Semiconductor Industry - Challenges and Opportunities

JUNE 9-11, 2025 | AUSTIN, TX
View Co-Located Events

  Special Symposium:
Semiconductor Industry — Challenges
and Opportunities

This symposium will focus on 3 target areas identified as critical to the R&D initiatives in the semiconductor industry:

Heterogeneous integration and chiplet technology
SmartFab infrastructure for large scale data handling and more efficient operation
Emerging methods in metrology

Submit your Abstract - due April 4

Please first review the information for authors — abstract submission guidelines.

Topics & Application Areas

Heterogeneous integration and chiplet technology
SmartFab infrastructure for large scale data handling and more efficient operation
Emerging methods in metrology
Other

Symposium Co-Chairs

Dalia Yablon

Technical Program Chair

TechConnect World Innovation Conference

Alex Norman

Executive Director

Princeton Materials Institute, Princeton University

Dan Woodie

Director of micro/Nano Fabrication Center

Princeton University

2024 Key Speakers Included

Jeff Nelson

Director of Center of Integrated Technologies,

Sandia National Laboratories

Yevgeny Raitses

Principal Research Physicist,

Princeton Plasma Physics Lab

Robert Baseman

Senior Staff Member,

IBM

Chris Anderson

Vice President,

XLight, Inc.

Mike Young-Han Kim

CEO,

Gauss Labs

Ali Hallal

Application Manager and Senior Data Scientist,

Pollen Metrology, France

Back to Top ↑ Symposium Sessions
	Tuesday June 10
4:00	CHIPS & Microelectronics R&D - Posters
	Wednesday June 11
9:00	Microelectronics R&D

Symposium Program
	Tuesday June 10

4:00	CHIPS & Microelectronics R&D - Posters
	In-memory computing using ReRAM arrays for 2-bit and 3-bit multipliers J. Modasiya, M. Liehr, N. Cady, University at Albany, US
	Heterogeneous AI Inference Platform for Energy-Efficient Large Language Models S. Kim, S. Yi, Y. Jeong, C. Lee, C.S. Kim, Simplus Inc., US
	Next-Gen UART: A Low-Power, Multi-Protocol Communication Core for IoT Applications C.N.K. Choudary, C.T. Siddanth, Amrita Vishwa Vidyapeetham, IN
	design,development and integration of fabless system on chip G. Mamatha, V. Akshaya, jawaharlal technological university ananthapur, IN
	2-Mask NMOS (N-type Metal Oxide Semiconductor) Device Manufacturing, Design, & Fabrication For Workforce Development E. Saucedo, N. Palana, SAN JOSE CITY COLLEGE (MESA PROGRAM), US
	Digital Twins for Advanced Workforce Training and Semiconductor Manufacturing K. Hong, I. Jha, N. Vatanshenas, C. Lee, A. Sunkad, A. Ashcroft, A. Ahmadi, R. Dhar, H. Mandadi, R.D. Melara, J.J. Mosquera, P.K. Stout, UC Irvine, US
	A Review of Recent Advances in Heterogeneous Integration and Chiplet Technology M.H. Haidari, Erie community college, US
	Wednesday June 11

9:00	Microelectronics R&D
	Session chair: Dan Woodie, Princeton University, US
	Expanding Our Reach: Creating a Virtual Reality Semiconductor Educational Platform at the Cornell NanoScale Facility T. Pennell, J. Williamson, C. Fiore, K. Ionova, B. Lane, L. Rathbun, R. Olson, A. Godwin, J. Cha, Cornell University, US
	Equipping Students for CHIPS R&D and Manufacturing Engineering through Transformative Microfabrication Education M. Pleil, N. Jackson, University of New Mexico, US
	Room Temperature 2D/3D Heterojunction Rectifiers Through Integration of Monolayer n-MoS2 With p-type Boron Doped Diamond A. Wali, R. Padhan, R. Divan, P. Darancet, N. Pradhan, A.V. Sumant, Argonne National Laboratory, US
	FAIDES: Strategic Partnership for Technological and Sustainable Leadership D. Schulz, Fortis Alliance para Inovação, Defesa Tecnológica e Sustentabilidade Estratégica (FAIDES), BR