The TechConnect World Advanced Engineering Materials symposium will feature materials that are ready for commercial application. We will also spotlight new research and development: Innovative technologies, materials, and approaches that could provide game-changing increases in performance in engineering applications. Please submit an abstract and plan to join innovators from industry, academic and government laboratories around the world at this important event. 

Submit Abstract - due January 24 »

Please first review the information for authors — abstract submission guidelines.

Select Topic / Application AreaAdvanced Engineering and Aerospace MaterialsNanomaterialsComposite MaterialsEnergy Storage & Light Harvesting MaterialsCeramics & Silicate MaterialsMagnetic MaterialsRecovery and Recycling of Metals & MaterialsMaterials in Environmental Protection & RemediationOtherGo