JUNE 19-21, 2023
WASHINGTON, DC

AI TechConnect
 

AI for Advanced Materials Design

Submit your Early Bird Abstract for a 15% reg discount - due December 16

Please first review the information for authors — abstract submission guidelines.

Symposium Co-Chairs

Shruti VenkatramShruti Venkatram
Materials Data Scientist
3M

Jan-Willem HandgraafJan-Willem Handgraaf
Senior Technical Product Manager
Siemens Digital Industries Software

2022 Key Speakers

Corinne LipscombCorinne Lipscomb
Strategic Operations Director
3M

Johannes HachmannThe Machine Learning Route to Accelerated Discovery and Inverse Design of Materials Systems
Johannes Hachmann
Associate Professor, University at Buffalo, SUNY

 
Topics & Application Areas
  • AI, Modeling & Simulation for Materials Design
  • Materials Informatics
  • Machine Learning
  • Autonomous Research Approaches
  • Quantitative Structure Property Relationship (QSAR) Methods
  • Data Science
  • Other
 

Sponsor & Exhibitor Opportunities
 

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Sponsors & Partners
 
2022 SBIR/STTR AGENCY PARTNERS
SBIR/STTR Agency Partners