MARCH 10-12, 2026 | RALEIGH, NC
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TechConnect World 2026 Program - Index of Affiliations

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Affiliation	Day	Presenter(s)	Talk title
Wake Forest University	T6.256	M. Makala, M. Barłóg, D. Dremann, S. Attar, E. G…	Suppressing Bias Stress Effects through Device Design and Side-Chain Engineering in n-Channel Organi…
Washington State University Vancouver	W6.604	H. Gao	Transformerless Paralleled Pulse-Width Modulated Current-Source Rectifier for Large-Scale Hydrogen P…
Waystone Technologies	W6.263	J. Fisher, M. Spence, T. Ulm	Modulated Electromagnetic Tracking and Localization (METAL™): Relative Navigation using Artificial…
We-Sensing LLC	T3.187	B. Li	"Plug-N-Forget" AI-powered Intelligent Miniature Sensor (AIMS) for Continuous in situ Wastewater Monitoring
Web Sensing LLC	T2.577	J. Brock	Space Accountability and Reporting Console (SPARC)
Weizmann Institute of Science	W2.725	N. Kampf, S. Gelman, I. Rosenhek-Goldian, M. Pato�…	Low-Resolution and Noisy Scanning Probe Microscopy Images Enhanced by Deep Learning
Weizmann Institute of Science	Th1.384	I. Rosenhek-Goldian, E.O. Zorikova, S. Chourasia, …	Structural and functional characterization of single mitochondria using atomic force microscopy
West Virginia University	T4.439	L. Xingbo	A next-generation solid-state hydrogen cell that protects itself from steam corrosion
West Virginia University	T3.486	N.A. Thieu, P. Gao, W. Li, S. Zhang, S. Chen, X. L…	Hybrid Metallic Cation−Anionic Surfactant Additive Regulating Interfacial Chemistry for High−Sta…
Wiconnect Global Corp	T4.415	M. Shahine	Photonic Chiplets for AI DataCenter Interconnects
Widener University	W3.342	H. Hashemi, B. Eslami	Comprehensive Analysis of Coupled Factors in Bimodal AFM: Optimization for Sensitive Imaging and Con…
Widener University	W3.362	M. Corey, B. Eslami	Decoding Thermal Gradients: Non-Destructive Quality Prediction in FDM 3D Printing Using BOS Imaging
Wolfpack Investor Network (WIN), North Carolina State University	T3.153	A. Phillips	Review Panelist
Wolfpack Investor Network (WIN), North Carolina State University	W3.631	A. Phillips	Review Panelist
Wolfspeed	T1.023	E. Balkas	Architecting the Future with Silicon Carbide: A Platform for Power, Intelligence, and Immersion
Wolfspeed	T2.503	C. Piard	Power Electronics
WovenStrong, LLC	W3.363	J.W. van Egmond	WovenStrong: 3D Ribbon Weaving for Advanced Drone and Airframe Manufacturing

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