AI Innovations

Symposium Co-Chairs

Dalia Yablon
Technical Program Chair
TechConnect World Innovation Conference

Sang Nam
Professor
George Mason University

This symposium highlights developments in AI, machine learning, data analytics and robotics that will enable multiple application areas. These innovations will have broad impact - but they will revolutionize manufacturing, advanced materials, biomaterials, and drug design and development - the focus areas for this conference. Submit an abstract describing your contributions to this exciting field and plan to join us in Washington DC in June.

Back to Top ↑ 2024 Symposium Sessions
	Monday June 17
3:30	AI-Accelerated Materials Design and Deployment Town Hall - Materials Genome Initiative (MGI)
	Tuesday June 18
9:15	Advanced Manufacturing Innovation
4:00	AI Innovations - Posters
	Wednesday June 19
9:00	AI Innovations

2024 Symposium Program
	Monday June 17

3:30	AI-Accelerated Materials Design and Deployment Town Hall - Materials Genome Initiative (MGI)	Annapolis 3-4
	Artificial intelligence (AI) has the potential to revolutionize the way we design, develop, and deploy new materials. This town hall will bring together industry leaders to discuss priorities and strategies for harnessing AI to accelerate materials innovation. Join us for a lively discussion on topics such as autonomous R&D, AI-enabled exploration of the vast materials design space, and opportunities for collaboration among industry, government, and academia.
	Session chair: Lisa E. Friedersdorf, Office of Science and Technology Policy, US
	Moderator B. Segal, Lockheed Martin, US
	Panelist L. Lee, IBM Research (Zürich), CH
	Panelist S. Arturo, Dow, US
	Panelist C. Boswell-Koller, National Science Foundation, US
	Panelist E. Breckenfeld, NVIDIA, US
	Tuesday June 18

9:15	Advanced Manufacturing Innovation	Chesapeake 1
	Session chair: Slade Gardner, Big Metal Additive, US
	Optimizing Graphene-Metal Composites Manufacturing Through Laser Photothermal Processing Modeling and Computation D. Espinoza, D. Coren, D. Colmanarez, P. Kang, M.A. Khan, George Mason University, US
	AI-assisted feedback to sheet metal stamping processes for automotive applications W. Halsey, D. Pokkalla, V. Paquit, R. Davies, L. Huang, A. Ilinich, W. Wu, K. Murali, L. Huang, K. Kannan, K. Li, S. Dev, S. Kim, Oak Ridge National Laboratory, US
	Quantum Cyber Trust Anchor: Authenticating and Tracking Physical Components M. Maasberg, I. Taylor, L.G. Butler, U.S. Naval Academy, US
	Defect Detection in ISC Cylinder Using Spoof Plasmon Polaritons W. Wilson, E. Tucker, NASA Langley Research Center, US
	The Electronic Alchemy eforge: An Innovation in the Multi-material 3D Printing of Functional Electronics C.M. Glenn, W. Chan, M. Whitely, L. Lassiter, Morningbird Space, US
	Digital Manufacturing for Production: Exploring Applications from Copper to Crowns M. Strobel, Quantica, DE

4:00	AI Innovations - Posters	Expo Hall BC
	Digital twin models developed by computer simulations and A.I. algorithms for real-time characterization of ceramic sintering process S. Hyun, J. Park, G-A Ryu, Y. Han, S. Baik, Korea Institute of Ceramic Engineering and Technology, KR
	Wednesday June 19

9:00	AI Innovations	Chesapeake C
	Session chair: Jan-Willem Handgraaf, Siemens, NL
	SPOC: A novel high-throughput screening platform that generates kinetic binding data for biological validation of AI-designed monoclonal antibodies to SARS-CoV-2 B. Takulapalli, C. Agu, R. Cook, W. Martelly, L. Gusghari, INanoBio Inc., US
	Autonomous Intelligent Architecture—Preliminary Results T.A. Duong and Q.D. Duong, Adaptive Computation LLC, US
	Robust Defect Detection for Binder Jet 3D Printing with Semi-Siamese Neural Networks Y. Niu, University of Connecticut, US
	AI-driven CO2 injection performance optimization for saline aquifers – Overcoming injection challenges for optimal CO2 sequestration K. Katterbauer, A. Alhashboul, H. Chen, A. Yousef, Saudi Aramco, SA
	Development of active prior learning system for experimental education using metaverse-based AI virtual human (Ailey) J. Oh, S.-H. Park, Soongsil University, KR