Symposium Sessions | ||
Tuesday June 18 | ||
8:30 | Quantum Engineering Materials | |
10:30 | Metasurfaces for NextGen Devices | |
1:30 | Integrated Optical Devices | |
2:30 | Quantum Information Systems & Computation | |
Symposium Program | ||
Tuesday June 18 | ||
8:30 | Quantum Engineering Materials | 313 |
Session chair: William L. Wilson, Harvard University, US | ||
8:30 | The Center for Integrated Quantum Materials R.M. Westervelt, Harvard University, Center for Integrated Quantum Materials, US | |
9:00 | Quantum Engineering Materials and Devices in Cambridge W. Wilson, Harvard University, US | |
9:30 | Harvard Quantum Initiative E. Hu, Harvard University | |
10:30 | Metasurfaces for NextGen Devices | 313 |
Session chair: William L. Wilson, Harvard University, US | ||
10:30 | Synthesis and Integration of Two Dimensional Materials J. Kong, Massachusetts Institute of Technology, US | |
11:00 | Two dimensional materials for tunable quantum electronic and optical devices L. Ju, Massachusetts Institute of Technology | |
11:30 | Metasurface-enabled broadband achromatic optics W-T. Chen, F. Capasso, Harvard University, US | |
12:00 | Optical metasurfaces: From fundamental science to application R. Devlin, Metalenz, US | |
1:30 | Integrated Optical Devices | 313 |
Session chair: Bob Westervelt, Harvard University, US | ||
1:30 | Quantum Photonics with Diamond M. Loncar, Harvard University, US | |
2:00 | Thin-film lithium niobate for next generation integrated photonic circuits - when performance meets scalability M. Zhang, HyperLight, US | |
2:30 | Quantum Information Systems & Computation | 313 |
Session chair: Bob Westervelt, Harvard University, US | ||
2:30 | Introduction to Quantum Computing W. Oliver, MIT Lincoln Lab, US | |
2:55 | Enabling Technology for Beyond Intermediate Scale Quantum Computing Systems T.A. Ohki, Raytheon BBN Technologies, US | |
3:20 | Two-dimensional quantum materials for quantum technology K.C. Fong, Raytheon BBN Technologies, US | |
This special session will highlight innovation in quantum engineering materials and devices in both industry and academia in the Cambridge, MA area.
Submit Abstract » | due April 12 |
To receive announcements and news, please join our mailing list.