JUNE 19-21, 2023

Special Symposium: CHIPS R&D — Challenges and Opportunities


Submit your Early Bird Abstract for a 15% reg discount - due December 16

Please first review the information for authors — abstract submission guidelines.

Symposium Co-Chairs

Dalia YablonDalia Yablon
Technical Program Chair
TechConnect World Innovation Conference

Alex NormanAlex Norman
Executive Director
Princeton Institute of Materials

Joe KlineJoe Kline
Project Leader


Key Speakers

Daniel SchmidtDaniel Schmidt
Metrology Engineer

David HenshallDavid Henshall
VP of Business Development

Roya LahijiRoya Lahiji

Wei Ting ChenWei Ting Chen

Xiaoting GuXiaoting Gu
Senior Manager
Thermo Fisher Scientific


With passage of the 2022 CHIPS for America Act, the US government is making a $50 billion investment to catalyze long-term growth in the domestic semiconductor industry in support of US national and economic security. A significant portion of this funding - $11 billion – goes towards R&D initiatives to create a network of innovation in the US semiconductor ecosystem.

This symposium will focus on 3 target areas identified as critical to the R&D initiatives:

  1. Metrology and characterization needs for leading-edge CMOS and beyond CMOS technologies including 3D devices for logic and memory
  2. Measurements for advanced packaging/3D heterogeneous integration
  3. Material purity and quality – requirement and challenges for the semiconductor industry as contamination and purity standards continue to become more strict.

*This symposium gathers experts to discuss research challenges and opportunities associated with the recently passed CHIPS act, but it is not an official activity by or related to the US CHIPS office.

Topics & Application Areas
  • Advanced metrology
  • Advanced Packaging
  • Material purity and quality
  • Workforce development
  • In-line process characterization
  • Visualization and automation
  • Other

Sponsor & Exhibitor Opportunities

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Sponsors & Partners
SBIR/STTR Agency Partners