TechConnect World 2019
 

Electronics & Microsystems - Program Highlights

Abstracts due: December 14 »

Join industry partners and applied research leadership accelerating the development and deployment of advanced electronics solutions into products and society.


2019 Featured Speakers:

 Yiliang WuYiliang Wu
TE Connectivity, US

William (Cy) Wilson William (Cy) Wilson
Fujifilm Dimatix, Inc., US

Chris MenzelChris Menzel
Fujifilm Dimatix, Inc., US

Cyrus HirjibehedinCyrus Hirjibehedin
MIT Lincoln Labs. US

 Junhong MinJunhong Min
Chung-Ang University, Korea


Jyrki SaarinenJyrki Saarinen
University of Eastern Finland, Finland



Kwang W. OhKwang W. Oh
University at Buffalo (SUNY)


Leslie YeoLeslie Yeo
RMIT University, Australia
Loucas TsakalakosLoucas Tsakalakos
GE Global Research


Mandakini Kanungo Mandakini Kanungo
Corning, Inc., US


Martin PoitzschMartin Poitzsch
Aramco Research Center, US

Mehmet TonerMehmet Toner
Harvard Medical School, US

Michael McConney Michael McConney
Wright-Patterson AFB, US

Rohit KarnikRohit Karnik
MIT, US


Ronald A. CoutuRonald A. Coutu
Marquette University, US
Sefa DagSefa Dag
Globalfoundries, US
Thomas ThundatThomas Thundat
University at Buffalo (SUNY), US

Tim SwagerTim Swager
MIT, US

William P PartridgeWilliam P Partridge
Oak Ridge National Laboratory, US

Kwang W. OhKwang W. Oh
University at Buffalo (SUNY)




2500
S&T Speakers

250
Exhibitors

1000
Prospectors

2000
Innovators

2500
1-on-1 Meetings


2019 Key Speakers Include:

  • Sefa Dag, Globalfoundries, US
  • Ronald A. Coutu, Marquette University, US
  • Cyrus Hirjibehedin, MIT Lincoln Labs. US
  • Mandakini Kanungo, Corning, Inc., US
  • Rohit Karnik, MIT, US
  • Michael McConney, Wright-Patterson AFB, US
  • Chris Menzel, Fujifilm Dimatix, Inc., US
  • Junhong Min, Chung-Ang University, Korea
  • Kwang W. Oh, University at Buffalo (SUNY)
  • William P Partridge, Oak Ridge National Laboratory, US
  • Martin Poitzsch, Aramco Research Center, US
  • Jyrki Saarinen, University of Eastern Finland, Finland
  • Sameer R Sonkusale, Tufts University, US
  • Tim Swager, MIT, US
  • Thomas Thundat, University at Buffalo (SUNY), US
  • Mehmet Toner, Harvard Medical School, US
  • Loucas Tsakalakos, GE Global Research
  • William (Cy) Wilson, NASA, US
  • Yiliang Wu, TE Connectivity, US
  • Leslie Yeo, RMIT University, Australia
2018 Sponsors & Partners