Organics, Printed, and Flexible Electronics technologies will have a far reaching impact in a number of areas including flat-panel displays, OLEDs, sensors, batteries, biomedical devices, and distributed macroelectronic systems and architectures. Printed smart devices incorporating organic and printed circuits, sensors and energy sources will enable new approaches in logistics and consumer packaging. New flexible displays with exceptionally low energy consumption will be used anywhere and anytime.
The synergy between materials, device and manufacturing technologies will be the primary driver in pushing printed and flexible large-area electronics and optoelectronics into large-scale applications and will revolutionize the manufacturing process for electronic devices.
Back to Top ↑2021 Symposium Sessions |
| Monday October 18 |
| 10:30 | Printed & Flexible Electronics: Devices & Applications |
| 1:30 | Printed & Flexible Electronics: Materials & Processes |
| Tuesday October 19 |
| 1:30 | 3D Printing |
| Wednesday October 20 |
| 8:30 | Advanced Manufacturing Track Keynote |
| 1:30 | 3D Printing Design |
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2021 Symposium Program |
| Monday October 18 |
|
| 10:30 | Printed & Flexible Electronics: Devices & Applications | Woodrow Wilson C |
| Session chair: Mandakini Kanungo, Corning Inc. |
| 10:30 | Advances in Multi-Layer Conductive Ink-Jet Printing on Textiles
A. Mills, North Carolina State University, US |
| 10:55 | Multi segment TFT Compact Model for Prediction Advanced TFT Applications in 6G and 3D integration
M.S. Shur, X. Liu, T. Ytterdal, Rensselaer Polytechnic Institute, US |
| 11:20 | Dissolvable Tattoo Electronics for Biomedicine
H. Cheng, J. Meeks, Penn State University, US |
| 11:40 | Printable copper electronics for high-temperature
S. Ren, SUNY - Buffalo, US |
| 12:00 | Bridging the competence gap: Flexible Hybrid Electronics
M. Dyson, R. Collins, IDTechEx, UK |
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| 1:30 | Printed & Flexible Electronics: Materials & Processes | Woodrow Wilson C |
| Session chair: Mandakini Kanungo, Corning Inc. |
| 1:30 | Stretchable Dielectric Substrate Manufacturing for Printed Electronics
S. Deshmukh, E. Keaney, C. Barry, J. Mead, University of Massachusetts Lowell, US |
| 1:50 | Printed sensors for vital sign monitoring
E. Smits, Holst Centre, NL |
| 2:15 | Effect of different surface energy theories on substrates used in printed electronics
B.N. Altay, M. Sta, P.D. Fleming, N.R. Demarquette, S.G. Cloutier, Rochester Institute of Technology, US |
| 2:35 | Lightweight and flexible printed organic-inorganic hybrid thin film photovoltaics with large grains
R. Miller, University of Vermont, US |
| 3:05 | Phase-change photolithography: Rapid diffraction limited patterning of organic electronic materials
Z.I. Bedolla-Valdez, Z. Su, G. Gonal, T.L. Murrey, C.C. Cendra-Guinassi, A. Salleo, C. Grigoropoulos, A.J. Moulé, University of California Davis, US |
| Tuesday October 19 |
|
| 1:30 | 3D Printing | Camellia 1 |
| Session chair: Nanci Hardwick, MELD. Manufacturing |
| 1:30 | Ask the Editor – a Q&A Session on Additive Manufacturing
P. Zelinski, Additive Manufacturing, US |
| 1:55 | Multi- Material / Modality / Scale / Axis: Realizing Multi-Functional Products with Next-Generation Additive Manufacturing Processes
C. Williams, Virginia Polytechnic Institute and State University, US |
| 2:20 | Hierarchical Deep Learning Neural Network (HiDeNN)-AI for process design and performance prediction of additive manufacturing systems
W.K. Liu, Y. Lu, S. Saha, Z. Gan, X. Xie, H. Lin, J. Cao, Northwestern University, US |
| 2:45 | The Strength of 3D Printed Electronics
K. Church, nScrypt Inc., US |
| 3:10 | Multi-Axis Additive Manufacturing for Topology and Toolpath Optimization of Composite Structures
J.R. Kubalak, C.B. Williams, Virginia Tech DREAMS Lab, US |
| 3:30 | Bayesian Networks Connecting Processing and Product Features in Additive Manufacturing
A. Malmberg, K. Chandra, A. Peterson, J. Mead, University of Massachusetts Lowell, US |
| 3:50 | AM-CFD: a well-validated thermal-fluid simulator for additive manufacturing part qualification
Z. Gan, K.K. Jones, Y. Lu, X. Xie, S. Saha, S. Mojumder, W.K. Liu, Northwestern University, US |
| 4:10 | Considerations for making the world's largest metal printer
N. Hardwick, MELD Manufacturing, US |
| Wednesday October 20 |
|
| 8:30 | Advanced Manufacturing Track Keynote | Baltimore 1 |
| Session chair: Joey Mead, University of Massachusetts |
| 8:30 | Reshaping Manufacturing in the Post-Pandemic Era: Where Additive Manufacturing Is Now
P. Zelinski, Additive Manufacturing, US |
| 9:00 | NSF Advanced Manufacturing Program and Research Opportunities
K. Cooper, National Science Foundation, US |
| 9:30 | Sustainable and Scalable Manufacturing of Microelectronics Using Directed Assembly of Nanomaterials
A. Busnaina, Northeastern University, US |
|
| 1:30 | 3D Printing Design | Magnolia 3 |
| Session chair: Slade Gardner, Big Metal Additive & Nanci Hardwick, MELD Manufacturing |
| 1:30 | Full Scale DoD Metal Prototype Vehicles by Hybrid AM
S. Gardner, Big Metal Additive, US |
| 1:55 | Integrated process-structure-property modeling framework and methods for process design and performance prediction of additively manufactured material systems
W.K. Liu, Z. Gan, S. Saha, C. Yu, O.L. Kafka, K.K. Jones, Y. Lu, Northwestern University, US |
| 2:20 | Post-Process Superfinishing of Additively Manufactured Components for Next-Gen Space Application, pp. 27-30
N. Michaud, A. Diaz, REM Surface Engineering, US |
| 2:40 | Development of a Framework for Component Repair Using Additive Manufacturing
M. Walluk, A. Luccitti, B. Hilton, B. Baker, K. DePalma, K. Sisak, P. Martin, Rochester Institute of Technology, US |
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Printed sensors for vital sign monitoring
Multi segment TFT Compact Model for Prediction Advanced TFT Applications in 6G and 3D integration
