JUNE 9-11, 2025 | AUSTIN, TX
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  AI, Modeling, and Simulation  
for Advanced Materials Design  



Advanced manufacturing enables transfer of science and technology into new products and processes. It is particularly pertinent for technologically complex products and for the commercialization of advanced materials such as those highlighted at TechConnect World. This symposium focuses on challenges and success stories in technology development and highlights exciting new approaches to solving manufacturing challenges.

Submit Abstract - due December 17 »

Please first review the information for authors — abstract submission guidelines.


Topics & Application Areas
  • AI, Modeling & Simulation for Materials Design
  • Materials Informatics
  • Machine Learning
  • Autonomous Research Approaches
  • Quantitative Structure Property Relationship (QSAR) Methods
  • Data Science
  • Intersection of Simulation and Experimentation
  • Method Development
  • Battery Application
  • Sustainability Application
  • Other
 

Symposium Co-Chairs


Mat Halls

Mat Halls

Senior VP

Schrodinger



 
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2024 Symposium Sessions

Monday June 17

3:30AI-Accelerated Materials Design and Deployment Town Hall - Materials Genome Initiative (MGI)

Tuesday June 18

1:30AI Modeling & Simulation
4:00AI Modeling & Simulation - Posters

2024 Symposium Program

Monday June 17

3:30AI-Accelerated Materials Design and Deployment Town Hall - Materials Genome Initiative (MGI)Annapolis 3-4
Artificial intelligence (AI) has the potential to revolutionize the way we design, develop, and deploy new materials. This town hall will bring together industry leaders to discuss priorities and strategies for harnessing AI to accelerate materials innovation. Join us for a lively discussion on topics such as autonomous R&D, AI-enabled exploration of the vast materials design space, and opportunities for collaboration among industry, government, and academia.
Session chair: Lisa E. Friedersdorf, Office of Science and Technology Policy, US
Moderator
B. Segal, Lockheed Martin, US
Panelist
L. Lee, IBM Research (Zürich), CH
Panelist
S. Arturo, Dow, US
Panelist
C. Boswell-Koller, National Science Foundation, US
Panelist
E. Breckenfeld, NVIDIA, US

Tuesday June 18

1:30AI Modeling & SimulationChesapeake C
Session chair: Jan-Willem Handgraaf, Siemens, NL
Towards chemical foundation models for digital prediction of experimental measurements
E. Annevelink, Physics Inverted Materials, US
Utilizing Genetic Algorithms for Autonomous RF FEM Simulation & Optimization
V. Gjokaj, NuPhotonics LLC, US
Leveraging Physics-Based Simulations and Machine Learning to Identify Promising Formulations for Materials Science Applications
A.K. Chew, M.A.F. Afzal, A. Chandrasekaran, M.D. Halls, Schrödinger, US
When Can We Ignore Missing Data in Model Training?
C. Zhen, A. Singh, A. Termehchy, Oregon State University, US
Analyzing and optimizing CO2 geothermal energy production utilizing artificial intelligence – a deep basin approach
K. Katterbauer, A. Alhashboul, H. Chen, A. Yousef, Saudi Aramco, SA
Common Data Model to Rapidly Certify AM Parts with Reduced Inspection Leveraging AI / ML
D. Reed, J. Shah, W. Sobol, T. Kirk, A. Kitt, MxD USA, US
4:00AI Modeling & Simulation - PostersExpo Hall BC
The effect of moisture on the mechanical and thermophysical properties of the crosslinked network of the SU-8 photoresist.
A. Goldberg, A.R. Browning, T. Morisato, T. Vadicherla, M.D. Halls, Schrodinger, US
Finite Difference Simulation of Surface Smoothing Induced by Atomic Layer Etching
M.F. Leung, Pasadena City College, US
Using Advanced Hybrid Power Systems Controls for Precision Sustainment Through AI
D. Moorman, Moser Energy Systems, US
Estimating solid-liquid interfacial anisotropy using phase-field simulations and machine learning
G. Kim, S. Hyun, H. Ko, Korea Institute of Ceramics Engineering and Technology, KR
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