With passage of the 2022 CHIPS for America Act, the US government is making a $50 billion investment to catalyze long-term growth in the domestic semiconductor industry in support of US national and economic security. A significant portion of this funding - $11 billion – goes towards R&D initiatives to create a network of innovation in the US semiconductor ecosystem.
This symposium will focus on 3 target areas identified as critical to the R&D initiatives:
*This symposium gathers experts to discuss research challenges and opportunities associated with the recently passed CHIPS act, but it is not an official activity by or related to the US CHIPS office.
Back to Top ↑2024 Symposium Sessions |
| Monday June 17 |
| 10:30 | CHIPS Workforce Development Program: Tutorial on the Semiconductor Industry |
| 1:30 | CHIPS Workforce Development Program: Career Panel Discussions |
| 3:30 | CHIPS Workforce Development Program: Registered Apprenticeships |
| Tuesday June 18 |
| 9:15 | CHIPS R&D - SmartFab |
| 10:45 | CHIPS R&D - Metrology |
| 12:00 | CHIPS Workforce Development Program Career Awareness Fair (12:00 - 6:00) |
| 4:00 | CHIPS R&D - Posters |
| 4:00 | Student Leaders Poster Session |
| Wednesday June 19 |
| 9:00 | XR for Semiconductor Workforce Development and Training |
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2024 Symposium Program |
| Monday June 17 |
|
| 10:30 | CHIPS Workforce Development Program: Tutorial on the Semiconductor Industry | Annapolis 3-4 |
|
| 1:30 | CHIPS Workforce Development Program: Career Panel Discussions | Annapolis 3-4 |
|
| 3:30 | CHIPS Workforce Development Program: Registered Apprenticeships | Annapolis 3-4 |
| Tuesday June 18 |
|
| 9:15 | CHIPS R&D - SmartFab | Annapolis 3-4 |
| Session chair: Daniel Schmidt, IBM, US |
| DOE Nanoscale Science Research Centers Support of the Chips and Science Act
J. Nelson, Sandia National Laboratories, US |
| SmartFab Data and Analytics - Challenges and Opportunities
R. Baseman, IBM, US |
| From Lab to Fab: AI-Powered Metrology for High-Volume Manufacturing
M.Y.-H. Kim, Gauss Labs Inc., US |
| Collaborative and Holistic AI driven process control software platform to accelerate IC Manufacturing
J. Foucher, S. Martinez, H. Ozdoba, J. Baderot, A. Hallal, M. Jacob, S. Garrais, POLLEN Metrology Inc., US |
|
| 10:45 | CHIPS R&D - Metrology | Annapolis 3-4 |
| Session chair: Alex Norman, Princeton University, US |
| The Last Light Source
E.R. Hosler, xLight, Inc., US |
| Advanced plasma diagnostics for materials synthesis and processing applications
Y. Raitses, Princeton Plasma Physics Laboratory, US |
| Characterizing Thermal Properties and Temperature-rise of High Frequency RF Transistors In-Operando at sub-50 nm Length Scales
B.M. Foley, T. Bates, P.E. Hopkins, J.T. Gaskins, Laser Thermal Inc., US |
| Scaling Chiplet Integration Through Advances in Printed Interconnects
N. Frick, Freescale LLC, US |
| Dendritic Identifiers as Digital Triggers in Microelectronics Manufacturing
M.N. Kozicki, J. Joseph, Arizona State University and Densec ID, LLC, US |
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| 12:00 | CHIPS Workforce Development Program Career Awareness Fair (12:00 - 6:00) | Expo Hall BC |
|
| 4:00 | CHIPS R&D - Posters | Expo Hall BC |
| Advances in Thermal Metrology of Thin Films via Steady-State Thermoreflectance
J.T. Gaskins, B.F. Foley, D.H. Olson, J.L. Braun, P.E. Hopkins, Laser Thermal, US |
| High-performance, power efficient storage device, on a base of NVDIMM for embedded systems
I. Sharovar, Truememorytechnology LLC, US |
| Fabrication of Epsilon-near-zero Metamaterial with Anomalous Refraction
A. Enriquez, M. Meretska, F. Capasso, Harvard University, US |
| Rugged SiC Device & Power Module Technology for Reliable Power Electronics
A. Morgan, NoMIS Power, US |
|
| 4:00 | Student Leaders Poster Session | Expo Hall BC |
| Polymeric layer-by-layer microcapsules containing iron oxide magnetic nanoparticles exposed to breast cancer cells: A viability study using tetrazolium-based (MTT) and calcein-AM assays
M. Ashcroft, R. Swift, N. Habibi, Micro Nano Technology Education Center, US |
| Understanding Electronic Properties of Gold and Streptavidin-Conjugated Gold Nanoparticles for Use in Photothermal Cancer Medicine
T. Nguyen, T.L. Sung, W.L. Yu, A. Ashcroft, M. Ashcroft, J. Ashcroft, Pasadena City College, US |
| Exploring the Performance of Convolutional Neural Networks for mRNA cancer vaccine 5’ UTR Design
A. Yan, Mercer County Community College, US |
| Student Created AI-powered Digital Twin for Semiconductor Workforce Training
I. Jha, A. Ashcroft, D. Kelley, J. Zhu, A. Rodriguez, A. Dong, F. Chen, K. Hong, G. Codina, Micro Nano Technology Education Center, US |
| Enhancing Microfabrication Education and Industry Readiness Leveraging the University of New Mexico’s Manufacturing Training and Technology Center Cleanroom Infrastructure
M.W. Pleil, N. Jackson, University of New Mexico, US |
| Photonics Programs at Stonehill College: Bridging Education and Industry
G. Gu, C. Schnitzer, R. Adams, J. Evora, V. Taylor, N. Vu, J. Wong, Stonehill College, US |
| Recyclable Nanocomposite Conductive Wire
C. Fitton-Gillen, A. Rivera, C. Pazmino-Izquierdo, C. Li, Hudson County Community College, US |
| Generative AI-based Personalized Semiconductor Education using Extended Reality
S. Salehi, P. Satam, E. Azimi, R. Straight, A. Salado, The University of Arizona, US |
| SemImmerse: Smart Immersive Training Ecosystem for Semiconductor Manufacturing
E. Azimi, R. Lan, C. Wang, K. A. Knudson, T. Peterson, Z. Mutlu, University of Arizona, US |
| Surface Smoothing of Diamond by Atomic Layer Etching
L. Stockl, R. Divan, N. Moldovan, S. Miller, L. Stan, A. Sumant, Rowan University, US |
| Designing a Sample Holder for Improved Instrument Sensitivity
K. Lewis, D. Nimlos, S. Cushing, Pasadena City College, US |
| Locking the SUMO Switch: Utilization of De Novo Design and Molecular Dynamics Simulations to Create Novel Small Molecule Inhibitors of Rhes SUMOylation and Stability Analysis of Interacting Residues for Huntington's Disease
B.N. Krishnan, North Creek High School, US |
| Synthesis of a novel hydrazone-based compound applied as a fluorescence turn-on chemosensor for iron (III) and a colorimetric sensor for copper (II) with antimicrobial, DFT and molecular docking studies.
A. Adams, A.R. Sharmin, A.M. Patwary, E.G. William, K.M. Royhana, M.M. Mahmud, M.A. Haque, J. Uddin, and K. Morshin, Coppin State University, US |
| Wednesday June 19 |
|
| 9:00 | XR for Semiconductor Workforce Development and Training | TBA |
| Session chair: Jared Ashcroft, Pasadena Community College, US |
| 9:00 | Co-designing Generative AI-powered Immersive Learning Experiences for Workforce Training
R. Jha, C. Johnson, SimInsights Inc, US |
| 9:20 | Student Centered Undergraduate Research Experiences in Creating Virtual Digital Twin Cleanroom
J. Ashcroft, I. Jha, A. Ashcroft, D. Kelley, J. Zhu, A. Rodriguez, A. Dong, F. Chen, K. Hong, G. Codina, Pasadena City College, US |
| 9:40 | How to overcome Reality's semiconductor self-identification, training and up-skilling challenges
J. Spyres, Training All People, Inc (Tap3d), US |
| 10:00 | AR/VR Experiences - Demonstration of Providers
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Collaborative and Holistic AI driven process control software platform to accelerate IC Manufacturing
Advanced plasma diagnostics for materials synthesis and processing applications
From Lab to Fab: AI-Powered Metrology for High-Volume Manufacturing
DOE Nanoscale Science Research Centers Support of the Chips and Science Act
SmartFab Data and Analytics - Challenges and Opportunities
The Last Light Source
