, US 
Yuhan Lee, Harvard Medical School, US 
Sang-Young Lee, Yonsei University, US 
Qilin Li, Rice University, US 

Arnie Lumsdaine, Oak Ridge National Laboratory, US 
Joey Mead, University of Massachusetts, Lowell, US 
Chris Menzel, Chris Menzel Engineering Design US 
Moein Moghimi, Newcastle University, US 
Sven Mumme, U.S. Department of Energy, US 
Prakash Nallathamby, University of Notre Dame, US 
Sang Nam, George Mason University, US 
Christina Newcomb, Stanford University, US 
Alex Norman, Princeton University, US 
Kwang Oh, University at Buffalo (SUNY), US 
Andriy Palasyuk, Ames Laboratory, US 
Simona Patange, National Institute of Standards and Technology, US 
Derek Patton, University of Southern Mississippi, US 
Martin Poitzsch, Aramco Research Center-Boston, US 
Elena Polyakova, G6 Materials Corp. US 
Zhiyuan (Zach) Qian, Modern Meadow, US 
Carlos Quiroz, Sandia National Laboratories, US 
Yuan Qiao Rao, The Dow Chemical Company, US 
Robert Rudd, Lawrence Livermore National Laboratory, US 
Jonathan Saathoff, ExxonMobil, US 
Daniel Schmidt, IBM, US 
Neeraj Sharma, 3M Corporate Research Laboratory, US 
Maksim Shivokhin, ExxonMobil, US 
Ginger Sigmon, Energy Frontier Research Center, US 
Christopher Sims, National Institute of Standards and Technology, US 
Emilie J Siochi, NASA Langley Research Center, US 
Kenan Song, Arizona State University, US 
Erik Spoerke, Sandia National Laboratories, US 
Chris Stafford, National Institute of Standards and Technology, US 
Anirudha Sumant, Argonne National Laboratory, US 
Halil Tekinalpm, Oak Ridge National Laboratory, US 
Loucas Tsakalakos, Coherent Inc., US 
Shruti Venkatram, 3M, US 
YuHuang Wang, University of Maryland, US 
Thomas Webster, Miraki Innovations, US 
William (Cy) Wilson, NASA Langley Research Center, US 
Yiliang Wu, CollTech North America, US 
Dalia Yablon, SurfaceChar LLC, US 
Helen Zha, Rensselaer Polytechnic Institute, US 
Lin Zhao, The Dow Chemical Company, US 
Junyong Zhu, U.S Deparment of Agriculture, US 


Conference Operations Manager

Sarah Wenning, TechConnect Division, ATI, USA

If you have interest in serving on a committee, please contact Jennifer Rocha jrocha@techconnect.org.

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