Advanced Materials for Engineering Applications

Symposium Co-Chairs

Jim Johnston
Professor, School of Chemical and Physical Sciences, Victoria University of Wellington, New Zealand

The TechConnect World Advanced Engineering Materials symposium will feature materials that are ready for commercial application. We will also spotlight new research and development: Innovative technologies, materials, and approaches that could provide game-changing increases in performance in engineering applications. Please submit an abstract and plan to join innovators from industry, academic and government laboratories around the world at this important event.

Back to Top ↑ 2021 Symposium Sessions
	Tuesday October 19
1:30	3D Printing
	Wednesday October 20
8:30	Advanced Manufacturing Track Keynote
1:30	Advanced Materials for Engineering Applications
4:00	Advanced Materials for Engineering Applications - Posters

2021 Symposium Program
	Tuesday October 19

1:30	3D Printing	Camellia 1
	Session chair: Nanci Hardwick, MELD. Manufacturing
1:30	Ask the Editor – a Q&A Session on Additive Manufacturing P. Zelinski, Additive Manufacturing, US
1:55	Multi- Material / Modality / Scale / Axis: Realizing Multi-Functional Products with Next-Generation Additive Manufacturing Processes C. Williams, Virginia Polytechnic Institute and State University, US
2:20	Hierarchical Deep Learning Neural Network (HiDeNN)-AI for process design and performance prediction of additive manufacturing systems W.K. Liu, Y. Lu, S. Saha, Z. Gan, X. Xie, H. Lin, J. Cao, Northwestern University, US
2:45	The Strength of 3D Printed Electronics K. Church, nScrypt Inc., US
3:10	Multi-Axis Additive Manufacturing for Topology and Toolpath Optimization of Composite Structures J.R. Kubalak, C.B. Williams, Virginia Tech DREAMS Lab, US
3:30	Bayesian Networks Connecting Processing and Product Features in Additive Manufacturing A. Malmberg, K. Chandra, A. Peterson, J. Mead, University of Massachusetts Lowell, US
3:50	AM-CFD: a well-validated thermal-fluid simulator for additive manufacturing part qualification Z. Gan, K.K. Jones, Y. Lu, X. Xie, S. Saha, S. Mojumder, W.K. Liu, Northwestern University, US
4:10	Considerations for making the world's largest metal printer N. Hardwick, MELD Manufacturing, US
	Wednesday October 20

8:30	Advanced Manufacturing Track Keynote	Baltimore 1
	Session chair: Joey Mead, University of Massachusetts
8:30	Reshaping Manufacturing in the Post-Pandemic Era: Where Additive Manufacturing Is Now P. Zelinski, Additive Manufacturing, US
9:00	NSF Advanced Manufacturing Program and Research Opportunities K. Cooper, National Science Foundation, US
9:30	Sustainable and Scalable Manufacturing of Microelectronics Using Directed Assembly of Nanomaterials A. Busnaina, Northeastern University, US

1:30	Advanced Materials for Engineering Applications	Azalea 3
	Session chair: Chris Menzel, Fujifilm Dimatix
1:30	Rapid setting, long pot life epoxy concrete for early high strength applications T. Farnsworth, Luna Innovations, Inc., US
1:50	A breakthrough in High Temperature Superconductors, pp. 75-77 W. Lau, LAU Superconductors Inc., US
2:10	Electrospun Nanofiber Scaffolds for Anterior Cruciate Ligament Reconstruction: Effect of Draw Ratio on Enzymatic Degradation Rate D. Brennan, J. Posselt, C. Wagner, V. Beachley, Rowan University, US
2:30	Spectral Characterization of Tin Dioxide for Gas-Sensing Applications, pp. 69-70 H. Alghamdi, B. Concepcion, S. Baliga, P. Misra, Howard University, US
2:50	Precipitation-Strengthened and Microlayered Bulk Copper- and Molybdenum-Based Nanocrystalline Materials Produced by High-Speed Electron-Beam Evaporation–Condensation in Vacuum: Structure and Phase Composition, pp. 71-74 N.I. Grechanyuk, V.G. Grechanyuk, A. Manulyk, Synergy ANTECH Services Corp., CA
3:10	Novel Titania based composites for Solar Disinfection A. Safri, A. Fletcher, University of Strathclyde, UK

4:00	Advanced Materials for Engineering Applications - Posters	Expo Hall AB
	Conductive coatings eliminate static discharge risk on aircraft, pp. 81-84 G. Christensen, H. Hong, C. Bailey, Novum Nano, US
	Hydrogen bonding enhanced thermally conductive carbon nano grease for enhanced CPU performance, pp. 78-80 C. Bailey, G. Christensen, H. Hong, Novum Nano, US
	Sub-10 nm Anisotropic Copper Oxide Nanowires for Electrochemical Sensing G. Pathiraja, D. Herr, H. Rathnayake, University of North Carolina at Greensboro, US
	Modification of Ultrahigh Molecular Weight Polyethylene (UHMWPE) Ballistic Fibers for Enhanced Performance H. Mahfuz, V. Prado Correia, T. Irons, L. Carlsson, O. Masory, and T. Langston, Florida Atlantic University, US