JUNE 13-15, 2022
WASHINGTON, DC

AI TechConnect
 

AI for Advanced Materials Design

Submit your Abstract - due January 14

Please first review the information for authors — abstract submission guidelines.

 

Symposium Co-Chairs

Rick RossRick Ross
Lead Research Specialist
3M Company

Jan-Willem HandgraafJan-Willem Handgraaf
Senior Technical Product Manager
Siemens Digital Industries Software

Key Speakers

 

Topics & Application Areas

  • AI, Modeling & Simulation for Materials Design
  • Materials Informatics
  • Machine Learning
  • Autonomous Research Approaches
  • Quantitative Structure Property Relationship (QSAR) Methods
  • Data Science
  • Other
 

Sponsor & Exhibitor Opportunities
 

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2021 Sponsors & Partners
 
2021 SBIR/STTR AGENCY PARTNERS
SBIR/STTR Agency Partners