Back to Top ↑2026 Symposium Sessions |
| Tuesday March 10 |
| Wednesday March 11 |
| 1:30 | Accelerating Wide Bandgap Innovation through the ME Commons CLAWS Hub: Technology, Transition, and Talent Development |
| 4:00 | Semiconductors - Posters |
| Thursday March 12 |
| 9:00 | Semiconductor Industry: Challenges and Opportunities |
|
2026 Symposium Program |
| Tuesday March 10 |
| Wednesday March 11 |
|
| 1:30 | Accelerating Wide Bandgap Innovation through the ME Commons CLAWS Hub: Technology, Transition, and Talent Development | Marriott State C |
| Session chair: Fred Kish, North Carolina State University |
| From Lab to Fab: An Overview of the ME Commons CLAWS Hub Mission and Ecosystem
F. Kish, North Carolina State University, US |
| Enabling Solid State Transformer with 3.3kv - 15kV SiC Devices
S. Bhattacharya, North Carolina State University, US |
| HVPE for High Voltage Power Electronics
H. Splawn, Kyma Technologies, US |
| The CLAWS Research Foundry: III-Nitride Wide-Bandgap RF and Power Electronics
P. Wellenius, CLAWS Hub - NC State University, US |
| Microelectronics Workforce Development: Challenges, Strategy and Programs Addressing Semiconductor Manufacturing
P. Strader, CLAWS Hub - NC State University, US |
|
| 4:00 | Semiconductors - Posters | Expo Hall AB |
| Improvement of memory window in tantalum oxide based ReRAM via optimization of device stack and operating conditions
J.J. Modasiya, R. Mathkari, K. Beckmann, N.C. Cady, University at Albany, US |
| Statistical Process Control and Measurement System Analysis in MEMS Thermal Actuator Fabrication Comparing Isotropic and Anisotropic Etching
T. Garcia, A. Dahl, T. Le, L. Majid, University of New Mexico, US |
| Xenon difluoride (XeF2) Etching of Silicon: Characterization and Optimization for MEMS Structure Release
T. Le, A. Dahal, T. Garcia, L. Majid, University of New Mexico, US |
| The Progress and Future of GaN Technology for the Automotive Power Electronics Market
J. Li, IDTechEx, UK |
| Optimization of KOH-Based Release Process for Silicon Nitride Bimorph Cantilevers
D. Amrit, L. Majid, T. Le, T. Garcia, University of New Mexico, US |
| Thursday March 12 |
|
| 9:00 | Semiconductor Industry: Challenges and Opportunities | Marriott State F |
| Session chair: Alex Norman, Princeton University |
| Materials on Demand: A Computational Framework for Accelerated ab initio Material and Device Simulation
D. Hill, Y. Gong, S. Rakheja, A. Tunga, A. Janotti, R. Hu, M. Grupen, SRI International, US |
| AYRSORB™ MOF-derived Gallium Oxides (Ga₂O₃) in 3D Heterogeneous Integration
R.O.K. Ozdemir, D. Young, C. Ybanez, framergy, Inc., US |
| Security Through Geometry
P. Bayley, K. Jackson, D. Henderson, R. Nuguru, Forward Edge-AI, Inc., US |
| Engineering Atomic-Ternary Semiconductors from TRL-3 Materials to TRL-4 Resilient Power Modules
S. Bashir, J.L. Liu, Texas A&M University-Kingsville, US |
| A Comparative Study of Isotropic (XeF₂) and Anisotropic (KOH) Etching Techniques for the Fabrication and Release of MEMS Thermal Actuators
T. Le, A. Dahal, T. Garcia, L. Majid, University of New Mexico, US |
| Thermal Characterization of Thin-Film Aluminum Oxynitride (AlON) Using a Dual-Loop Liquid Heat Exchange Method
B.J. Soller, M. Romero, J. Schmitt, D. Huitink, W. Vinson, M. Norris, T. Akintunde, Nitride Global, Inc., University of Arkansas, US |
| Scaling Novel Photonic Materials: Lessons from Barium Titanate for the Semiconductor Industry
A. Demkov, A. Posadas, La Luce Cristallina, Inc., US |
| Metrology-Integrated Microfabrication Course: Closing the Loop Between Process, Measurement and SPC for Workforce Readiness
M.W. Pleil, N. Jackson, University of New Mexico, US |
| Effective solutions for semiconductor technician education in the community college setting
T.J. Pennell, S. Georgiakaki, Tompkins Cortland Community College, US |
|
