Nanotech 2022

JUNE 13-15, 2022
WASHINGTON, DC


Advanced Materials for Engineering Applications

Advanced Materials for Engineering Applications

Submit your Abstract - due December 17

Please first review the information for authors — abstract submission guidelines.

 

Symposium Co-Chairs

Jim JohnstonJim Johnston
Professor, School of Chemical and Physical Sciences, Victoria University of Wellington, New Zealand

 

The TechConnect World Advanced Engineering Materials symposium will feature materials that are ready for commercial application. We will also spotlight new research and development: Innovative technologies, materials, and approaches that could provide game-changing increases in performance in engineering applications. Please submit an abstract and plan to join innovators from industry, academic and government laboratories around the world at this important event. 

 

Topics & Application Areas

  • Advanced Engineering and Aerospace Materials
  • Nanomaterials
  • Composite Materials
  • Energy Storage & Light Harvesting Materials
  • Ceramics & Silicate Materials
  • Magnetic Materials
  • Recovery and Recycling of Metals & Materials
  • Materials in Environmental Protection & Remediation
  • Other
 

Sponsor & Exhibitor Opportunities


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2021 TechConnect Sponsors & Partners
2021 TechConnect Sponsors & Partners