Join industry partners and applied research leadership accelerating the development and deployment of advanced electronics solutions into products and society.

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2024 Speakers and Chairs Included:

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2024 Sector Program - Electronics & Microsystems

Back to Top ↑ Sessions
	Monday June 17
8:30	TechConnect World Innovation Conference - Plenary Keynotes
10:00	CHIPS Workforce Development and Student Leaders Conference Internal Welcome and Networking (SLC Participants Only)
10:30	Space Based Manufacturing Value Proposition
10:30	CHIPS Workforce Development Program: Tutorial on the Semiconductor Industry
1:00	Space Enabled Biological Products
1:30	Quantum Information Sciences & Technologies
2:30	Space Enabled Materials & Hardware Products
3:30	SPMConnect: Panel Discussion - SPM for Semiconductors
1:30	TechConnect Innovation Spotlights: Electronics, Sensors, Communications
1:30	Counter WMD Innovation Challenge - Sponsored by CWMD
2:45	Federal Lab Technology Transfer (FLC 101)
2:45	TechConnect Innovation Spotlights: Electronics, Sensors, Communications
4:00	TechConnect Innovation Showcase Reception, Poster Session I (4:00 - 6:00)
	Tuesday June 18
7:00	Registration
8:00	TechConnect Keynote Program
9:00	CHIPS R&D - SmartFab
9:15	Physical & Chemical Sensors
9:00	SPMConnect: Advances FluidFM
9:15	Space Based Product Development & Experimentation Platforms
10:30	Impact in Advanced Manufacturing for LEO - Panel
10:30	CHIPS R&D - Metrology
11:00	SPMConnect: Dynamic Processes at Solid-Liquid Interfaces
11:15	Revolutionizing Industry with Space Manufacturing
12:00	TechConnect World, SBIR/STTR Pavilion, and EPA P3 Exhibit Hall Opens
12:00	TechConnect Business Team Meet & Greet - Booth 501
12:00	EPA P3 National Student Design Competition Showcase
1:00	Space Based Manufacturing Systems & Technologies
1:30	SPM Nanomechanics
1:30	Electrical and Optical Properties of Graphene & 2D Materials
2:30	Fabrication Processes for Space
3:30	SPM Cantilevers
3:45	Panel Discussion - SPM Cantilevers
2:00	MOSA Innovation Challenge
1:30	Medical Threat Reduction Challenge - Sponsored by MCDC
1:30	Accelerating Innovation: Policy Engagements & TechConnect Innovation Pitches
1:30	Defense Business Accelerator (DBX) - Innovation Collider
12:30	SBA ESO Meeting (Private)
3:00	MOSA Innovation Challenge and Awards Ceremony
4:00	TechConnect Innovation Showcase Reception, Poster Session 2 (4:00 - 6:00)
4:00	Student Leaders Poster Session
	Wednesday June 19
9:00	SPMConnect: Chemical Spectroscopy
9:00	InSpace Infrastructure Fabrication
9:00	XR for Semiconductor Workforce Development and Training
10:00	Scanning Probe Microscopy of 2D Materials
Program
	Monday June 17
8:30	TechConnect World Innovation Conference - Plenary Keynotes	Maryland C
	Session chair: Jennifer Rocha, Dalia Yablon, Matthew Laudon, TechConnect ATI, US
	TechConnect Overview: Connecting Research, Accelerating Innovation M. Laudon, J. Rocha, D. Yablon, TechConnect ATI, US
	Durable, Affordable and Scalable Carbon Removal using the Engineered Storage of Biomass H. Murnen, Graphyte, Inc., US
	Scalable Production of Hierarchical Carbon-Based Aerogel Materials for Filtration Applications C. Arnold, Princeton University, US
	How SBA is Enabling the Future D. Syed, U.S. Small Business Administration, US
10:00	CHIPS Workforce Development and Student Leaders Conference Internal Welcome and Networking (SLC Participants Only)	National Harbor 12
	Session chair: Maria Fernanda Campa, National Nanotechnology Coordination Office, US
	Panelist B. Brough, National Nanotechnology Coordination Office, US
	Panelist J. Ashcroft, Micro Nano Technology Education Center, US
	Panelist D. Yablon, TechConnect World Innovation Conference, US
10:30	Space Based Manufacturing Value Proposition	Annapolis 1-2
	Session chair: Jonathan Jakischa, TechConnect ATI, US
	Automation Unearthed: The Future of Manufacturing S. Sonty, Space Tango, US
	Rhodium SPARC Challenge™: Space Programs Advancing Research and Commercialization (SPARC) to Expand Space Biotech O. Gámez Holzhaus, Rhodium Scientific, US
	Science of Manufacturing in Space to Benefit Earth R. Hernandez, ISS National Laboratory, US
10:30	CHIPS Workforce Development Program: Tutorial on the Semiconductor Industry	National Harbor 12
	Introductory Remarks, Congressman Jake Auchincloss - MA
	D. Weinstein, OSTP, The White House, US
	S. Roberts, City University of New York, US
	L. Folks, University of Arizona, US
	A. Michelin, SUNY Poly/NY CREATES, US
	J. Ellington, Wolfspeed, US
1:00	Space Enabled Biological Products	Annapolis 1-2
	Session chair: Jonathan Jakischa, TechConnect ATI, US
	Characterization of Protein-based Artificial Retina Thin Films Produced via Layer-by-Layer Assembly on the International Space Station N.L. Wagner, D. Sylva, H. Sylva, K. Dixit, J.A. Greco, LambdaVision, US
	In-Space Expansion of Hematopoietic Stem Cells: Technical Progress, Economic Potential, and Commercialization Challenges L. Stodieck, S. Countryman, F. Karouia, T. Niederwieser, P. Huang, A. Zubair, L. Helander, B. Freed, BioServe Space Technologies, US
	Biomanufacturing Tissue and Cells in Microgravity M. Mulligan, K. Savin, A. Rogers, Redwire, US
	A review of organoid production in microgravity R. Roettgen, Prometheus Life Technologies AG, CH
1:30	Quantum Information Sciences & Technologies	Chesapeake C
	Session chair: Piotr Kulczakowicz, Quantum Startup Foundry, US
	From the ground state up -- a quantum startup's founding story with small business grant seed funds D. Lucarelli, Error Corp, US
	Computational Fluid Dynamics on Quantum Computers M. Syamlal, Qubit Solve, US
	Quantum Computing and Simulations for Energy-related Applications H.P. Paudel, Y.-L. Lee, S. Crawford, M.-T. Nguyen, B. Avramidis, D. Alfonso, Y. Duan, National Energy Technology laboratory, US
	SiGeSn for Monolithically Integrated Optoelectronic Devices on Silicon N. Rosson, A. Fischer, R. Scott, Lawrence Semiconductor Research Laboratory, US
	Photonics Programs at Stonehill College: Bridging Education and Industry G. Gu, C. Schnitzer, N. Vu, B. Bacon, R. Adams, T. Seaward, J. Evora, J. Wong, C. Dwyer, and C. Leonard, Stonehill College, US
2:30	Space Enabled Materials & Hardware Products	Annapolis 1-2
	Session chair: Chris Menzel, Menzel Engineering Design, US
	Microgravity 101: Understanding the Significance of In-Space Manufacturing J.J. Frick, J. Janowitz, Astral Materials, US
	ZBLAN in Space: Comparing Phase Transitions in Microgravity versus Earth’s Gravity A. De, Apsidal, US
	In-Space Production of MoS2 Films for Next-Generation Electronics D.J. Niedzwiecki, Goeppert LLC, US
	LEO – A New Technology Platform – Leveraging Low Earth Orbit for Advanced Materials Research and Manufacturing G.B. Rodrigue, M. Shumbera, J.M. Smith, Allbright Consulting, US
	Revolutionizing Space Manufacturing: Sharing Insights from the Breakthroughs in Optical Glass Fabrication from ISS M. Vestel, Flawless Photonics Inc., US
3:30	SPMConnect: Panel Discussion - SPM for Semiconductors	National Harbor 5
	Session chair: Jason Killgore, NIST, US
	Panelist G. Min, Park Instruments, US
	Panelist D. Ziegler, Nanosurf, US
	Panelist K. Amponsah, Xallent Inc., US
1:30	TechConnect Innovation Spotlights: Electronics, Sensors, Communications	Maryland 4
	Session chair: Bart Romanowicz, TechConnect ATI, US
	Bidirectional Power Converter A. Vaughn, Aegis Power Systems, US
	Epsilon's NanoLens: The Future of Flat Lens Technology A. Arias, Axelys, US
	Nano-probe Thermoreflectance Microscope (NTM) J. Gaskins, Laser Thermal, US
	Medium-doped Amorphous Glass (MAG) digital memory devices for next-generation edge AI and automotive applications D. Loke, Singapore University of Technology and Design, SG
	Subsea Communications Network to Enable Collaborative Swarms of AUVs E. Larson, Tampa Deep Sea Xplorers, Inc., US
	Review Panelist J. Epstein, Lockheed Martin, US
	Review Panelist B. Romanowicz, TechConnect ATI, US
	Review Panelist P. Kotidis, NobleReach, US
	Review Panelist P. Staszak, Boeing, US
1:30	Counter WMD Innovation Challenge - Sponsored by CWMD	Maryland 3
	Session chair: Katie Bornfleth, TechConnect Division, ATI, US
	Review Panelist TBA, Northrop Grumman, US
	Welcome from Countering Weapons of Mass Destruction Consortium M. Stebbins, ATI - CWMD, US
	J. Sarik, Nanohmics, US
	V. Putkaradze, SenseVOC LLC, US
	J. Grey, Sandia National Laboratories, US
	E. Hoffmann, Venti LLC, US
	L. Hergenroeder, Alakai Defense Systems, US
	K. Olsen, D-Tect Systems, a division of Ludlum Measurements, US
	M. Derzon, Gold Standard Radiation Detection, Inc., US
	E. Biesieda, SteriO3 LLC, US
	S.S. Lee, A2US, Inc., US
	L. Dubois, Nanoionix LLC, US
	B. Hall, Luna Labs USA LLC, US
	A. Adema, University of Colorado Anschutz Medical Campus School of Medicine, US
	TBA, M2DCON, US
	K. Rambhatla, Metakosmos, US
	P. Mangos, J. Ferraro, Adaptive Immersion Technologies, US
	Review Panelist R. Spencer, ANSER, US
	Review Panelist J. Lesho, Defense Architecture Systems, Inc., US
	Review Panelist J. Collins, InterFuze, US
	Review Panelist D. Grogan, JRAD, US
2:45	Federal Lab Technology Transfer (FLC 101)	Maryland 5
	Session chair: Federal Lab Consortium (FLC)
	P. Zielinski, FLC, US
	M. Salgaller, National Institutes of Health, Technology Transfer Office, US
2:45	TechConnect Innovation Spotlights: Electronics, Sensors, Communications	Maryland 4
	Session chair: Bart Romanowicz, TechConnect ATI, US
	Air Quality Monitoring Solutions C. Luft, TELLUS, US
	Harbinger™ Powered Sensor Array D. Abramovitz, Tempest Droneworx, Inc., US
	Compliance Testing of Systems Against SOSA Specification M. Kokar, VIStology, Inc., US
	Laser manufacturing of graphene-nanoparticle composite P. Kang, George Mason University, US
	Low SWaP Neuromorphic Vision for Drones and Embedded Applications G. Barrows, Centeye, Inc., US
	Innovative Power Semiconductor & Power Packaging Solution A. Morgan, NoMIS Power Corporation, The Research Foundation for SUNY, US
	Long-Wave Infrared Phase Modulator and Device for Producing Polarization Ellipticity Standards M.H. Kim, Texas Tech University Office of Research Commercialization, US
	Review Panelist B. Romanowicz, TechConnect ATI, US
	Review Panelist P. Kotidis, NobleReach, US
	Review Panelist P. Staszak, Boeing, US
	Review Panelist J. Blumenau, AAR Corporation, US
	Review Panelist P. Feinberg, Northrop Grumman, US
4:00	TechConnect Innovation Showcase Reception, Poster Session I (4:00 - 6:00)	Expo Hall BC
	Tuesday June 18
7:00	Registration	Convention Center Pre-Function
8:00	TechConnect Keynote Program	Maryland C
	Session chair: Jennifer Rocha, TechConnect ATI, US
	SBA Growth Accelerator Competition B. Sickler, Office of Investment & Innovation, U.S. Small Business Administration, US
	Advanced Manufacturing in Space - Catalyst Community Launch M. Laudon, TechConnect ATI, US
	ATI Catalyzing National Innovation P. Dudley, Advanced Technology International (ATI), US
	Commercial Space Office (COMSO) and the recently signed DoD and USSF Commercial Space Strategies J. Leader, U.S. Space Force, US
	In-Space Manufacturing as a Profitable and Investable Business R. Roettgen, E2MC Ventures, CH
9:00	CHIPS R&D - SmartFab	National Harbor 12
	Session chair: Daniel Schmidt, IBM, US
	DOE Nanoscale Science Research Centers Support of the Chips and Science Act J. Nelson, Sandia National Laboratories, US
	SmartFab Data and Analytics - Challenges and Opportunities R. Baseman, IBM, US
	From Lab to Fab: AI-Powered Metrology for High-Volume Manufacturing M.Y.-H. Kim, Gauss Labs Inc., US
	Collaborative and Holistic AI driven process control software platform to accelerate IC Manufacturing J. Foucher, S. Martinez, H. Ozdoba, J. Baderot, A. Hallal, M. Jacob, S. Garrais, POLLEN Metrology Inc., US
9:15	Physical & Chemical Sensors	Chesapeake 2
	Session chair: Martin Poitzsch, Aramco Americas, US
	Combining IOT with Real-Time Spectroscopy to Digitize Chemical Optimization J. Lovell, O. Kulbrandstad, A. Haun, J.H. Alzate, MIcroSilicon, US
	Metal-Organic Frameworks on Textiles for Chemical Sensing, Filtration, and Detoxification K.A. Mirica, Dartmouth College, US
	Microwave Interrogation of Woven Straps under Light Loading for Inflatable Applications W. Wilson, T.C. Jones, E. Tucker, G. Szatkowski, NASA Langley Research Center, US
	New-generation spacecraft water monitoring with flight-ready solid-state nanopores Z. Xia, Goeppert LLC, US
	Mass sensitivity of co-resonantly coupled dynamic mode cantilever sensors I. Lampouras, J. Körner, Leibniz University Hannover, DE
9:00	SPMConnect: Advances FluidFM	National Harbor 5
	Session chair: Simona Patange, NIST, US
	FluidFM: Cytosurge's journey from hollow AFM probes to precision genome engineering P. Behr, Cytosurge AG, CH
	FluidFM in Live Cell Biology: From Biomechanics to Single-Cell Omics O. Guillaume-Gentil, EPFL, CH
	Advancements in BioAFM: Fluid Micro Cantilevers and Novel Thermocouple Devices for Cellular Analysis A. Gaitas, Icahn School of Medicine at Mt. Sinai, US
	Capturing Transient Responses – Combining BioAFM with External Stimulation A. Gelmi, RMIT University, AU
	Scanning Probe Microscopy Based Investigations at Single Cell Level G-Y. Liu, University of California, Davis, US
9:15	Space Based Product Development & Experimentation Platforms	Annapolis 1-2
	Session chair: Chris Menzel, Menzel Engineering Design, US
	Manufacture in Space: A New Era of Advanced Materials Innovation D. Panchanathan, Axiom Space, US
	The Fabrication Laboratory (FabLab) facility for exploration missions. K.A. Savin, Redwire, US
	Optimizing Space Manufacturing: The Crucial Role of AI/ML in Design and Process Automation I. Cozmuta, G-Space, Inc., US
10:30	Impact in Advanced Manufacturing for LEO - Panel	Annapolis 1-2
	Session chair: Curtis Hill, NASA Materials & Processes Laboratory, US
	Panelist A. De, Apsidal, US
	Panelist P. Dutta, United Semiconductor, US
	Panelist R. Hernandez, ISS National Laboratory, US
	Panelist M. Mulligan, Redwire, US
	Panelist D. Panchanathan, Axiom Space, US
	Panelist A. Wilson, Butler University, US
10:30	CHIPS R&D - Metrology	National Harbor 12
	Session chair: Alex Norman, Princeton University, US
	The Last Light Source C. Anderson, xLight, Inc., US
	Advanced plasma diagnostics for materials synthesis and processing applications Y. Raitses, Princeton Plasma Physics Laboratory, US
	Characterizing Thermal Properties and Temperature-rise of High Frequency RF Transistors In-Operando at sub-50 nm Length Scales B.M. Foley, T. Bates, P.E. Hopkins, J.T. Gaskins, Laser Thermal Inc., US
	Scaling Chiplet Integration Through Advances in Printed Interconnects N. Frick, M. Fisher and C. Contreras Sepulveda, North Carolina State University, US
	Dendritic Identifiers as Digital Triggers in Microelectronics Manufacturing M.N. Kozicki, J. Joseph, Arizona State University and Densec ID, LLC, US
11:00	SPMConnect: Dynamic Processes at Solid-Liquid Interfaces	National Harbor 5
	Session chair: Christina Newcomb, Stanford University, US
	An in situ look at interfacial structure and dynamics during nucleation and self-assembly J.J. De Yoreo, Pacific Northwest National Laboratory, US
	Scanning Probe Microscopy Investigations of Microbiologically Influenced Corrosion on Naval Assets T.T. Brown, J.S. Lee, U.S. Naval Research Laboratory, US
	The role of additives on the thermodynamics and kinetics of nucleation, crystal growth and dissolution J. Tao, Pacific Northwest National Laboratory, US
11:15	Revolutionizing Industry with Space Manufacturing	Annapolis 1-2
	Session chair: Ioana Cozmuta, G-SPACE, US
	Panelist L. Cromley, Deloitte Consulting, US
	Panelist P. Dutta, United Semiconductors, US
	Panelist H. Mills, Rhodium Scientific, US
	Panelist F. Karouia, BioServe Space Technologies, US
	Panelist J. Scoccimerra, Interstellar Lab, US
12:00	TechConnect World, SBIR/STTR Pavilion, and EPA P3 Exhibit Hall Opens	Expo Hall BC
12:00	TechConnect Business Team Meet & Greet - Booth 501	Expo Hall BC
12:00	EPA P3 National Student Design Competition Showcase	Expo Hall BC
1:00	Space Based Manufacturing Systems & Technologies	Annapolis 1-2
	Session chair: Zack Smith, Advanced Technology International (ATI)
	Perspectives on United States Standards Development and Industry Engagement for ISAM D. Poster, U.S. Department of Commerce, US
	Operating a Manufacturing Facility in Space; Verification, Validation, and Product Signoff R. Rughani, N. Gladden, D.A. Barnhart, Arkisys, US
	Manufacturing Better Drugs in Space K. Savin, M. Mulligan, S. Tuma, Redwire, US
	On-Demand Manufacturing of Electronics for Next-Generation Semiconductor Devices M. Seol, NASA Ames, US
1:30	SPM Nanomechanics	National Harbor 5
	Session chair: Jason Killgore, NIST, US
	Nanomechanical analysis of materials using photothermal off-resonance actuation E. Nelson, J.D. Adams, H. Gunstheimer, G. Fläschner, B. Hoogenboom, Nanosurf AG, CH
	Broadband, High Frequency Viscoelastic Property Characterization of Polymers with Atomic Force Microscopy A. Deolia, S.P. Carter, R.B. Wagner, Purdue University, US
	Mechano-Spectroscopy of Soft Materials with Atomic Force Microscopy: Comparison with Raman Confocal Microscopy N. Kulachenkov, M. Petrov, I. Sokolov, Tufts University, US
	Pushing AFM to the boundaries — Validating mechanical property measurement near a rigid substrate R.J. Sheridan, I. Saito, L.C. Brinson, Duke University, US
	Advancing Nanobiomechanical Research: Large Tissue Area Mapping and Nano Scale Rheology via AFM M. Ye, A. Koernig, Bruker Nano Surface, US
	Exploring Biomechanical Properties of Microporous Annealed Particle Hydrogel (MAP Gel) in Comparison with MAP-treated Natural Tissues M. Motezaker, J.J. Daniero, P.E. Hopkins, University of Virginia, US
1:30	Electrical and Optical Properties of Graphene & 2D Materials	Chesapeake 12
	Session chair: Anirudha Sumant, Argonne National Laboratory, US
	Light-matter interactions in semiconducting selenides and 2D perovskites A.B. Kaul, University of North Texas, US
	Perovskite Photodetectors and the Effects of Environmental Phenomena on Device Performance T. Mather, C. Padilla, S. Aryal, C. Lewis, Q. Jiang, A. Sumant, Y. Lin, A.B. Kaul, University of North Texas, US
	Stacking-Dependent Optical Properties in Bilayer WSe2 K. McCreary, M. Phillips, H.-J. Chuang, D. Wickramaratne, M. Rosenberger, C.S. Hellberg, B.T. Jonker, Naval Research Laboratory, US
	Deterministically placed single photon emitters in hexagonal boron nitride E. Cobas, US Naval Research Laboratory, US
2:30	Fabrication Processes for Space	Annapolis 1-2
	Session chair: Chris Menzel, Menzel Engineering Design, US
	Enabling Metal Joining & Additive Manufacturing for On-Orbit Assembly and Manufacturing: Metal AM using Vibrational Resonance In-space via Cold-welding (MAVRIC) K. Hsu, Arizona State University, US
	Solid State Metal 3D Printing for Space P. Bahn, M. Norfolk, Fabrisonic LLC, US
	Laser Beam Welding for in-Space Joining Demonstrated Under Vacuum on the Ground and By Parabolic Flight Experiments E. Choi, A. Brimmer, W. McAuley, B. Panton, A. Ramirez, W. Evans, A. O'Connor, Z. Courtright, J.W. Sowards, NASA/MSFC, US
	Volumetric Additive Manufacturing for In-Space Manufacturing T. Waddell, UC-Berkeley, US
3:30	SPM Cantilevers	National Harbor 5
	Session chair: Christina Newcomb, Stanford University, US
3:45	Panel Discussion - SPM Cantilevers	National Harbor 5
	Session chair: Christina Newcomb, Stanford University, US
	Panelist O. Krause, NanoWorld AG, CH
	Panelist S. Jesse, Oak Ridge National Laboratory, US
	Panelist A. Eskandarian, Harvard Medical School, US
2:00	MOSA Innovation Challenge	Baltimore 3
	Session chair: Emma Mooney, TechConnect ATI, US
	Real-Time Innovations (RTI) A. Walker, Connext® Professional, US
	Real-Time Innovations (RTI) A. Walker, ConnextÒ TSS, US
	Tangram Flex S. Yantko, Tangram Pro, US
	Intellisense Systems Inc J. Holmstedt, Demonstration of MOSA Intelligent Power Systems, US
	Green Hills Software R. Jaenicke, Secure Virtualization Technology, US
	Tangram Flex, Inc. M. Zolman, Tangram Pro: Auto-generated interoperability and integration of embedded software systems, US
	Brelyon C. Barsi, Brelyon Ultra Reality IT Modernization, US
	Review Panelist A. Hammond, PEO Aviation US Army, US
	Review Panelist R. Moudy, PEO Aviation US Army, US
	Review Panelist R. Kramer, LMI, US
	Review Panelist M. Spencer, Avilution, US
	Review Panelist S. Davidson, MITRE Corporation, US
	Review Panelist N. Lappos, Lockheed Martin/ Sikorsky Aircraft Corporation, US
1:30	Medical Threat Reduction Challenge - Sponsored by MCDC	Maryland 3
	Session chair: Katie Bornfleth, TechConnect ATI, US
	Welcome from Medical CBRN Defense Consortium M. Stebbins, ATI - MCDC, US
	J. Devadhasan, Center for Applied NanoBiosceicne and Medicine (ANBM) at The University of Arizona, US
	D. Duffy, Quanterix Corporation, US
	H-J. Suk, DxLab, Inc, US
	R. Hughen, Linshom Medical, US
	J. Chapman, SimWerx, US
	C. Nank, E. Johnson, ReliOx Corporation, US
	J. Harford, SynerGene Therapeutics, Inc., US
	D. Graifman, Thylacine Biotherapeutics Inc, US
	D. Jackson, Ceria Therapeutics, US
	J. Singh, SingleTimeMicroneedles, US
	B. Takulapalli, SPOC Proteomics, US
	M. Gaitan, M. Haggerty, PrecNA LLC, US
	L. Valenti, Vaxess Technologies, US
	T. Yeruva, University of Maryland, US
	Review Panelist K. DeMarco, Strategic Analysis, Inc., US
	Review Panelist L. Palestrini, ATI, US
	Review Panelist A. Brown, US Department of Health & Human Services, US
1:30	Accelerating Innovation: Policy Engagements & TechConnect Innovation Pitches	Maryland 4
	Session chair: Jonathan Jakischa, TechConnect/ATI, US
	What is the US Congress and How Does it Help Me as an Innovator? B. Greer, Empire Consulting Group, US
	All-in-one Remote Wound Biofilm Management System A. Garg, Virginia Tech, US
	Biomineral Soil Management and Agricultural Research Technologies (B-SMART) for Climate Resilience N. Adam, Biomineral Systems LLC, US
	RF over Fiber System in a package V. Gjokaj, NuPhotonics LLC, US
	Machine learning enabled microchips for Positron Emission Tomography (PET) imaging I. Mostafanezhad, Nalu Scientific, LLC, US
	IntuiBot Delta: Revolutionizing SME Automation with Speed and Simplicity A. Arias, Axelys, CA
	Direct Conversion Process™, UHT Silicon Carbon Fiber (Fi-Bar™) Materials K. Koller, Advanced Ceramic Fibers, LLC, US
	Unlocking the full value of recycled plastics by removing color and adhesive impurities M. Yutthasaksunthorn, BMP Chemicals Co., Ltd, US
	Review Panelist J. Bindra, University of Ottawa, CA
	Review Panelist M. Ryan, ATI, US
	Review Panelist S. Bagheri, University of Waterloo, CA
	Review Panelist C. Clyburn, MedForeSight LLC, US
1:30	Defense Business Accelerator (DBX) - Innovation Collider	Chesapeake 3
	DBX Welcome & Introductions M. Laudon, M. Sanchez, TechConnect Division, ATI, US
	Defense Business Accelerator - Overview C. Zember, Office of the Assistant Secretary of Defense for Industrial Base Policy, DOD, US
	DBX Awardee Mosaic Microsystems, US
	DBX Awardee SiliconCore Technologies, US
	DBX Awardee Momentum Optics, US
	DBX Awardee Gigantor Technologies, US
	DBX Awardee Soctera, US
	DBX Mentor Y. Gamble, San Pete Financial Group, US
	DBX Mentor J. David, BryceTech, US
	DBX Mentor R. Julien, BOKA Group Holdings, US
	DBX Mentor K. Hill Richie, TEDCO - State of Maryland's Venture Capital Firm, US
	DBX Mentor B. Kortokrax, E2MC Ventures, US
	DBX Mentor J. Richmond, Lockheed Martin Ventures, US
	DBX Mentor J. Wong, Redd's Capital, IEEE Entrepreneurship, US
12:30	SBA ESO Meeting (Private)	Maryland 1-2
3:00	MOSA Innovation Challenge and Awards Ceremony	Baltimore 3
	Session chair: Emma Mooney, TechConnect ATI, US
	LightCell Modular Power Generator M. Ellis, Mesodyne, US
	BridgeInspect Pro G. Sutherland, Canetia Analytics Inc., US
	Low-Cost, High-Resolution Optical Infrared Camera using our nano EnCoater technology J. Scholtz, Vyir Inc, US
	HIGH ENERGY DENSITY Li-ION BATTERIES BASED ON GRAPHENE ANODE T. Paronyan, HeXalayer, LLC, US
	3D Interactive Instructions with XR Customer Experience A. Qureshi, BILT Incorporated, US
	PNT as a Service (PNTaaS) A. Brown, Navsys, US
	MOSA Augmented Reality (AR) Glass for Equipment Maintenance S. Kuh, Bonafi, Inc, US
	Review Panelist A. Hammond, PEO Aviation US Army, US
	Review Panelist R. Moudy, PEO Aviation US Army, US
	Review Panelist R. Kramer, LMI, US
	Review Panelist M. Spencer, Avilution, US
	Review Panelist S. Davidson, MITRE Corporation, US
	Review Panelist N. Lappos, Lockheed Martin/ Sikorsky Aircraft Corporation, US
4:00	TechConnect Innovation Showcase Reception, Poster Session 2 (4:00 - 6:00)	Expo Hall BC
4:00	Student Leaders Poster Session	Expo Hall BC
	Polymeric layer-by-layer microcapsules containing iron oxide magnetic nanoparticles exposed to breast cancer cells: A viability study using tetrazolium-based (MTT) and calcein-AM assays M. Ashcroft, R. Swift, N. Habibi, Micro Nano Technology Education Center, US
	Understanding Electronic Properties of Gold and Streptavidin-Conjugated Gold Nanoparticles for Use in Photothermal Cancer Medicine T. Nguyen, T.L. Sung, W.L. Yu, A. Ashcroft, M. Ashcroft, J. Ashcroft, Pasadena City College, US
	Exploring the Performance of Convolutional Neural Networks for mRNA cancer vaccine 5’ UTR Design A. Yan, Mercer County Community College, US
	Student Created AI-powered Digital Twin for Semiconductor Workforce Training I. Jha, A. Ashcroft, D. Kelley, J. Zhu, A. Rodriguez, A. Dong, F. Chen, K. Hong, G. Codina, Micro Nano Technology Education Center, US
	Enhancing Microfabrication Education and Industry Readiness Leveraging the University of New Mexico’s Manufacturing Training and Technology Center Cleanroom Infrastructure M.W. Pleil, N. Jackson, University of New Mexico, US
	Photonics Programs at Stonehill College: Bridging Education and Industry G. Gu, C. Schnitzer, R. Adams, J. Evora, V. Taylor, N. Vu, J. Wong, Stonehill College, US
	Recyclable Nanocomposite Conductive Wire C. Fitton-Gillen, A. Rivera, C. Pazmino-Izquierdo, C. Li, Hudson County Community College, US
	Generative AI-based Personalized Semiconductor Education using Extended Reality S. Salehi, P. Satam, E. Azimi, R. Straight, A. Salado, The University of Arizona, US
	SemImmerse: Smart Immersive Training Ecosystem for Semiconductor Manufacturing E. Azimi, R. Lan, C. Wang, K. A. Knudson, T. Peterson, Z. Mutlu, University of Arizona, US
	Surface smoothing of diamond by isotropic plasma atomic layer etching L. Stockl, C.M. Lewis, M. Huerta, N. Moldovan, R. Divan, S. Miller, L. Stan, A. Sumant, Rowan University, US
	Designing a Sample Holder for Improved Instrument Sensitivity K. Lewis, D. Nimlos, S. Cushing, Pasadena City College, US
	Synthesis of a novel hydrazone-based compound applied as a fluorescence turn-on chemosensor for iron (III) and a colorimetric sensor for copper (II) with antimicrobial, DFT and molecular docking studies. A. Adams, A.R. Sharmin, A.M. Patwary, E.G. William, K.M. Royhana, M.M. Mahmud, M.A. Haque, J. Uddin, and K. Morshin, Coppin State University, US
	Determining Optimal Base Dose with Electron Beam Lithography K. Ohashi, Caltech/Pasadena City College, US
	*STUDENT POSTER AWARDEE* Copper-bearing hydrotalcite minerals as precursors for photocatalytic supported plasmonic nanoparticles J. Cabezas Parra, E.R. Newmeyer, J. North, M. Hershey, D.F. Swearer, Northwestern University, US
	Wednesday June 19
9:00	SPMConnect: Chemical Spectroscopy	National Harbor 5
	Session chair: Greg Haugstad, University of Minnesota, US
	AFM-IR technique development in applications to industrial research G. Haugstad, B. Luo, B. Curtin, K. Wormuth, University of Minnesota, US
	Cross-correlated SPM and TERS/TEPL imaging: unique tool for nanoscale structural characterization of 2D semiconductors and the vertical / lateral heterostructures thereof. A. Krayev, HORIBA Scientific, US
	Optimized Spatial Resolution, Sensitivity, Measurement Speed and Artifact Reduction in Photothermal AFM-IR C. Phillips, M. Wagner, Q. Hu, C. Li, P. Dewolf, Bruker Nano, US
9:00	InSpace Infrastructure Fabrication	Annapolis 1-2
	Session chair: Chris Menzel, Menzel Engineering Design, US
	In-Space Manufacturing of Antennas for Global Scale Communications and Energy A. Badesha, C. Nielsen, D. Stevens, Orbital Composites, US
	Near room temperature production of segregated network composites of carbon nanotubes and regolith as multifunctional, building materials in space J.R. Garcia, E. Caffrey, L. Doolan, D.V. Horvath, T. Carey, C. Gabbett, J.N. Coleman, Trinity College Dublin, IE
	Radiation Shielding Boron Nitride Nanotube (BNNT) Reinforced Metal Matrix Composites C. Chidiac, T. Dolmetsch, Thaero LLC, US
	In-situ production of silicon carbide (SiC) from Lunar and Martian regolith S.K. Nithya Srimurugan, S. Sathyan, Indian Institute of Technology Madras, IN
	Spaceflight Qualification of Additive Aluminum S. Gardner, Big Metal Additive, US
9:00	XR for Semiconductor Workforce Development and Training	National Harbor 12
	Session chair: Jared Ashcroft, Pasadena City College, US
	Co-designing Generative AI-powered Immersive Learning Experiences for Workforce Training R. Jha, C. Johnson, SimInsights Inc, US
	Student Centered Undergraduate Research Experiences in Creating Virtual Digital Twin Cleanroom J. Ashcroft, I. Jha, A. Ashcroft, D. Kelley, J. Zhu, A. Rodriguez, A. Dong, F. Chen, K. Hong, G. Codina, Pasadena City College, US
	How to overcome Reality's semiconductor self-identification, training and up-skilling challenges J. Spyres, Training All People, Inc (Tap3d), US
	AR/VR Experiences - Demonstration of Providers
10:00	Scanning Probe Microscopy of 2D Materials	National Harbor 5
	Session chair: Greg Haugstad, University of Minnesota, US
	Torsional Force Microscopy of Van der Waals Moires and Atomic Lattices M. Pendharkar, Stanford University, US
	Scanning probe microscopy as a tool to uncover new phenomena in twisted 2D materials A. Luican-Mayer, University of Ottawa, CA
	The challenge of automating and summarizing analysis of particles in multiple AFM datasets M. Cognard, Digital Surf, FR
	Exfoliation of Nanoribbons from Bulk van der Waals Crystals for Optical and Electronic Characterization A.P. Saunders, A. Krayev, V. Chen, A.C. Johnson, A.S. McKeown-Green, H.J. Zeng, E. Pop, F. Liu, Stanford University, US
	Mechanical, electrical and KPFM investigations of ultrathin membranes of MoSSe alloy J. Serafińczuk, A. Piejko, M. Tamulewicz-Szwajkowska, K. Król , R. Kudrawiec, Wroclaw University of Science and Technology, PL
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