JUNE 9-11, 2025 | AUSTIN, TX
View Co-Located Events






 





  Materials Characterization & Imaging  


This year's symposium will focus on innovations in nanoscale materials characterization including new method development as well as industry-specific applications. Submissions are also invited for special sessions focused on machine learning for materials characterization and imaging (in conjunction with the AI TechConnect Conference); and on industrial applications of x-ray scattering methods.

Submit Poster Abstract - due December 17 »

Please first review the information for authors — abstract submission guidelines.


Topics & Application Areas
  • User facilities for industrial participation
  • Advances in image analysis
  • Characterization of real-world systems
  • Machine learning for Characterization
  • Other
 

Symposium Co-Chairs


Greg Haugstad

Greg Haugstad

Technical Staff Member & Director, Characterization Facility (CharFac)

University of Minnesota

Dalia Yablon

Dalia Yablon

Technical Program Chair

TechConnect World Innovation Conference


Alex Norman

Alex Norman

Executive Director

Princeton Materials Institute, Princeton University



 
Back to Top ↑

2024 Symposium Sessions

Monday June 17

4:00Material Characterization & Imaging - Posters

2024 Symposium Program

Monday June 17

4:00Material Characterization & Imaging - PostersExpo Hall BC
Reactive accelerated aging as a novel in vitro method for degradation studies of polymer materials
A. Schadenhofer, J. Körner, Leibniz University Hannover, DE
Analytical techniques for soft-solid characterization
G.J.C. Braithwaite, J. White, Cambridge Polymer Group, Inc., US
Towards causal understanding of phenotypes and developmental anomalies
W. Tao, C. Keller, M. Hurtt, G. Srinivasa, R. Whitaker, M. Langham, University of Utah, US
....  
 

2024 SPONSORS & PARTNERS

2024 Sponsors & Partners
 

2024 SBIR/STTR AGENCY PARTNERS

2024 BIR/STTR Agency Partners
TechConnect at division of ATI

Produced by

TechConnect a division of ATI

© Copyright 2024 TechConnect. All Rights Reserved. Disclaimer | Privacy Policy | Terms of Use