TechConnect World 2023 Program - Index of Affiliations

Affiliation	Day	Presentation
C&G Hitech Co., Ltd.	T4.566	Stable uniform nanoparticle dispersion in composite materials for antibacterial food packaging
C&G Hitech Co., Ltd.	W4.489	Thermally Conductive Composite with High Mechanical Strength
Calico Biosciences	M8.988	Developing Biosensors for High Throughput Drug Screening against Muscular Dystrophy
Callentis Consulting Group	W2.247	Using Physics-Informed Machine Learning to Collect Road Conditions with Connected Vehicles
Carbon BioCapture LLC	T8.545	Biological Integrated Systems For Carbon Capture
Carbon Solutions	M4.443	Insights and Best Practices for Planning and Executing Geologic Sequestration Projects
Carnegie Mellon University	M4.441	Current and near-future decarbonization options for steelmaking
Chimeras	M8.464	Real-Time Intelligent Surveillance using Ethical Anomoly Detection
Chung-Ang University	T4.702	Sensitive POC (point-of-care) system to detect virus from the environmental and fecal samples using graphene o…
Chung-Ang University	T8.262	Core–Satellite–Satellite Hierarchical Nanostructures: Assembly, Plasmon Coupling, and Gap-Selective Surfac…
Chungnam National University	T8.261	2-D Pd-cellulose with optimized morphology for the effective solar to steam generation
Cirrus Materials Science	M4.482	A Novel Process of Plating on Polymer Substrates
CollTech	W4.562	How to Make Flexible Printed Circuits More Reliable
Columbia University	T8.321	Cerium Separation from Energy-Relevant Elements with Structured Ligands
Columbia University	T8.322	Development of Ligand-based Hybrid Systems to Sustainably Recover Energy-Relevant Metals from Unconventional R…
Columbus Nanoworks	M8.981	Quantum-based sensing of biomolecules using fluorescent nitrogen vacancy-center nanodiamonds
Concurrent Technologies Corporation	M4.243	High Temperature Rare Earth Element (REE) Extraction Technology
Cornell High Energy Synchrotron Source, Cornell University	M2.225	Art of the Possible: High Energy Synchrotron X-Ray Radiation for Mine Tailings Characterization in Re-mining O…

TechConnect World 2023 Program - Index of Affiliations

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