Electronics & Microsystems

• Jeffrey Chalmers, The Ohio State University, US
• Alisa Morss Clyne, University of Maryland, US
• Ronald A. Coutu, Marquette University, US
• Lou Dadock, FUJIFILM Dimatix, Inc.
• Payel Das, IBM, US
• Ananth Dodabalapur, The University of Texas at Austin
• Tomasz Durakiewicz, US National Science Foundation
• Aaron D. Franklin, Duke University, US
• Susan Fullerton, University of Pittsburgh, US
• Sean Garner, Corning Inc.
• Christopher Harrison, Schlumberger, US
• Soojung Claire Hur, Johns Hopkins University, US
• Xiaoting Jia, Virginia Tech, US
• Mandakini Kanungo, Corning, Inc., US
• Ioannis (Yanni) Karampelas, FLOW-3D, US
• Thomas Li, NXP Semiconductor 
• Kai Liu, Georgetown University, US

• Anson W. K. Ma, University of Connecticut, US
• Chris Menzel, Fujifilm Dimatix, Inc., US
• Junhong Min, Chung-Ang University, S. Korea
• Tse Nga (Tina) Ng, UCSD, US
• Kwang W. Oh, University at Buffalo (SUNY), US
• Joe Pratt, Golden Gate Zero Emission Marine, US
• Matteo Rinaldi, Northeastern University, US
• Axel Scherer, Caltech, US 
• Lydia Sohn, University of California, Berkeley, US
• Edsger Smits, Holst Centre, Netherlands
• Sarah Tao, Sanofi, US
• Bob Westervelt, Harvard University, US
• William (Cy) Wilson, NASA, US
• William L. Wilson, Harvard University, US
• Yiliang Wu, TE Connectivity, US
• Amir Yacoby, Harvard University, US
• Brenton Young, AOSense, Inc., US