AI Innovation

Speakers and Chairs Include:

Nobuyuki Matsuzawa

Panasonic Industry Co

Jan-Willem Handgraaf

Siemens Digital Industries Software

Dalia Yablon

TechConnect World Innovation Conference

Boris Kozinsky

Harvard University

Michael Webb

Princeton University

Timothy Gardner

Cambium

Sak Arumugam

Ansys

Michael Rauch

Schrödinger

Technical Symposia

Back to Top ↑ Sessions
	Monday June 9
8:30	TechConnect World Innovation Conference - Plenary Keynotes
10:30	TechConnect Innovation Spotlights: AI, Data, Cyber I
11:30	TechConnect Innovation Spotlights: AI, Data, Cyber II
1:15	TechConnect Innovation Spotlights: Aerospace, Space and Defense I
1:30	Emerging Methods for Materials Design with Artificial Intelligence I
4:00	AI for Materials Design - Posters
	Tuesday June 10
8:00	TechConnect World Innovation Conference - Plenary Keynotes
9:30	Emerging Methods for Materials Design with Artifical Intelligence II
11:30	TechConnect Innovation Spotlights: AI, Data, Cyber III
4:00	AI Innovations - Posters
	Wednesday June 11
9:00	AI Innovations

Detailed Program
	Monday June 9

8:30	TechConnect World Innovation Conference - Plenary Keynotes	Lone Star E
	Session chair: Jennifer Rocha, Dalia Yablon, Matthew Laudon, TechConnect Division, ATI, US
	Welcome to TechConnect M. Laudon, TechConnect Division, ATI, US
	TechConnect Overview: Connecting Research, Accelerating Innovation D. Yablon, J. Rocha, TechConnect Division, ATI, US
	The nexus of materials, energy, and carbon dioxide—and how science, technology, and market development can impact it M. Pasquali, Rice University, US
	Future Technologies Based on Mimicking Nature with Controls of Charge, Spin, and Heat P. Weiss, University of California, Los Angeles, US
	Accelerating Innovation through America’s Seed Fund F. Salomone, Office of Innovation and Investment, Small Business Administration, US

10:30	TechConnect Innovation Spotlights: AI, Data, Cyber I	Lone Star B
	Session chair: Emma Mooney, TechConnect Division ATI, US
	BleedIO Tech owns the only edge-based SaaS written for the new BLE Mesh standard. S. Podolski, BleedIO Tech, US
	Finite-element-based physics-informed neural networks for surrogate modeling R. Sills, Rutgers University, US
	MISTO - City as a Service Platform B. Ostpiuk, MISTO, UA
	Computer Vision Enabled Time & Motion Analysis A. Sharotry, Texas State University, US
	IRONCLAD: Integrated Resilient Operations for Naval Cloud and AI Deployments B. Jones, Colvin Run Networks, US
	Review Panelist R. Roley, Battelle, US
	Review Panelist T. Fowler, US STRATCOM, US
	Review Panelist TBA, DIU, US
	Review Panelist N. Wendt, Acme General, US
	Review Panelist R. Julian, BOKA Capital, US

11:30	TechConnect Innovation Spotlights: AI, Data, Cyber II	Lone Star B
	Session chair: Emma Mooney, TechConnect Division ATI, US
	ZenLight: AI-powered Learning Assistant for Everyone L. Bhat, iZen ai, Inc., US
	Walacor Data Platform L. George, Walacor Corporation, US
	Accelerated Data Processing / Computing and data preparation for AI workloads C. Dunham, Voltron Data, US
	Data Center Cooling Module D. Mallin, Stanford University - Office of Technology Licensing, US
	Cofactr's DocAI P. Gulley, Cofactr, US
	Review Panelist L. Manning, Cross Timber APEX, US
	Review Panelist R. Roley, Battelle, US
	Review Panelist T. Fowler, US STRATCOM, US
	Review Panelist TBA, DIU, US
	Review Panelist N. Wendt, Acme General, US

1:15	TechConnect Innovation Spotlights: Aerospace, Space and Defense I	Lone Star C
	Session chair: Alicia Boyd, TechConnect Division ATI, US
	Suncase 605 P. Shmotolokha, New Use Energy Solutions, US
	Quantum Quantum Resilient Identity and Access Management S. Moorhead, Lastwall, US
	Passive Ultra-Broadband Single-Photon Imaging M. DiPaul, University of Toronto, CA
	3D Fiber Tethering (3DFiT) for High-Performance Drone Frames K. Fu, University of Delaware, US
	AI-baseed reskilling platform for new jobs in Critical Industries, including Energy and Manufacturing K. Solomatina, PowerTechs, Inc, US
	Review Panelist J. Epstein, Lockheed Martin, US
	Review Panelist M. Augustine, Boeing, US
	Review Panelist J. Bindra, University of Ottawa, CA
	Review Panelist S. Vohnout, OppsSpot LLC, US

1:30	Emerging Methods for Materials Design with Artificial Intelligence I	Room 311
	Session chair: Michael Rauch, Schrodinger, US
	Multiscale machine learning accelerates materials computations B. Kozinsky, Harvard University, US
	Complex Polymer Design in the Age of AI: What, How, and Why? M.A. Webb, Princeton University, US
	Towards Complex Materials Development: Integration of Physics-Based and Machine Learning Approaches E.M. Collins, K.B. Moore, H. Abroshan, D. Giesen, M.D. Halls, A. Chandrasekaran, Schrödinger, Inc., US
	CAMINNO Gen6: Enhancing Advanced Manufacturing for High-Tech Applications with Digital Twins and Scientific Machine Learning A. Stein, CAMINNO, Inc., US

4:00	AI for Materials Design - Posters	JW Grand Ballroom
	Model Based Iterative Reconstruction (MBIR) X-Ray computed tomography for nano-micro characterization of complex biological structures A.F.D. Ornelas, J. Lipp, C. Bouman, G. Buzzard, M. Ostendorf, V. Roman, J. Roth, D. Kisailus, S. Farajollahi, AFRL, US
	Closing the Gap Between Theory & Experiment: A Retrosynthesis Platform for Inorganic Solids M.J. McDermott, Newfound Materials, US
	Tuesday June 10

8:00	TechConnect World Innovation Conference - Plenary Keynotes	Lone Star E
	Session chair: Jennifer Rocha, Dalia Yablon, Matthew Laudon, TechConnect Division ATI, US
	National Health Security Innovation Initiatives M. Stebbins, Advanced Technology International (ATI), US
	Fireside Chat with DARPA - Jennifer Thabet, DARPA & Jennifer Rocha, TechConnect/ATI J. Thabet, DARPA SBIR/STTR, US
	SBIR Reauthorization Briefing J. Williams, SBIRC, US

9:30	Emerging Methods for Materials Design with Artifical Intelligence II	Room 311
	Session chair: Nobuyuki N. Matsuzawa, Panasonic, US
	Direct Inverse Analysis of Machine Learning Models for Desings of Molecules, Materials, and Processes H. Kaneko, Meiji University, JP
	Designing extreme-performance materials for air, land, sea and space with advanced computation T. Gardner, Cambium, US
	Revolutionizing Materials Science: Accelerating Discovery and Innovation with LQMs T. Mustard, T. Sours, A. Singh, O. Allam, M. Cormier, A. Xiao, SandboxAQ, US
	Surrogate modeling with finite-element-based physics-informed neural networks R.B. Sills, P. Sunil, M. Vasoya, Rutgers University, US
	Better Together: Combining Machine Learning and Physics-Based Models to Accelerate Product Development S.D. Edkins, Citrine Informatics, US
	Reactivity of Detached XLi₆ Nanoclusters with SEI Components: A Computational Framework for Lithium-Ion Battery Stability F.A. Soto, The Penn State University-Harrisburg, US
	Applying Artificial Intelligence (AI) to build new generation gas sensors to positively impact society R.A. Potyrailo, S. Shan, T. Wang, GE Vernova Advanced Research Center, US

11:30	TechConnect Innovation Spotlights: AI, Data, Cyber III	Lone Star C
	Session chair: Alicia Boyd, TechConnect Division ATI, US
	BIFROST Digital Thread Enabler S. Flanagan, Integration, Innovation Inc. (i3), US
	SKY-RAG -Semantic Knowledge Graph Retrieval-Augmented Generation H. Alam, Al Asset Management LLC, US
	Deceptio.ai M. Carson, Deceptio.ai, US
	AI-Empowered Leak Detection and Localization for Intelligent Water System Management A. Kazeem, Case Western University, US
	Computer Vision AI that Digitizes Current and New Infrastructure in 4D A. Ruci, Nearabl Inc., US
	Review Panelist R. Roley, Battelle, US
	Review Panelist T. Fowler, US STRATCOM, US
	Review Panelist TBA, DIU, US
	Review Panelist R. Julien, BOKA Capital, US

4:00	AI Innovations - Posters	JW Grand Ballroom
	Task-specific Evaluation for Biomedical Large Language Models (LLMs) for the HealthCare Industry A. Dutta, Texas State University, US
	Harnessing AI: Bridging the Gap Between Innovators and Federal Grant Opportunities K.M Cooper, V Palermo, Grant Management Associates, US
	Robust and Portable Performance Datasets for HPC with Generative AI M. Ali, A. Qasem, Texas State University, US
	Large Language Models for High-Performance Computing Z. Sadman, A. Qasem, Texas State University, US
	Dynamic Data and AI driven Healthcare Billing Audit Framework T. Ekin, L. Shaw, Texas State University, US
	RoadRating: Realtime Safety Scoring of the Travel Paths S. Das, Texas State University, US
	Wednesday June 11

9:00	AI Innovations	Room 304
	Session chair: Jan-Willem Handgraaf, Siemens, US
	From Imagination to Experimentation to Full Scale Adoption: How to ensure a successful Generative AI Project J. Hogan, SHI International Corp., US
	Real-Time Data, Real-Life Impact: Halite Medical's AI Solution for Emergency Care R. Wong, D. Sharrock, S. Hickey, Halite Medical, US
	LifeLensAR: AI-Driven Voice Recognition and Assisted Reality for Streamlined Nursing Documentation in Long-Term Care C. Lewis, A. Lehman, M. Schaffner, I. Wang, A. Andoy, 360 Social Impact Studios, US
	From Digital Thread to Physical Thread: Traceability through procurement, manufacturing, integration, and deployment E.W. Dodd, Cofactr, US
	Generative AI to Accelerate Manufacturing Supply Chains Z. Tschirhart, Sustainment, US
	STUDENT ABSTRACT WINNER Transforming Healthcare with AI: Security and Privacy in Remote AI-Enabled Stethoscopes S. Kumar, W. Glenewinkel, A. Singh, Texas A&M University, US
	A Physics Informed Gaussian Process Model for Real-time Simulation of Tire-Terrain Interactions S.A. Kowshik, A. Srinivasa, J.N. Reddy, Texas A and M University,, US
	Safeguarding Media Integrity from the Growing Thread of Generative AI J. DeGol, Steg.AI, US

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