MARCH 10-12, 2026 | RALEIGH, NC
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  Innovation, Business  


The innovation and business sector focuses on fostering cutting-edge ideas and translating them into viable commercial solutions that drive economic growth. This sector encompasses entrepreneurship, venture capital, and corporate innovation, supporting the development of new products, services, and business models across industries. By leveraging emerging technologies, market insights, and collaborative ecosystems, innovation in business fuels competitiveness, accelerates time-to-market, and opens up new opportunities for sustained success in a rapidly evolving global marketplace.



TechConnect Innovation Business Program Coming Soon!



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2026 Sessions

Tuesday March 10

8:30TechConnect World Innovation Conference - Plenary Keynotes
10:30Bio In Space Symposium
10:30TechConnect Innovation Spotlights: Biotech & Medical I
10:30SBIR Session I
10:30Supporting the Translation of Research-based Technologies to Products
11:30Bio In Space Symposium
11:30TechConnect Innovation Spotlights: Biotech & Medical II
11:30TechConnect Innovation Spotlights: Space, Defense, and Mobility
11:30SBIR Session II
1:00TechConnect World Expo and SBIR/STTR Pavilion Open
1:30TechConnect Innovation Spotlights: AI and Digital Transformation I
1:30TechConnect Innovation Spotlights: Energy and Sustainability I
1:30SBIR Session III
1:30Bio In Space Innovation Challenge
1:30Revolutionary Fibers and Textiles Innovation Challenge
2:30TechConnect Innovation Spotlights: AI and Digital Transformation I
2:30TechConnect Innovation Spotlights: Energy and Sustainability II
2:30SBIR Session IV
3:30Manufacturing USA Institutes: A Funding and Partner Catalyst for Fostering Innovation Coast to Coast
4:00Bio In Space Innovation Challenge-Winners Announced
4:00TechConnect World Expo, Technical Poster Session I, and Expo Social (4:00 - 6:00)
4:00SBIR/STTR Pavilion Reception

Wednesday March 11

8:30TechConnect World Innovation Conference - Business Keynotes
9:30LEAN Power and EMC2 Industry Day
9:30DOE EPIC Prize Challenge Pitch Competition
9:30National Safety Council (NSC) Session (invited)
9:30SBIR Session V
10:30Bio In Space Symposium
10:30SBIR Session VI
10:30TechConnect Innovation Spotlight
10:30DARPA Session (invited)
11:30SBIR Session VII
11:30TechConnect Business Session TBA
12:15Lunch Break
1:00TechConnect World Expo and SBIR/STTR Pavilion Open
1:30U.S. National Strategic Plan for Advanced Manufacturing Town Hall
1:30TechConnect Innovation Spotlights: Electronics and Microsystems
1:30TechConnect Innovation Spotlights: Advanced Materials
1:30SBIR Session VIII
1:30LEAN Power and EMC2 Member Only Meeting
2:30Future‑Ready by Design: How the FBI Builds Continuous Innovation
2:30TechConnect Innovation Spotlights: Advanced Materials and Manufacturing
2:30SBIR Session IX
3:30DOE EPIC Prize Challenge Winner Announcement
4:00TechConnect World Expo, Technical Poster Session II, and Expo Social (4:00 - 6:00)
4:00SBIR/STTR Pavilion Reception

Thursday March 12

8:30SBIR/STTR Innovator Training Workshop 8:30am-4:30pm (Additional Registration Required)
9:00TechConnect Innovation Spotlights: Advanced Materials, AI, Biotech, and Defense
9:00Pathfinder Workforce Development Program, Supporting Emerging Technology Manufacturing Workforce and Development
10:00Pathfinder Workforce Development Program, Supporting Emerging Technology Manufacturing Workforce and Development
12:00Lunch Break
1:15Critical Materials - Workshop (open to all conference attendees)

2026 Detailed Program

Tuesday March 10

8:30TechConnect World Innovation Conference - Plenary Keynotes
Session chair: Jennifer Rocha, Dalia Yablon, Matthew Laudon, TechConnect Division, ATI, US
Architecting the Future with Silicon Carbide: A Platform for Power, Intelligence, and Immersion
E. Balkas, Wolfspeed, US
Quantum Computing 101: Foundations, Frontiers, and Future Impact
W. Oliver, MIT, US
Lightweighting with single crystal graphene, and new routes to growing diamonds
R. Ruoff, Ulsan National Institute of Science & Technology, KR
SBIR/STTR Keynote
TBA, U.S. Small Business Administration, US
10:30Bio In Space Symposium
Session chair: Jonathan Jakischa, TechConnect Division, ATI
10:30TechConnect Innovation Spotlights: Biotech & Medical I
Review Panelist
K. Covey, First Flight Venture Center, US
Review Panelist
T. Willis, Med1 Ventures, US
Review Panelist
C. Stebbins, ATI, US
Review Panelist
T. Martin, New Ventures and Investments, North Carolina State University, US
Review Panelist
M. McKee, New Ventures and Partnerships, University of North Carolina, US
Coordinate with Care: A Digital Educational Platform
N. McFadden, Texas State University, US
Ambient Intelligent Modular Rack Guidance System
R. Schmid, Intelligent Clinical Systems, LLC, US
RapiSep: A Plasma Separator Enabling Rapid and Decentralized Blood Processing and Diagnostics
J. Zhou, MicroFAST Dx, US
MelodiaSync: Enhancing Cognitive Performance by an EEG-Guided Audio Neuromodulation System
J. Blume, MelodiaSync, US
Regenerative Breast Tissue
K. Weimer, GenesisTissue Inc., US
Enhanced Lubrication and Anti-inflammation Treatment for Articular and Artificial Joints
D. Berman, University of North Texas, US
10:30SBIR Session I
10:30Supporting the Translation of Research-based Technologies to Products
Session chair: Christine Galib, Princeton University & Alex Norman, Princeton University
NASA’s University Collaborations and Their Effects on Its Mission, Technical Excellence, and Workforce
J.S. McCabe, NASA Johnson Space Center, US
Research Triangle Innovation Sphere
J. Jur, NC Dept of Commerce, US
It Takes a Village: Innovation Ecosystem Building Panel
E. Dinu (Moderator), J.E. Odegard, J. Jones, B. Solomon, P. Datta, Numinous Capital, 62x Ventures, North Carolina State University, FedTech, Evonik, US
11:30Bio In Space Symposium
Session chair: Jonathan Jakischa, TechConnect Division, ATI
11:30TechConnect Innovation Spotlights: Biotech & Medical II
Review Panelist
K. Covey, First Flight Venture Center, US
Review Panelist
T. Willis, Med1 Ventures, US
Review Panelist
C. Stebbins, ATI, US
Review Panelist
T. Martin, New Ventures and Investments, North Carolina State University, US
Review Panelist
L. Foster, Z-Field Technologies, US
An efficient monitoring tool for chronic wounds and pressure ulcers
V.D. Vincely, LumaWave Inc., US
RealNose: AI-Powered Bioelectronic Scent Detection Platform
N. Stefanou, RealNose Inc, US
Smart Pneumatic Tourniquet for Field Hemorrhage Control
R. Hogan, Pressure Medical, US
DEVA- Decellularized Engineered Vascularized Allograft
G. Singh, Stony Brook University, US
Long-lasting, reversible on demand, non-hormonal male contraceptive
D. Walley, NEXT Life Sciences, Inc., US
IV cNP8 (Phase 2 Clinical Trial)
M. Musillo, Neomatrix Therapeutics, US
Direct de novo sequencing of therapeutic RNA and impurities via next-generation mass spectrometry
S. Zhang, DirectSeq Biosciences, Inc., US
11:30TechConnect Innovation Spotlights: Space, Defense, and Mobility
Session chair: Jennifer Rocha, TechConnect Division, ATI
Review Panelist
R. Julian, HOKA Ventures, US
Review Panelist
C. Owens, Lockheed Martin, US
Review Panelist
S. Scharf (invited), BAE Systems, US
Review Panelist
S. Obare, Research and Engagement, University of North Carolina at Greensboro, US
Optical Gas Detection Insight for Hydrogen and Beyond
K. Andersen, Brint Tech Corp, US
Space Accountability and Reporting Console (SPARC)
J. Brock, Web Sensing LLC, US
Next generation intelligent vision super-powering satellites and machines
J. Galatsanos, Diffraqtion, US
In-situ recovery of rare earth elements from volcanic rocks
M. Sumi, Ascension Earth Resources Ltd, UK
ArcSynerCom™: UAV and Autonomous System Communication Device
S. Arzo, AgileRadioCom LLC, US
HiveLink UAVs
V.V. Muvva, University of Nebraska - Lincoln, US
11:30SBIR Session II
1:00TechConnect World Expo and SBIR/STTR Pavilion Open
1:30TechConnect Innovation Spotlights: AI and Digital Transformation I
Session chair: Sonia Vohnout, OppsSpot
Review Panelist
M. Hetrick, ABB, US
Review Panelist
L. Foster, Z-Field Technologies, US
Review Panelist
A. Phillips, Wolfpack Investor Network (WIN), North Carolina State University, US
Review Panelist
C. Sahu, ABB, US
Lastwall Zero Trust Identity for Multi-Domain Operations
S. Moorhead, Lastwall, US
Efficient In-Sensor and Multimodal Signal Processing using Hyperdimensional Computing Algorithms Implemented on an FPGA
V. Ehsan, Arch Systems, LLC, US
Belvedere
B. Frutchey, Clear Fracture LLC, US
FraudSphere: Dependent Multi-Agent Generative Adversarial Framework for Adaptive and Explainable Fraud Detection
T. Ekin, Texas State University, US
SMART Adaptive Twins
R. Jha, SimInsights Inc., US
A Quantum Security Remediation Platform
R. Parizi, Quturn, US
1:30TechConnect Innovation Spotlights: Energy and Sustainability I
Session chair: Emma Mooney, TechConnect Division, ATI
Review Panelist
J. Caley, U.S. Navy Operational Energy, US
Review Panelist
L. Wilhelm, U.S. Navy Operational Energy, US
Review Panelist
TBA, NSWC Crane, US
Review Panelist
E. Armstrong, Naval Operational Energy Office, US
"Plug-N-Forget" AI-powered Intelligent Miniature Sensor (AIMS) for Continuous in situ Wastewater Monitoring
B. Li, We-Sensing LLC, US
Transformative Energy Materials: Tunable Architectures for Scalable Storage and Hydrogen Futures
J. Liu, Nanoinnovation North American, LLC, Texas A&M University-Kingsville, US
Gateway System for Non-Penetrating Data & Power Transfer through Solid Barriers
D. Messenger, SDI Engineering Inc./Rho-C Limited, US
Carbon Dioxide Reduction Through Electrolysis for Green Chemistry
M. Rizkallah, Cincy Carbon, US
AquaSplash-Fast-Acting Nanotech Water Purification
S. Mandal, Texas State University, US
PFAS AI
J. Yu, EcoPulse, Inc., US
1:30SBIR Session III
1:30Bio In Space Innovation Challenge
Session chair: Laura Murphree, TechConnect Division, ATI
1:30Revolutionary Fibers and Textiles Innovation Challenge
Session chair: Jonathan Jakischa, TechConnect Division, ATI
2:30TechConnect Innovation Spotlights: AI and Digital Transformation I
Session chair: Sonia Vohnout, OppsSpot
Review Panelist
M. Hetrick, ABB, US
Review Panelist
S. Vohnout, OppsSpot, US
Review Panelist
M. McKee, New Ventures and Partnerships, University of North Carolina, US
Review Panelist
L. Foster, Z-Field Technologies, US
Photonic Chiplets for AI DataCenter Interconnects
M. Shahine, Wiconnect Global Corp, US
VerifAI: Quality Inspector’s AI Companion
L. Bhat, iZen ai, Inc., US
AI-driven vision system for safety monitoring of human-robot collaboration
T. Yahia, Center for Intelligent Metrology & Sensing, US
A Facility Management Digital Twin Software Platform
K. Mobasher, Power Theory INC., US
Voice-based Impairment Management
R. Seiilova-Olson, Tenvos Inc., US
IDCommand Tactical: ZTA-Compliant, PQC-Secured, Local Authentication Capabilities from the Enterprise to the Disconnected Edge
S. Moorhead, Lastwall, US
Sotaog
S. Tamilarasan, Sotaog, US
2:30TechConnect Innovation Spotlights: Energy and Sustainability II
Session chair: Emma Mooney, TechConnect Division, ATI
Review Panelist
J. Caley, U.S. Navy Operational Energy, US
Review Panelist
L. Wilhelm, U.S. Navy Operational Energy, US
Review Panelist
TBA, NSWC Crane, US
Review Panelist
E. Armstrong, Naval Operational Energy Office, US
Engineered amorphous aerogel catalysts for supercharged electrochemical processes
A. Kent, M1 Catalysts, Inc., US
Direct Salt-to-Anode Manufacturing for Fully Domestic High-Energy Lithium Metal Batteries
S. Esarey, Alpha-En Corporation, US
A next-generation solid-state hydrogen cell that protects itself from steam corrosion
L. Xingbo, West Virginia University, US
Chargeable Hybrid Flexible Ballistic Protection Battery Systems for Individual Warrior Power Consolidation
A. Kuntz, Salubrium Aegis, US
Organic SolidFlow battery
G. Damato, CMBlu Energy, Inc., US
A High Performance membrane electrolyte for Solid State Lithium-ion Batteries
H. Rathnayake, BRIGHT Institute, US
2:30SBIR Session IV
3:30Manufacturing USA Institutes: A Funding and Partner Catalyst for Fostering Innovation Coast to Coast
4:00Bio In Space Innovation Challenge-Winners Announced
Session chair: Laura Murphree, TechConnect Division, ATI
4:00TechConnect World Expo, Technical Poster Session I, and Expo Social (4:00 - 6:00)
4:00SBIR/STTR Pavilion Reception

Wednesday March 11

8:30TechConnect World Innovation Conference - Business Keynotes
Session chair: Jennifer Rocha, TechConnect Division, ATI, US
National Safety Council (NSC), US
DOE EPIC Prize Challenge, US
LEAN Power, US
9:30LEAN Power and EMC2 Industry Day
Operational Energy, Deputy Assistant Secretary of the Navy, Energy, US
Naval Surface Warfare Center - Crane Division, US
ATI, US
9:30DOE EPIC Prize Challenge Pitch Competition
9:30National Safety Council (NSC) Session (invited)
9:30SBIR Session V
10:30Bio In Space Symposium
Session chair: Jonathan Jakischa, TechConnect Division, ATI
10:30SBIR Session VI
10:30TechConnect Innovation Spotlight
10:30DARPA Session (invited)
11:30SBIR Session VII
11:30TechConnect Business Session TBA
12:15Lunch BreakOn own
1:00TechConnect World Expo and SBIR/STTR Pavilion Open
1:30U.S. National Strategic Plan for Advanced Manufacturing Town Hall
1:30TechConnect Innovation Spotlights: Electronics and Microsystems
Session chair: Jaipreet Bindra, University of Ottawa
Review Panelist
A. Phillips, Wolfpack Investor Network (WIN), North Carolina State University, US
Review Panelist
S. Vohnout, OppsSpot, US
Review Panelist
J. Bindra, University of Ottawa, CA
Review Panelist
S. Scharf (invited), BAE Systems, US
Integrating Edge AI on Embedded Devices at Scale
D. Meer, Atym Inc., US
Gallium Oxide for High Voltage Power Electronics
H. Splawn, Kyma Technologies, Inc., US
TREBUCHET: A Fully Homomorphic Encryption (FHE) Accelerator for Deep Computation
M. French, USC, Information Sciences Institute, US
Holographic Volumetric Lithography
L. Connolly, Texas Microsintering, US
Metasurface Sensors for Enhancing UAV Autonomy and Capabilities
D. Smith, Metacept, Inc., US
DiaDEM: A Digital Discovery Platform for Organic Electronic Materials
O. Omar, Apoello Limited, UK
1:30TechConnect Innovation Spotlights: Advanced Materials
Session chair: Bart Romanowicz, TechConnect Division, ATI
Review Panelist
S. Obare, Research and Engagement, University of North Carolina at Greensboro, US
Review Panelist
B. Romanowicz, TechConnetc Division, ATI, US
Review Panelist
J. Bindra, University of Ottawa, CA
Review Panelist
G. Garland, Office of the Vice Chancellor of Research Development, North Carolina State University, US
Review Panelist
P. Fisher, Greenville ENC Alliance, US
MetaXLab - Integrated Design-to-Manufacturing Platform (SaaS)
L. Mirmomen, 360 Degree Engineering LLC (DBA:Optimuos), US
BactiBlank (Anti‑adhesive, antibiotic‑free shield)
P. Nallathamby, Berthiaume Institute for Precision Health at the Unviersity of Notre Dame, US
Biobased Two Part Adhesive-Metal to Metal, Glass to Glass, Wood to Wood, and Any Combination of Surfaces
M. McConnaughey, BioBond Adhesives, Inc., US
Direct writing solution for semiconductor fabrication
R. Beaudry, Digitho Technologies inc., CA
Submerged Cure, Composite Patch for Hull Restoration
E. Andrew, Materials Sciences, US
Transforming Agricultural Waste into High-Performance, Biodegradable, and PFAS-Free Advanced Materials
R. Saremi, Ecoatex, US
1:30SBIR Session VIII
1:30LEAN Power and EMC2 Member Only Meeting
Operational Energy, Deputy Assistant Secretary of the Navy, Energy, US
Naval Surface Warfare Center - Crane Division, US
ATI, US
2:30Future‑Ready by Design: How the FBI Builds Continuous Innovation
2:30TechConnect Innovation Spotlights: Advanced Materials and Manufacturing
Review Panelist
P. Fisher, Greenville ENC Alliance, US
Review Panelist
E. Runge, Launch Chapel Hill, US
Review Panelist
J. Hardin, North Carolina Department of Commerce, US
Review Panelist
G. Garland, Office of the Vice Chancellor of Research Development, North Carolina State University, US
Review Panelist
C. Sahu, ABB, US
Shipboard Modular Testing System (SMTS)
N. Rudenko, Materials Sciences, US
Nanocoining for highly scalable nanopatterning
S. Furst, Smart Material Solutions, LLC, US
Infiltration-Free ceramic matrix composite
J. Wei, SRI International, US
Advanced Electromagnetic Wave Absorption (EWA) Materials for Stealth and Defense Technology
H.M. Duong, Mekong University, SG
Rapid Expeditionary Biomineralization for Enhanced Land Stabilization (REBELS)
H. Binde, BioSqueeze Inc., US
Adaptive “Chameleon” Coatings to Enable Multi-Environment Space-Ambient Functionality
D. Berman, University of North Texas, US
2:30SBIR Session IX
3:30DOE EPIC Prize Challenge Winner Announcement
4:00TechConnect World Expo, Technical Poster Session II, and Expo Social (4:00 - 6:00)
4:00SBIR/STTR Pavilion Reception

Thursday March 12

8:30SBIR/STTR Innovator Training Workshop 8:30am-4:30pm (Additional Registration Required)
9:00TechConnect Innovation Spotlights: Advanced Materials, AI, Biotech, and Defense
Session chair: Jonathan Jakischa, TechConnect Division, ATI
Review Panelist
E. Runge, Launch Chapel Hill, US
Review Panelist
J. Hardin, North Carolina Department of Commerce, US
Review Panelist
J. Bindra, University of Ottawa, CA
Review Panelist
S. Vohnout, OppsSpot, US
Durable, Non-Wetting Surface Solutions
K. Nithyanandam, Impact Innovations LLC, US
Plasmonic Cooling for Spacecraft Components Through Ultrafast Laser Surface Structuring
K. Campbell, Quantum Qool, US
The Vision-to-Motion (V2M) Engine
A. Sharotry, Texas State University, US
Fungal Sphaeropsidin A for Refractory Cancer
A. Kornienko, Texas State University, US
Rare-Earth-Free Magnets Via Field Assisted 3D Printing
P. Karkhanis, Texas State University-San Marcos, US
9:00Pathfinder Workforce Development Program, Supporting Emerging Technology Manufacturing Workforce and Development
Session chair: Jared Ashcroft, Pasadena City College
Digital Twin and AI (DTAI) Based Training Content Capture, Creation, and Customization Skills Lab for All
A. Ahmadi, Mercer County Community College, US
10:00Pathfinder Workforce Development Program, Supporting Emerging Technology Manufacturing Workforce and Development
Session chair: Jared Ashcroft, Pasadena City College
VR/AR Session for Semiconductor Manufacturing Educational Tools
12:00Lunch BreakOn own
1:15Critical Materials - Workshop (open to all conference attendees)
Session chair: Santa Jansone Popova, Oak Ridge National Laboratory
Rare Earths and Permanent Magnets: TEA, Life Cycle, and Supply Chain
B.J. Smith, Argonne National Laboratory, US
From Mine to Concentrate: Extraction, Processing, and Separation
C. Anderson, Colorado School of Mines, US
Rare Earth Separation Technologies: History, Progress, and Current Practice
S. Jansone Popova, Oak Ridge National Laboratory, US
Turning Waste into Resource: Secondary and Unconventional Feedstocks
A. Fritz, National Energy Technology Laboratory, US
Permanent Magnets: From Fundamentals to Recycling
A. Palasyuk, Ames National Laboratory, US
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