Join industry partners and applied research leadership accelerating the development and deployment of advanced electronics solutions into products and society.

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Speakers and Chairs Include:

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2024 Sector Program - Electronics & Microsystems

Back to Top ↑ Sessions
	Monday June 17
8:00	TechConnect World Innovation Conference - Plenary Keynotes
10:30	Space Based Manufacturing Value Proposition
10:30	CHIPS Workforce Development Program: Tutorial on the Semiconductor Industry
1:00	Space Enabled Biological Products
1:30	Quantum Information Sciences & Technologies
2:30	Space Enabled Materials & Hardware Products
3:45	SPMConnect: Panel Discussion - SPM for Semiconductors
1:30	TechConnect Innovation Spotlights: Electronics, Sensors, Communications
1:30	Counter WMD Innovation Challenge - Sponsored by CWMD
2:45	Federal Lab Technology Transfer (FLC 101)
2:45	TechConnect Innovation Spotlights: Electronics, Sensors, Communications
2:45	Counter WMD Innovation Challenge - Sponsored by CWMD
4:00	TechConnect Innovation Showcase Reception, Poster Session I (4:00 - 6:00)
	Tuesday June 18
7:00	Registration
8:00	TechConnect Keynote Program
9:15	Physical & Chemical Sensors
9:15	CHIPS R&D - SmartFab
9:15	SPMConnect: Advances FluidFM
9:15	Space Based Product Development & Experimentation Platforms
10:30	Impact in Advanced Manufacturing for LEO - Panel
10:45	CHIPS R&D - Metrology
11:15	Revolutionizing Industry with Space Manufacturing
11:00	SPMConnect: Dynamic Processes at Solid-Liquid Interfaces
12:00	TechConnect World, SBIR/STTR Pavilion, and EPA P3 Exhibit Hall Opens
12:00	TechConnect Business Team Meet & Greet
12:00	EPA P3 National Student Design Competition Showcase
1:30	SPM Nanomechanics
3:30	Panel Discussion - SPM Cantilevers
1:30	Electrical and Optical Properties of Graphene & 2D Materials
1:00	Space Based Manufacturing Systems & Technologies
2:30	Fabrication Processes for Space
1:30	MOSA Innovation Challenge
1:30	Medical Threat Reduction Challenge - Sponsored by MCDC
1:30	Accelerating Innovation: Policy Engagements & TechConnect Innovation Pitches
1:30	Defense Business Accelerator (DBX) - Innovation Collider
1:30	SBA ESO Meeting (Private)
2:30	MOSA Innovation Challenge
1:30	Medical Threat Reduction Challenge - Sponsored by MCDC
4:00	TechConnect Innovation Showcase Reception, Poster Session 2 (4:00 - 6:00)
4:00	Student Leaders Poster Session
	Wednesday June 19
9:00	SPMConnect: Chemical Spectroscopy
9:00	InSpace Infrastructure Fabrication
9:00	XR for Semiconductor Workforce Development and Training
10:00	Scanning Probe Microscopy of 2D Materials
Program
	Monday June 17
8:00	TechConnect World Innovation Conference - Plenary Keynotes	Maryland C
	Session chair: Jennifer Rocha, Dalia Yablon, Matthew Laudon, TechConnect ATI, US
8:00	Welcome to TechConnect M. Laudon, TechConnect ATI, US
8:05	TechConnect Overview: Connecting Research, Accelerating Innovation D. Yablon, J. Rocha, TechConnect ATI, US
8:15	MXenes – 2D Building Blocks for the Future Technology Y. Gogotsi, Drexel University, US
8:40	Scalable Production of Hierarchical Carbon-Based Aerogel Materials for Filtration Applications C. Arnold, Princeton University, US
9:15	SBIR/STTR Keynote Panel: Investment, Innovation, & Strategic Capital for Critical Technologies
10:30	Space Based Manufacturing Value Proposition	Annapolis 2
	Session chair: Chris Menzel, Menzel Engineering Design, US
10:30	Science of Manufacturing in Space to Benefit Earth M. Alafrangy, International Space Station National Laboratory, US
10:50	Automation Unearthed: The Future of Manufacturing S. Sonty, Space Tango, US
11:10	The Promise of Manufacturing in Space for Defense Applications: Directions, Enablers & Challenges A. Hamilton, N. Gladden, D. Barnhart, Arkisys, US
11:30	TBA O. Holzhaus, Rhodium Scientific, US
10:30	CHIPS Workforce Development Program: Tutorial on the Semiconductor Industry	Annapolis 3-4
1:00	Space Enabled Biological Products	Annapolis 2
	Session chair: Chris Menzel, Menzel Engineering Design, US
1:00	Characterization of Protein-based Artificial Retina Thin Films Produced via Layer-by-Layer Assembly on the International Space Station N.L. Wagner, D. Sylva, H. Sylva, K. Dixit, J.A. Greco, LambdaVision, US
1:20	In-Space Expansion of Hematopoietic Stem Cells: Technical Progress, Economic Potential, and Commercialization Challenges L. Stodieck, S. Countryman, F. Karouia, T. Niederwieser, P. Huang, A. Zubair, L. Helander, B. Freed, BioServe Space Technologies, US
1:40	Biomanufacturing Tissue and Cells in Microgravity M. Mulligan, K. Savin, A. Rogers, Redwire, US
2:00	A review of organoid production in microgravity R. Roettgen, Prometheus Life Technologies AG, CH
1:30	Quantum Information Sciences & Technologies	TBA
	Session chair: Piotr Kulczakowicz, Quantum Startup Foundry & Loucas Tsakalakos, Coherent Corp, US
	From the ground state up -- a quantum startup's founding story with small business grant seed funds D. Lucarelli, Error Corp, US
	Computational Fluid Dynamics on Quantum Computers M. Syamlal, Qubit Solve, US
	Quantum Computing and Simulations for Energy-related Applications H.P. Paudel, Y.-L. Lee, S. Crawford, M.-T. Nguyen, B. Avramidis, D. Alfonso, Y. Duan, National Energy Technology laboratory, US
	TBA H. Banaei, Everix, US
	SiGeSn for Monolithically Integrated Optoelectronic Devices on Silicon N. Rosson, A. Fischer, R. Scott, Lawrence Semiconductor Research Laboratory, US
	Photonics Programs at Stonehill College: Bridging Education and Industry G. Gu, C. Schnitzer, N. Vu, B. Bacon, R. Adams, T. Seaward, J. Evora, J. Wong, C. Dwyer, and C. Leonard, Stonehill College, US
2:30	Space Enabled Materials & Hardware Products	Annapolis 2
	Session chair: Chris Menzel, Menzel Engineering Design, US
2:30	Microgravity 101: Understanding the Significance of In-Space Manufacturing J.J. Frick, J. Janowitz, Astral Materials, US
2:50	ZBLAN in Space: Comparing Phase Transitions in Microgravity versus Earth’s Gravity A. De, Apsidal, US
3:10	In-Space Production of MoS2 Films for Next-Generation Electronics D.J. Niedzwiecki, Goeppert LLC, US
3:30	LEO – A New Technology Platform – Leveraging Low Earth Orbit for Advanced Materials Research and Manufacturing G.B. Rodrigue, M. Shumbera, J.M. Smith, Allbright Consulting, US
3:50	Revolutionizing Space Manufacturing: Sharing Insights from the Breakthroughs in Optical Glass Fabrication from ISS M. Vestel, Flawless Photonics Inc., US
3:45	SPMConnect: Panel Discussion - SPM for Semiconductors	TBA
	Session chair: Jason Killgore, NIST, US
1:30	TechConnect Innovation Spotlights: Electronics, Sensors, Communications	Maryland 4
	Session chair: Bart Romanowicz, TechConnect ATI, US
	Bidirectional Power Converter A. Vaughn, Aegis Power Systems, US
	Epsilon's NanoLens: The Future of Flat Lens Technology A. Arias, Axelys, US
	Nano-probe Thermoreflectance Microscope (NTM) J. Gaskins, Laser Thermal, US
	Reprogrammable Nucleic Acid-Based Biomarker Measurements A. Balijepalli, NIST, US
	Medium-doped Amorphous Glass (MAG) digital memory devices for next-generation edge AI and automotive applications D. Loke, Singapore University of Technology and Design, SG
	Subsea Communications Network to Enable Collaborative Swarms of AUVs E. Larson, Tampa Deep Sea Xplorers, Inc., US
	Review Panelist T. Fowler, USSTRATCOM, US
	Review Panelist J. Epstein, Lockheed Martin, US
	Review Panelist B. Romanowicz, TechConnect ATI, US
	Review Panelist D. Rios, USCENTCOM, US
	Review Panelist P. Staszak, Boeing, US
1:30	Counter WMD Innovation Challenge - Sponsored by CWMD	Maryland 3
2:45	Federal Lab Technology Transfer (FLC 101)	Maryland 5
	Session chair: Federal Lab Consortium (FLC)
2:45	TechConnect Innovation Spotlights: Electronics, Sensors, Communications	Maryland 4
	Session chair: Bart Romanowicz, TechConnect ATI, US
	Air Quality Monitoring Solutions C. Luft, TELLUS, US
	Harbinger™ Powered Sensor Array D. Abramovitz, Tempest Droneworx, Inc., US
	Compliance Testing of Systems Against SOSA Specification M. Kokar, VIStology, Inc., US
	Laser manufacturing of graphene-nanoparticle composite P. Kang, George Mason University, US
	Low SWaP Neuromorphic Vision for Drones and Embedded Applications G. Barrows, Centeye, Inc., US
	Innovative Power Semiconductor & Power Packaging Solution A. Winter, The Research Foundation for SUNY, US
	Long-Wave Infrared Phase Modulator and Device for Producing Polarization Ellipticity Standards W. Jones, Texas Tech University Office of Research Commercialization, US
	Review Panelist T. Fowler, USSTRATCOM, US
	Review Panelist B. Romanowicz, TechConnect ATI, US
	Review Panelist D. Rios, USCENTCOM, US
	Review Panelist P. Staszak, Boeing, US
	Review Panelist TBA, Northrop Grumman, US
2:45	Counter WMD Innovation Challenge - Sponsored by CWMD	Maryland 3
4:00	TechConnect Innovation Showcase Reception, Poster Session I (4:00 - 6:00)	Expo Hall BC
	Tuesday June 18
7:00	Registration	Convention Center Pre-Function
8:00	TechConnect Keynote Program	Maryland C
	Session chair: Jennifer Rocha, TechConnect ATI, US
8:00	Secure Tactical Advanced Mobile Power (STAMP) TBA, U.S. Department of Defense, US
8:15	Commercial Space Office (COMSO) J. Leader, U.S. Space Force, US
8:35	In-Space Manufacturing as a Profitable and Investable Business R. Roettgen, E2MC Ventures, CH
9:15	Physical & Chemical Sensors	TBA
	Session chair: Martin Poitzsch, Aramco Americas, US
	Combining IOT with Real-Time Spectroscopy to Digitize Chemical Optimization J. Lovell, O. Kulbrandstad, A. Haun, J.H. Alzate, MIcroSilicon, US
	Microwave Interrogation of Woven Straps under Light Loading for Inflatable Applications W. Wilson, T.C. Jones, E. Tucker, G. Szatkowski, NASA Langley Research Center, US
	New-generation spacecraft water monitoring with flight-ready solid-state nanopores Z. Xia, Goeppert LLC, US
	Mass sensitivity of co-resonantly coupled dynamic mode cantilever sensors I. Lampouras, J. Körner, Leibniz University Hannover, DE
	Metal-Organic Frameworks on Textiles for Chemical Sensing, Filtration, and Detoxification K.A. Mirica, Dartmouth College, US
9:15	CHIPS R&D - SmartFab	Annapolis 3-4
	Session chair: Daniel Schmidt, IBM, US
	DOE Nanoscale Science Research Centers Support of the Chips and Science Act J. Nelson, Sandia National Laboratories, US
	SmartFab Data and Analytics - Challenges and Opportunities R. Baseman, IBM, US
	From Lab to Fab: AI-Powered Metrology for High-Volume Manufacturing M.Y.-H. Kim, Gauss Labs Inc., US
	Collaborative and Holistic AI driven process control software platform to accelerate IC Manufacturing J. Foucher, S. Martinez, H. Ozdoba, J. Baderot, A. Hallal, M. Jacob, S. Garrais, POLLEN Metrology Inc., US
9:15	SPMConnect: Advances FluidFM	TBA
	Session chair: Simona Patange, NIST, US
	FluidFM: Cytosurge's journey from hollow AFM probes to precision genome engineering P. Behr, Cytosurge AG, CH
	FluidFM in Live Cell Biology: From Biomechanics to Single-Cell Omics O. Guillaume-Gentil, EPFL, CH
	Advancements in BioAFM: Fluid Micro Cantilevers and Novel Thermocouple Devices for Cellular Analysis A. Gaitas, Icahn School of Medicine at Mt. Sinai, US
	Scanning Probe Microscopy Based Investigations at Single Cell Level G-Y. Liu, University of California, Davis, US
	Capturing Transient Responses – Combining BioAFM with External Stimulation A. Gelmi, RMIT University, AU
9:15	Space Based Product Development & Experimentation Platforms	Annapolis 2
	Session chair: Chris Menzel, Menzel Engineering Design, US
9:15	Manufacture in Space: A New Era of Advanced Materials Innovation D. Panchanathan, Axiom Space, US
9:35	The Fabrication Laboratory (FabLab) facility for exploration missions. K.A. Savin, Redwire, US
9:55	Optimizing Space Manufacturing: The Crucial Role of AI/ML in Design and Process Automation I. Cozmuta, G-Space, Inc., US
10:30	Impact in Advanced Manufacturing for LEO - Panel	Annapolis 2
	Session chair: Curtis Hill, NASA Materials & Processes Laboratory, US
	Panelist A. De, Apsidal, US
	Panelist P. Dutta, United Semiconductor, US
	Panelist R. Hernandez, ISS National Laboratory, US
	Panelist D. Panchanathan, Axiom Space, US
	Panelist A. Parlock, Space Forge, US
	Panelist A. Wilson, Butler University, US
10:45	CHIPS R&D - Metrology	Annapolis 3-4
	Session chair: Alex Norman, Princeton University, US
	The Last Light Source E.R. Hosler, xLight, Inc., US
	Advanced plasma diagnostics for materials synthesis and processing applications Y. Raitses, Princeton Plasma Physics Laboratory, US
	Characterizing Thermal Properties and Temperature-rise of High Frequency RF Transistors In-Operando at sub-50 nm Length Scales B.M. Foley, T. Bates, P.E. Hopkins, J.T. Gaskins, Laser Thermal Inc., US
	Scaling Chiplet Integration Through Advances in Printed Interconnects N. Frick, Freescale LLC, US
	Dendritic Identifiers as Digital Triggers in Microelectronics Manufacturing M.N. Kozicki, J. Joseph, Arizona State University and Densec ID, LLC, US
11:15	Revolutionizing Industry with Space Manufacturing	Annapolis 2
	Session chair: Ioana Cozmuta, G-SPACE, US
	Panelist V. Maier, The Exploration Company, US
	Panelist D. Rasky, NASA Ames, US
	Panelist L. Cromley, Deloitte Consulting, US
	Panelist P. Dyutta, United Semiconductors, US
	Panelist H. Mills, Rhodium Scientific, US
11:00	SPMConnect: Dynamic Processes at Solid-Liquid Interfaces	TBA
	Session chair: Christina Newcomb, Stanford University, US
	An in situ look at interfacial structure and dynamics during nucleation and self-assembly J.J. De Yoreo, Pacific Northwest National Laboratory, US
	Scanning Probe Microscopy Investigations of Microbiologically Influenced Corrosion on Naval Assets T.T. Brown, J.S. Lee, U.S. Naval Research Laboratory, US
	The role of additives on the thermodynamics and kinetics of nucleation, crystal growth and dissolution J. Tao, Pacific Northwest National Laboratory, US
12:00	TechConnect World, SBIR/STTR Pavilion, and EPA P3 Exhibit Hall Opens	Expo Hall BC
12:00	TechConnect Business Team Meet & Greet	Expo Hall BC
12:00	EPA P3 National Student Design Competition Showcase	Expo Hall BC
1:30	SPM Nanomechanics	TBA
	Session chair: Jason Killgore, NIST, US
	Nanomechanical analysis of materials using photothermal off-resonance actuation E. Nelson, J.D. Adams, H. Gunstheimer, G. Fläschner, B. Hoogenboom, Nanosurf AG, CH
	Broadband, High Frequency Viscoelastic Property Characterization of Polymers with Atomic Force Microscopy A. Deolia, S.P. Carter, R.B. Wagner, Purdue University, US
	Mechano-Spectroscopy of Soft Materials with Atomic Force Microscopy: Comparison with Raman Confocal Microscopy N. Kulachenkov, M. Petrov, I. Sokolov, Tufts University, US
	Pushing AFM to the boundaries — Validating mechanical property measurement near a rigid substrate R.J. Sheridan, I. Saito, L.C. Brinson, Duke University, US
	Advancing Nanobiomechanical Research: Large Tissue Area Mapping and Nano Scale Rheology via AFM M. Ye, A. Koernig, Bruker Nano Surface, US
	Exploring Biomechanical Properties of Microporous Annealed Particle Hydrogel (MAP Gel) in Comparison with MAP-treated Natural Tissues M. Motezaker, J.J. Daniero, P.E. Hopkins, University of Virginia, US
3:30	Panel Discussion - SPM Cantilevers	TBA
	Session chair: Christina Newcomb, Stanford University, US
1:30	Electrical and Optical Properties of Graphene & 2D Materials	TBA
	Session chair: Anirudha Sumant, Argonne National Laboratory, US
	Light-matter interactions in semiconducting selenides and 2D perovskites A.B. Kaul, University of North Texas, US
	Perovskite Photodetectors and the Effects of Environmental Phenomena on Device Performance T. Mather, C. Padilla, S. Aryal, C. Lewis, Q. Jiang, A. Sumant, Y. Lin, A.B. Kaul, University of North Texas, US
	Stacking-Dependent Optical Properties in Bilayer WSe2 M. Phillips, H.-J. Chuang, D. Wickramaratne, M. Rosenberger, C.S. Hellberg, B.T. Jonker, Naval Research Laboratory, US
	Deterministically placed single photon emitters in hexagonal boron nitride E. Cobas, US Naval Research Laboratory, US
1:00	Space Based Manufacturing Systems & Technologies	Annapolis 2
	Session chair: Chris Menzel, Menzel Engineering Design, US
1:00	Perspectives on United States Standards Development and Industry Engagement for ISAM D. Poster, U.S. Department of Commerce, US
1:20	Technology Maturation for In-Space Manufacturing R.A. Bardsley, NASA, US
1:40	Operating a Manufacturing Facility in Space; Verification, Validation, and Product Signoff R. Rughani, N. Gladden, D.A. Barnhart, Arkisys, US
2:00	Manufacturing Better Drugs in Space K. Savin, M. Mulligan, S. Tuma, Redwire, US
2:30	Fabrication Processes for Space	Annapolis 2
	Session chair: Chris Menzel, Menzel Engineering Design, US
2:30	Enabling Metal Joining & Additive Manufacturing for On-Orbit Assembly and Manufacturing: Metal AM using Vibrational Resonance In-space via Cold-welding (MAVRIC) K. Hsu, Arizona State University, US
2:50	Laser Beam Welding for in-Space Joining Demonstrated Under Vacuum on the Ground and By Parabolic Flight Experiments E. Choi, A. Brimmer, W. McAuley, B. Panton, A. Ramirez, W. Evans, A. O'Connor, Z. Courtright, J.W. Sowards, NASA/MSFC, US
3:10	Solid State Metal 3D Printing for Space P. Bahn, M. Norfolk, Fabrisonic LLC, US
3:30	Volumetric Additive Manufacturing for In-Space Manufacturing T. Waddell, UC-Berkeley, US
3:50	Additive Manufacturing in Space: Potentials and Challenges L. Wang, R. Mosher, P. Duett, Mississippi State University, US
1:30	MOSA Innovation Challenge	Baltimore
	Session chair: Emma Mooney, TechConnect ATI, US
1:30	Medical Threat Reduction Challenge - Sponsored by MCDC	Maryland 3
1:30	Accelerating Innovation: Policy Engagements & TechConnect Innovation Pitches	Maryland 4
	Session chair: Jonathan Jakischa, TechConnect/ATI, US
	What is the US Congress and How Does it Help Me as an Innovator? B. Greer, Empire Consulting Group, US
	All-in-one Remote Wound Biofilm Management System A. Garg, Virginia Tech, US
	Biomineral Soil Management and Agricultural Research Technologies (B-SMART) for Climate Resilience N. Adam, Biomineral Systems LLC, US
	RF over Fiber System in a package V. Gjokaj, NuPhotonics LLC, US
	Machine learning enabled microchips for Positron Emission Tomography (PET) imaging I. Mostafanezhad, Nalu Scientific, LLC, US
	Review Panelist J. Bindra, University of Ottawa, CA
	Review Panelist M. Ryan, ATI, US
	Review Panelist S. Bagheri, University of Waterloo, CA
	Review Panelist C. Clyburn, MedForeSight LLC, US
1:30	Defense Business Accelerator (DBX) - Innovation Collider	Annapolis 1
	DBX Welcome & Introductions L. Murphree, TechConnect, ATI, US
	Defense Business Accelerator - Overview C. Zember, Office of the Assistant Secretary of Defense for Industrial Base Policy, DOD, US
	DBX Awardee Mosaic Microsystems, US
	DBX Awardee SiliconCore Technologies, US
	DBX Awardee Momentum Optics, US
	DBX Awardee Gigantor Technologies, US
	DBX Awardee Soctera, US
	DBX Awardee Freedom Photonics, US
	DBX Mentor Y. Gamble, San Pete Financial Group, US
	DBX Mentor J. David, BryceTech, US
	DBX Mentor R. Julien, BOKA Group Holdings, US
	DBX Mentor K. Hill Richie, TEDCO - State of Maryland's Venture Capital Firm, US
	DBX Mentor B. Kortokrax, E2MC Ventures, US
	DBX Mentor J. Richmond, Lockheed Martin Ventures, US
	DBX Mentor J. Wong, Redd's Capital, IEEE Entrepreneurship, US
1:30	SBA ESO Meeting (Private)	Maryland 5
2:30	MOSA Innovation Challenge	Baltimore
	Session chair: Emma Mooney, TechConnect ATI, US
1:30	Medical Threat Reduction Challenge - Sponsored by MCDC	Maryland 3
4:00	TechConnect Innovation Showcase Reception, Poster Session 2 (4:00 - 6:00)	Expo Hall BC
4:00	Student Leaders Poster Session	Expo Hall BC
	Polymeric layer-by-layer microcapsules containing iron oxide magnetic nanoparticles exposed to breast cancer cells: A viability study using tetrazolium-based (MTT) and calcein-AM assays M. Ashcroft, R. Swift, N. Habibi, Micro Nano Technology Education Center, US
	Understanding Electronic Properties of Gold and Streptavidin-Conjugated Gold Nanoparticles for Use in Photothermal Cancer Medicine T. Nguyen, T.L. Sung, W.L. Yu, A. Ashcroft, M. Ashcroft, J. Ashcroft, Pasadena City College, US
	Exploring the Performance of Convolutional Neural Networks for mRNA cancer vaccine 5’ UTR Design A. Yan, Mercer County Community College, US
	Student Created AI-powered Digital Twin for Semiconductor Workforce Training I. Jha, A. Ashcroft, D. Kelley, J. Zhu, A. Rodriguez, A. Dong, F. Chen, K. Hong, G. Codina, Micro Nano Technology Education Center, US
	Enhancing Microfabrication Education and Industry Readiness Leveraging the University of New Mexico’s Manufacturing Training and Technology Center Cleanroom Infrastructure M.W. Pleil, N. Jackson, University of New Mexico, US
	Photonics Programs at Stonehill College: Bridging Education and Industry G. Gu, C. Schnitzer, R. Adams, J. Evora, V. Taylor, N. Vu, J. Wong, Stonehill College, US
	Recyclable Nanocomposite Conductive Wire C. Fitton-Gillen, A. Rivera, C. Pazmino-Izquierdo, C. Li, Hudson County Community College, US
	Generative AI-based Personalized Semiconductor Education using Extended Reality S. Salehi, P. Satam, E. Azimi, R. Straight, A. Salado, The University of Arizona, US
	SemImmerse: Smart Immersive Training Ecosystem for Semiconductor Manufacturing E. Azimi, R. Lan, C. Wang, K. A. Knudson, T. Peterson, Z. Mutlu, University of Arizona, US
	Surface Smoothing of Diamond by Atomic Layer Etching L. Stockl, R. Divan, N. Moldovan, S. Miller, L. Stan, A. Sumant, Rowan University, US
	Designing a Sample Holder for Improved Instrument Sensitivity K. Lewis, D. Nimlos, S. Cushing, Pasadena City College, US
	Locking the SUMO Switch: Utilization of De Novo Design and Molecular Dynamics Simulations to Create Novel Small Molecule Inhibitors of Rhes SUMOylation and Stability Analysis of Interacting Residues for Huntington's Disease B.N. Krishnan, North Creek High School, US
	Synthesis of a novel hydrazone-based compound applied as a fluorescence turn-on chemosensor for iron (III) and a colorimetric sensor for copper (II) with antimicrobial, DFT and molecular docking studies. A. Adams, A.R. Sharmin, A.M. Patwary, E.G. William, K.M. Royhana, M.M. Mahmud, M.A. Haque, J. Uddin, and K. Morshin, Coppin State University, US
	Wednesday June 19
9:00	SPMConnect: Chemical Spectroscopy	TBA
	Session chair: Liam Collins, Oak Ridge National Laboratory, US
	AFM-IR technique development in applications to industrial research G. Haugstad, B. Luo, B. Curtin, K. Wormuth, University of Minnesota, US
	Cross-correlated SPM and TERS/TEPL imaging: unique tool for nanoscale structural characterization of 2D semiconductors and the vertical / lateral heterostructures thereof. A. Krayev, HORIBA Scientific, US
	Optimized Spatial Resolution, Sensitivity, Measurement Speed and Artifact Reduction in Photothermal AFM-IR C. Phillips, M. Wagner, Q. Hu, C. Li, P. Dewolf, Bruker Nano, US
9:00	InSpace Infrastructure Fabrication	Annapolis 2
	Session chair: Chris Menzel, Menzel Engineering Design, US
9:00	In-Space Manufacturing of Antennas for Global Scale Communications and Energy A. Badesha, C. Nielsen, D. Stevens, Orbital Composites, US
9:20	Near room temperature production of segregated network composites of carbon nanotubes and regolith as multifunctional, building materials in space J.R. Garcia, E. Caffrey, L. Doolan, D.V. Horvath, T. Carey, C. Gabbett, J.N. Coleman, Trinity College Dublin, IE
9:40	Radiation Shielding Boron Nitride Nanotube (BNNT) Reinforced Metal Matrix Composites C. Chidiac, T. Dolmetsch, Thaero LLC, US
10:00	In-situ production of silicon carbide (SiC) from Lunar and Martian regolith S.K. Nithya Srimurugan, S. Sathyan, Indian Institute of Technology Madras, IN
10:20	Spaceflight Qualification of Additive Aluminum S. Gardner, Big Metal Additive, US
9:00	XR for Semiconductor Workforce Development and Training	TBA
	Session chair: Jared Ashcroft, Pasadena Community College, US
9:00	Co-designing Generative AI-powered Immersive Learning Experiences for Workforce Training R. Jha, C. Johnson, SimInsights Inc, US
9:20	Student Centered Undergraduate Research Experiences in Creating Virtual Digital Twin Cleanroom J. Ashcroft, I. Jha, A. Ashcroft, D. Kelley, J. Zhu, A. Rodriguez, A. Dong, F. Chen, K. Hong, G. Codina, Pasadena City College, US
9:40	How to overcome Reality's semiconductor self-identification, training and up-skilling challenges J. Spyres, Training All People, Inc (Tap3d), US
10:00	AR/VR Experiences - Demonstration of Providers
10:00	Scanning Probe Microscopy of 2D Materials	TBA
	Session chair: Mehmet Baykara, University of California, Merced, US
	Torsional Force Microscopy of Van der Waals Moires and Atomic Lattices M. Pendharkar, Stanford University, US
	Scanning probe microscopy as a tool to uncover new phenomena in twisted 2D materials A. Luican-Mayer, University of Ottawa, CA
	The challenge of automating and summarizing analysis of particles in multiple AFM datasets M. Cognard, Digital Surf, FR
	Exfoliation of Nanoribbons from Bulk van der Waals Crystals for Optical and Electronic Characterization A.P. Saunders, A. Krayev, V. Chen, A.C. Johnson, A.S. McKeown-Green, H.J. Zeng, E. Pop, F. Liu, Stanford University, US
	Mechanical, electrical and KPFM investigations of ultrathin membranes of MoSSe alloy J. Serafińczuk, A. Piejko, M. Tamulewicz-Szwajkowska, K. Król , R. Kudrawiec, Wroclaw University of Science and Technology, PL
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